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KR-102960854-B1 - LED Module with Improved Optical and Electrical Characteristics and Quick-Assembly Lighting Fixture Incorporating the Same

KR102960854B1KR 102960854 B1KR102960854 B1KR 102960854B1KR-102960854-B1

Abstract

The present invention relates to an LED module that efficiently dissipates LED driving heat, improves the light output performance of indoor lighting by increasing effective luminous flux, and prevents degradation of the electrical characteristics of the LED module by suppressing or blocking electromagnetic interference (EMI) noise, as well as facilitating assembly and replacement workability, and to a multi-functional LED lighting fixture applying the same. The present invention, for achieving the above objective, comprises an LED lighting fixture formed by organically linking a metallic fixture body, an LED module including an insulating substrate (PCB) on which an LED chip is mounted, and a power supply unit, wherein a light-focusing heat dissipation reinforcing substrate is stacked and disposed on the upper surface of the insulating substrate, and a noise dispersion grounding board is electrically connected on the insulating substrate. By integrally implementing improvements in light performance, heat dissipation performance, electrical and electronic stability, and assembly without separate additional parts within a modular type noise dispersion grounding board and a stacked double-layer substrate structure, the invention provides a composite effect that simultaneously improves the performance, reliability, and productivity of the LED module and the LED lighting fixture to which it is applied.

Inventors

  • 전창호
  • 김선보

Assignees

  • 우성이엔에스 주식회사

Dates

Publication Date
20260507
Application Date
20260323

Claims (20)

  1. An LED module (200) comprising an insulating substrate (210) on which an LED chip (211) is mounted, wherein a plurality of grounding points (212) are formed on the insulating substrate, a noise dispersion grounding board (230) is connected to the grounding points, and (+)(-) connection terminals electrically connected to the LED chip are formed on the back surface of the insulating substrate (210), and a connector (216) is connected to the connection terminals.
  2. In Article 1, The LED module (200) is installed in a lighting fixture including a fixture body (100) and a power supply unit (110), and the noise dispersion grounding board (230) is connected to a grounding point (212) and simultaneously electrically connected to the fixture body (100) so that electromagnetic noise generated by switching operation is dispersed or dissipated through multiple low-impedance return paths.
  3. In Article 1, An LED module characterized in that a grounding point (212) is formed on a grounding circuit pattern patterned on an insulating substrate (210) and includes a through hole (213) into which an external metallic fastener is inserted, an exposed conductive portion (214) for electrically connecting to the metallic fastener is formed on the periphery of the through hole, and a connection connector (215) for electrically connecting to a noise dispersion grounding board (230) is further formed on the grounding circuit pattern.
  4. In Article 1, The LED module is characterized in that the above grounding points (212) are formed in two or more locations depending on the size, power consumption, or electromagnetic requirements of the insulating substrate (210), and are distributed in the edge area, central area, or a combination of these areas of the insulating substrate.
  5. In Paragraph 3, An LED module characterized in that the noise dispersion grounding board (230) is configured to include a board (231) comprising a noise filter circuit combined with an inductor and a capacitor, and further includes a connector part (232) that is optionally detachably attached to a connection connector (215).
  6. In Article 1, An LED module characterized in that the connector (216) connected to the (+)(-) connection terminal is formed to protrude vertically from the back surface of the insulating substrate (210).
  7. In an LED module (200) comprising an insulating substrate (210) on which a plurality of LED chips (211) are mounted, a light-focusing heat dissipation reinforcing substrate (220) stacked on top of the insulating substrate, and a noise dispersion grounding board (230) electrically connected to the insulating substrate, A plurality of grounding points (212) are formed on the insulating substrate (210), and a noise dispersion grounding board (230) is electrically connected to the grounding points. On the back surface of the insulating substrate (210), a (+)(-) connection terminal is formed that is electrically connected to an LED chip (211), and a connector (216) connected to an external power source is connected to the connection terminal. The light-focusing heat dissipation reinforcing substrate (220) is provided with a plurality of light-focusing guide holes (221) formed in a number corresponding to the LED chip (211), and the light-focusing guide holes are formed in a through-shape and positioned close to the outer surface of the corresponding LED chip (211) to limit the diffusion of lateral light, and the light-focusing heat dissipation reinforcing substrate (220) is characterized by pressing and supporting the insulating substrate (210) from above so that it adheres to the object to be installed.
  8. In Article 7, An LED module characterized by comprising a grounding point (212) formed on a grounding circuit pattern patterned on an insulating substrate (210), including a through hole (213) into which an external metallic fastener is inserted, an exposed conductive portion (214) formed on the periphery of the through hole for electrically connecting with the metallic fastener, a connection connector (215) further formed on the grounding circuit pattern for electrically connecting with a noise dispersion grounding board (230), and an elongated hole (222) in which the noise dispersion grounding board (230) can be inserted and inserted into the light-focusing heat dissipation reinforcing substrate (220).
  9. In Article 7, An LED module characterized in that the light focusing guide hole (221) is formed as a circular through hole, and the thickness of the light focusing heat dissipation reinforcing substrate (220) is formed to be greater than the mounting height of the LED chip so that the upper surface of the LED chip (211) does not protrude above the upper surface of the light focusing guide hole (221).
  10. In Article 9, An LED module characterized in that the thickness of the light-focusing heat dissipation reinforcing substrate (220) is formed to be in the range of 115% to 130% of the mounting height of the LED chip (211).
  11. In Article 9, An LED module characterized in that the mounting height of the LED chip (211) is 0.6 mm to 1 mm, and the thickness of the light-focusing heat dissipation reinforcing substrate (220) is formed in the range of 0.8 mm to 1.25 mm.
  12. In Article 7, An LED module characterized by the inner surface of the light focusing guide hole (221) being formed in one of the following shapes: a vertical through hole shape with no change in diameter, an upwardly expanding tapered hole shape with an increasing diameter towards the top, or an inverse tapered hole shape with an increasing diameter towards the bottom.
  13. In Article 7, The LED module (200) is installed in an indoor or outdoor lighting fixture comprising a metallic fixture body (100) and a power supply unit (110), and is characterized in that fastening holes (217) (223) are formed in the insulating substrate (210) and the light-focusing heat dissipation reinforcing substrate (220) so as to be aligned vertically and communicate with each other, and the substrates (210) (220) are fixed integrally in a close contact state with the fixture body (100) by means of a fastening member (400) penetrating the fastening holes.
  14. In an LED lighting fixture formed by organically linking a fixture body (100), an LED module (200) including an insulating substrate (210) on which an LED chip (211) is mounted, and a power supply unit (110), An LED lighting fixture characterized by having a plurality of grounding points (212) arranged on the insulating substrate (210), and a noise dispersion grounding board (230) connected to the grounding points and electrically connected to the main body of the fixture (100) so that electromagnetic noise generated by switching operation is dispersed and dissipated through a plurality of low-impedance return paths rather than a single grounding path.
  15. In Article 14, An LED lighting fixture characterized by grounding points (212) being formed in two or more dispersed locations depending on the size, power consumption, or electromagnetic requirements of the insulating substrate (210).
  16. In Article 14, An LED lighting fixture characterized by having a plurality of grounding points (212) distributed in the edge region, central region, or a combination thereof of an insulating substrate (210).
  17. In Article 14, An LED lighting fixture characterized by the grounding point (212) being formed on a patterned grounding circuit pattern of an insulating substrate (210), having a through hole (213) formed to allow an external metallic fastener to be inserted, having an exposed conductive part (214) formed along the perimeter of the surface of the through hole to be electrically connected to the metallic fastener, and further including a connection connector (215) for electrically connecting a noise dispersion grounding board (230) by fitting it into a grounding circuit pattern adjacent to the through hole.
  18. In Article 17, An LED lighting fixture characterized in that the noise dispersion grounding board (230) comprises a substrate (231) in which an inductor and a capacitor are combined to form a noise filter circuit, and further comprises a connector part (232) for electrically connecting by being selectively detachably attached to a connection connector (215) formed on one side of the substrate.
  19. In Article 17, An LED lighting fixture characterized by a metallic fastener inserted into a through hole (213) within a grounding point being connected and connected within the main body (100) in conjunction with contacting an exposed current-carrying part (214), so that a noise current induced from a noise-dispersing grounding board (230) is distributed and grounded toward the main body (100) via a grounding circuit pattern and a metallic fastener (240).
  20. In an LED lighting fixture formed by organically linking a fixture body (100), an LED module (200) including an insulating substrate (210) on which an LED chip (211) is mounted, and a power supply unit (110), An LED lighting fixture characterized by having a light-focusing heat dissipation reinforcing substrate (220) stacked on top of the insulating substrate and a noise dispersion grounding board (230) electrically connected on the insulating substrate (210).

Description

LED Module with Improved Optical and Electrical Characteristics and Quick-Assembly LED Lighting Fixture Incorporating the Same The present invention relates to an LED module that efficiently dissipates LED driving heat, improves the light output performance of indoor lighting by increasing effective luminous flux, and prevents degradation of the electrical characteristics of the LED module by suppressing or blocking electromagnetic interference (EMI) noise, as well as facilitating assembly and replacement workability, and to a multi-functional LED lighting fixture applying the same. Generally, an LED (Light Emitting Diode) chip is a semiconductor device that emits light when current is applied. It has a PN junction diode structure made of opto-semiconductor materials such as GaAs or GaN and converts electrical energy into light energy. Because these LEDs can be driven at low voltage and have excellent light efficiency, they are widely applied as a key component for constructing LED modules in various electrical and electronic devices, including lighting, displays, electronic billboards, and various home appliances. A well-known LED module is configured such that a plurality of LED chips are mounted on an insulating substrate (PCB) containing a patterned conductive circuit pattern, and an input terminal (+/- connection terminal) on one side of the insulating substrate is electrically connected to an output wiring (+/- wiring) of a power supply (converter), thereby causing the LED chips to emit light and illuminate the room when external power is applied. This LED module can be prepared in a single package form that corresponds 1:1 with the installation space of the lighting fixture, or it can be divided into two or more parts and spaced apart within the main body of the fixture depending on changes in characteristics such as the size or capacity of the lighting fixture. FIGS. 1 and 2 illustrate an example of a lighting fixture equipped with an LED module. A metal plate is bent and formed into a circular, square, or rectangular shape to form a fixture body (10). A single or multiple LED modules (20) are mounted and fixed inside the fixture body using a fixing means such as a bolt. A power supply unit (converter) (30) for supplying power to the LED modules and a light diffusion plate (40) for protecting the LED modules and dispersing light in a scanning direction are organically connected and installed outside the fixture body. In addition, an output wiring section (+/- wiring) (31) connected to an LED module (20) is provided at the output terminal of the power supply unit (converter). After being introduced into the wire hole (11) of the main body of the device, it is electrically connected to the (+)(-) connection terminal (23) of the LED module insulating board (PCB) (21) to supply power necessary for operation. Furthermore, if the LED module is divided and mounted in multiple units, a separate connecting wire can be additionally connected to the (+)(-) connection terminal formed on each LED module so that multiple LED modules can be connected in series. In the case of a conventional LED module with the above structure and a lighting fixture equipped with it, the output wiring (+/- wiring) (31) of the power supply unit must be inserted from the outside into the fixture body (10) and then individually connected to the insulating board connection terminals (+/-) (23), making assembly difficult and inconvenient. Furthermore, as the process of connecting adjacent LED modules through separate connecting wires is added, overall assembly efficiency is reduced, and the output wiring is extended, making the appearance cluttered and aesthetically unpleasing. Additionally, there is a problem of increased cost due to the increased wiring length. In addition, the output wiring (+/- wiring) (31) is continuously exposed to heat emitted from the LED module (20) as shown in FIG. 2, which may cause quality stability issues such as damage, degradation of electrical characteristics, or shortened lifespan, and may act as an interference factor for light output, resulting in shadowing or reduced light efficiency. In particular, when a converter fails, the replacement work is cumbersome and requires excessive time because the output wiring (+/- wiring) (31) must be separated from the insulating substrate connection terminal (+/-) (23) after the lighting fixture cover or light diffuser plate has been removed first, and then the converter must be disassembled. As a result, not only is post-maintenance, i.e., maintenance, reduced, but a structural defect occurs in which foreign matter, dust, or pests enter through the exposed wire hole (11) of the fixture body, causing the quality of the lighting fixture to deteriorate or become contaminated. In addition, there is a problem in that the spacing distance (L) between the divided insulating substrates (21) is relatively large, which reduces the mounting density of LED chips (22) relativ