KR-102960798-B1 - Substrate processing device and substrate processing method

KR102960798B1KR 102960798 B1KR102960798 B1KR 102960798B1KR-102960798-B1

Abstract

A substrate processing device (1) comprises a substrate rotating part (20) that holds, supports, and rotates a substrate, an outer cup (51), an inner cup (52), an annular drain (64), and an exhaust passage (62). The outer cup (51) covers the area around the substrate held and supported by the substrate rotating part (20) in an annular shape. The inner cup (52) is positioned inside the outer cup (51) and is positioned below the substrate held and supported by the substrate rotating part (20). The annular drain (64) is formed between the outer cup (51) and the inner cup (52) to discharge the processing liquid supplied to the substrate to the outside. The exhaust passage (62) is formed inside the inner cup (52). The inner cup (52) has an exhaust hole (61) that connects the liquid receiving space (60) formed by the inner cup (52) and the outer cup (51) with the exhaust passage (62). The exhaust hole (61) is formed obliquely downward from the outer surface (52c) of the inner cup (52) to the inner surface (52d).

Inventors

아이우라, 가즈히로
아마노, 요시후미

Assignees

도쿄엘렉트론가부시키가이샤

Dates

Publication Date: 20260507
Application Date: 20220930
Priority Date: 20211104

Claims (14)

A substrate rotation unit that holds, supports, and rotates the substrate, and An outer cup that covers the circumference of the substrate, which is held and supported by the substrate rotating part, and An inner cup disposed on the lower side of the substrate that is held and supported by the substrate rotating part, together with being disposed on the inner side of the outer cup, and A circular drain formed between the outer cup and the inner cup to discharge the processing liquid supplied to the substrate to the outside, and An exhaust passage formed on the inner side of the inner cup. Includes, The inner cup has an exhaust hole connecting the liquid receiving space formed by the inner cup and the outer cup and the exhaust passage. The exhaust hole is formed obliquely downward from the outer surface to the inner surface of the inner cup. Substrate processing device.
In claim 1, the inner cup has an inclined portion that gradually slopes downward toward the outside, and a vertical portion that extends vertically from the outer circumference end of the inclined portion toward the annular drain. The above exhaust hole is a substrate processing device disposed in the above vertical section.
In paragraph 2, the outer cup comprises an upper annular member whose inner surface is inclined along the inclined portion of the inner cup, and A substrate processing device having, when viewed in a planar view, an inner surface of the upper annular member having a hydrophilic surface having a width of less than that at the inner circumference end and a hydrophilic surface located outside the hydrophilic surface.
In any one of claims 1 to 3, further comprising a processing liquid nozzle that is movable in a horizontal direction and supplies a processing liquid to the substrate held and supported by the substrate rotating part, The outer cup has an opening formed to enable the processing liquid nozzle to move between a processing position above the periphery of the substrate and a waiting position outside the processing position. A substrate processing device comprising a processing liquid nozzle, the above-mentioned covering that blocks at least a portion of the opening.
In paragraph 4, the above cover has a side wall portion and an upper wall portion, The above side wall is positioned close to the side of the processing liquid nozzle, and The above upper wall portion is a substrate processing device positioned above the processing liquid nozzle.
A substrate processing device according to claim 5, wherein the side wall portion is positioned outside the processing liquid nozzle when viewed from the center of the substrate rotating portion, and blocks at least a portion of the opening when the processing liquid nozzle is in the processing position.
A substrate processing device according to claim 5, wherein the side wall portion is positioned inside the processing liquid nozzle when viewed from the center of the substrate rotating portion, and blocks at least a portion of the opening when the processing liquid nozzle is in the standby position.
A substrate processing device according to any one of claims 1 to 3, wherein the inner surface of the outer cup has a horizontal portion extending horizontally outward from the point closest to the substrate.
In any one of claims 1 to 3, the cleaning solution nozzle for supplying cleaning solution to the annular drain is further included, The above-mentioned annular drain is a substrate processing device having a drain port on the bottom surface at a position opposite to the location where the cleaning liquid nozzle is provided.
In claim 9, the above-mentioned annular drain is a substrate processing device having a slope at which the drainage port is lowest.
In claim 9, a processing liquid nozzle capable of moving in a horizontal direction and supplying a processing liquid to the substrate held and supported by the substrate rotating part, and It further includes a control unit that controls the processing liquid nozzle and the cleaning liquid nozzle, and The above control unit is, A substrate processing device that supplies a cleaning solution from the cleaning solution nozzle to the annular drain after processing the previous substrate with a processing solution and before processing the next substrate with a processing solution.
In claim 9, a processing liquid nozzle capable of moving in a horizontal direction and supplying a processing liquid to the substrate held and supported by the substrate rotating part, and It further includes a control unit that controls the processing liquid nozzle and the cleaning liquid nozzle, and The above control unit is, A substrate processing device that supplies a cleaning solution from a cleaning solution nozzle to an annular drain at the same timing as the process of supplying a rinse solution to the substrate from a nozzle.
A substrate processing device comprising: a substrate rotating part that holds, supports, and rotates a substrate; an outer cup that covers the periphery of the substrate held, supported by the substrate rotating part in an annular shape; an inner cup disposed inside the outer cup and disposed below the substrate held, supported by the substrate rotating part; an annular drain formed between the outer cup and the inner cup to discharge a processing liquid supplied to the substrate to the outside; an exhaust passage formed inside the inner cup; and a cleaning liquid nozzle that supplies a cleaning liquid to the annular drain, wherein the inner cup has an exhaust hole communicating between the liquid receiving space formed by the inner cup and the outer cup and the exhaust passage, and the exhaust hole is formed obliquely downward from the outer surface to the inner surface of the inner cup. A process comprising supplying a cleaning solution from the cleaning solution nozzle to the annular drain after treating the preceding substrate with a processing solution and before treating the next substrate with a processing solution, Substrate processing method.
A substrate processing device comprising: a substrate rotating part that holds, supports, and rotates a substrate; an outer cup that covers the periphery of the substrate held, supported by the substrate rotating part in an annular shape; an inner cup disposed inside the outer cup and disposed below the substrate held, supported by the substrate rotating part; an annular drain formed between the outer cup and the inner cup to discharge a processing liquid supplied to the substrate to the outside; an exhaust passage formed inside the inner cup; and a cleaning liquid nozzle that supplies a cleaning liquid to the annular drain, wherein the inner cup has an exhaust hole communicating between the liquid receiving space formed by the inner cup and the outer cup and the exhaust passage, and the exhaust hole is formed obliquely downward from the outer surface to the inner surface of the inner cup. A process comprising supplying a cleaning solution from the cleaning solution nozzle to the annular drain at the same timing as the process of supplying a rinse solution to the substrate from the nozzle, Substrate processing method.

Description

Substrate processing device and substrate processing method An embodiment of the disclosure relates to a substrate processing apparatus and a substrate processing method. Conventionally, a technique for etching the periphery of a substrate, such as a semiconductor wafer (hereinafter also referred to as a wafer), with a processing solution is known (see Patent Document 1). FIG. 1 is a schematic diagram illustrating the configuration of a substrate processing apparatus according to an embodiment. FIG. 2 is a schematic diagram illustrating the configuration of a substrate processing device according to an embodiment. FIG. 3 is a cross-sectional view illustrating the configuration of the recovery unit according to an embodiment. FIG. 4 is a perspective view illustrating the configuration of a second member regarding an embodiment. FIG. 5 is a perspective view illustrating the configuration of a first member regarding an embodiment. FIG. 6 is a cross-sectional view illustrating the configuration of an annular drain according to an embodiment. FIG. 7 is a plan view illustrating the configuration of an annular drain according to an embodiment. FIG. 8 is a timing chart showing an example of a cleaning treatment of an annular drain according to an embodiment. FIG. 9 is a timing chart showing another example of the cleaning treatment of an annular drain according to an embodiment. FIG. 10 is a perspective view illustrating the configuration of an exhaust duct according to an embodiment. FIG. 11 is a cross-sectional view illustrating the configuration of an upper annular member according to a modified example 1 of an embodiment. FIG. 12 is a cross-sectional view illustrating the configuration of an upper annular member according to a modified example 2 of an embodiment. FIG. 13 is a cross-sectional view illustrating the configuration of an upper annular member according to modified example 3 of an embodiment. FIG. 14 is a cross-sectional view illustrating the configuration of a recovery unit according to Example 4 of an embodiment. FIG. 15 is a cross-sectional view illustrating the configuration of a recovery unit according to modified example 5 of an embodiment. FIG. 16 is a cross-sectional view illustrating the configuration of a recovery unit according to a modified example 6 of an embodiment. FIG. 17 is a cross-sectional view illustrating the configuration of a recovery unit according to modified example 7 of an embodiment. FIG. 18 is a cross-sectional view illustrating the configuration of a recovery unit according to modified example 8 of an embodiment. FIG. 19 is a perspective view illustrating the configuration of a cover according to a modified example 8 of an embodiment. FIG. 20 is another perspective view illustrating the configuration of a cover according to a modified example 8 of the embodiment. FIG. 21 is a perspective view illustrating the configuration of a cover according to a modified example 9 of an embodiment. FIG. 22 is another perspective view illustrating the configuration of a cover according to a modified example 9 of the embodiment. FIG. 23 is a perspective view illustrating the configuration of a cover according to a modified example 10 of an embodiment. FIG. 24 is another perspective view illustrating the configuration of a cover according to a modified example 10 of the embodiment. FIG. 25 is a perspective view illustrating the configuration of a cover according to a modified example 11 of an embodiment. FIG. 26 is another perspective view illustrating the configuration of a cover according to a modified example 11 of an embodiment. FIG. 27 is a perspective view illustrating the configuration of a cover according to a modified example 12 of an embodiment. Hereinafter, embodiments of the substrate processing apparatus and substrate processing method disclosed herein will be described in detail with reference to the attached drawings. Furthermore, the present disclosure is not limited by each embodiment shown below. Additionally, it should be noted that the drawings are schematic and that the dimensional relationships of each element and the ratios of each element may differ from reality. Furthermore, there may be parts in which the dimensional relationships or ratios differ from one another among the drawings. In addition, in each of the following embodiments, the same reference numerals are assigned to identical parts, and redundant descriptions are omitted. Furthermore, in each of the drawings referenced below, mutually orthogonal X-axis, Y-axis, and Z-axis directions may be defined to facilitate understanding, and an orthogonal coordinate system may be shown with the Z-axis direction being the vertically upward direction. Conventionally, a technique for etching the periphery of a substrate, such as a semiconductor wafer (hereinafter also referred to as a wafer), with a processing solution is known. In this etching process of the periphery, by rotating the substrate at high speed, the sw