KR-102961072-B1 - METHOD AND SYSTEM FOR PLATING TREATMENT, AND METHOD FOR DETERMINING PLATING TREATMENT CONDITION

Abstract

The present invention relates to a plating treatment method, and the plating method for a workpiece according to the present invention comprises the step of performing a first CVD (chemical vapor deposition) process according to a first process condition for cleaning the workpiece; the step of performing a second CVD process according to a second process condition for surface deposition of the workpiece; and the step of performing a third CVD process according to a third process condition for surface homogenization of the workpiece, wherein the first process condition includes a first voltage value applied for plasma generation, and the second process condition includes a second voltage value adjusted according to a predetermined ratio of the first voltage value.

Inventors

• 유승균
• 백숙은
• 유의정

Dates

Publication Date

20260507

Application Date

20191205

Claims (9)

1. A step of performing a first CVD (chemical vapor deposition) process according to first process conditions for cleaning the workpiece; A step of performing a second CVD process according to second process conditions for surface deposition of the above-mentioned workpiece; and The method includes the step of performing a third CVD process according to third process conditions for surface homogenization of the plated workpiece, and The above first process condition includes a first voltage value applied for plasma generation, and The above second process condition includes a second voltage value obtained by adjusting the first voltage value within the above first process condition by a ratio of 1/10, and The above third process condition includes a third voltage value set to differ from the second voltage value at a ratio smaller than the ratio of the voltage difference between the second voltage value and the first voltage value, wherein A plating method for a workpiece, characterized in that the above third process condition provides a gas excluding a component having a hydrophilic characteristic among the acrylic acid or acrylic anhydride gas injected according to the above second process condition.
2. In Article 1, A plating method for a workpiece, characterized by further including the step of performing plating on the workpiece surface-treated according to the third CVD process.
3. In Article 1, A plating method for a workpiece characterized by performing a process waiting process according to the first process parameter conditions before the second CVD process after the first CVD process and the second process parameter conditions before the third CVD process after the second CVD process.
4. delete
5. In Article 1, The above first process conditions are the first gas injected, The above second process conditions are the second gas injected and A plating method for a workpiece, characterized in that the above-mentioned third process conditions include third gas information to be injected.
6. In Article 1, A plating method for a workpiece, characterized by further including a step of determining the conditions of a third CVD process for homogenizing the charge amount of the above surface within a predetermined standard.
7. In Article 1, A step of receiving characteristic information of the above-mentioned workpiece; and, It further includes a step of receiving plating result information of the above-mentioned workpiece, and The first to third process conditions are determined by learning the correlation between the above feature information and the plating result information, and A plating method for a workpiece, characterized in that the above feature information includes at least one of the material information, structural information, and surface area information of the workpiece.
8. A step of performing a first CVD (chemical vapor deposition) process for cleaning a workpiece according to first process conditions including a first voltage value applied for plasma generation; A step of performing a second CVD process for surface deposition of the workpiece according to a second process condition including a second voltage value adjusted to a ratio of 1/10 of the first voltage value; A step of performing a third CVD process according to third process conditions for surface homogenization of the above-mentioned workpiece; and The method includes the step of performing plating on the surface-treated workpiece according to the above third CVD process, The above second process condition includes the second voltage value adjusted according to a predetermined ratio of the first voltage value, and The above third process condition includes a third voltage value set to differ from the second voltage value at a ratio smaller than the ratio of the voltage difference between the second voltage value and the first voltage value, wherein A plated product produced according to a plating method characterized in that the third process condition above provides a gas excluding a component containing a functional group having hydrophilic properties among the acrylic acid or acrylic anhydride gas injected according to the second process condition above.
9. A power supply unit that applies voltage for plasma generation; A CVD chamber that performs a first CVD (chemical vapor deposition) process for cleaning a workpiece according to a first process condition including a first voltage value, a second CVD process for surface deposition of the workpiece according to a second process condition including a second voltage value adjusted to a 1/10 ratio of the first voltage value, and a third CVD process according to a third process condition for surface homogenization of the workpiece; and A controller for determining the above first to third process conditions, comprising: The above third process condition includes a third voltage value set to differ from the second voltage value at a ratio smaller than the ratio of the voltage difference between the second voltage value and the first voltage value, and A surface treatment system for a plated object, characterized in that the above third process condition provides a gas excluding a component containing a functional group having hydrophilic properties among the acrylic acid or acrylic anhydride gas injected according to the above second process condition.

Description

Method and System for Plating Treatment, and Method for Determining Plating Treatment Conditions Based on Learning The present invention relates to a plating treatment method, and more specifically, to a plating method through surface treatment of a polymer material. Polymer materials have many advantages over metal materials, such as being inexpensive, lightweight, having excellent processability, and possessing superior corrosion resistance due to chemical stability, so they are widely used as substitutes for metals in recent years. Furthermore, recently, these polymer materials are being used as printing materials for 3D printers to manufacture articles of various shapes. By using 3D printers, the technical and cost problems associated with subtractive or injection molding processes for manufacturing complex composite shapes are overcome, and specific objects can be manufactured simply by printing them in three dimensions. However, due to the nature of the manufacturing method, objects produced by such 3D printers may show differences in impact resistance and tensile strength depending on the direction of layering, and have the disadvantage of being less durable against pressure or impact in a specific direction. In addition, due to the characteristics of polymer materials, their heat resistance is lower than that of general metal materials, so there are limitations to using directly printed objects in products applied in various industrial fields. Accordingly, methods for plating objects 3D printed with polymer materials are being devised, and manufacturing methods for products that combine the advantages of metals, such as hardness, strength, and electrical conductivity, with the advantages of polymer materials, such as lightweight, processability, and productivity, are being proposed. In the case of the prior patent (Publication No.: KR10-2018-0121150, Publication Date: 2018.11.07), a method is proposed to manufacture a 3D printed body with desired properties by enabling control of surface properties when manufacturing a 3D printed body using a photocurable composition, thereby increasing plating time and plating quality. However, this method involves changing the material being 3D printed itself, which limits its application to general 3D printers, and there is a problem with the actual plated surface being uneven, resulting in reduced marketability. Therefore, there is a need to devise a more universal processing method for plating articles manufactured by a general 3D printing method. FIG. 1 is a figure showing a plating treatment method according to one embodiment of the present invention. FIG. 2 is a figure showing a plating treatment method according to one embodiment of the present invention. FIG. 3 is a figure showing a plating treatment method according to one embodiment of the present invention. FIG. 4 is a diagram showing the configuration of a surface treatment system for performing a plating treatment method according to one embodiment of the present invention. FIG. 5 is a diagram illustrating the cross-sectional configuration of a plated material plated according to one embodiment of the present invention. The following description merely illustrates the principles of the invention. Therefore, those skilled in the art may invent various devices that embody the principles of the invention and are included within the concept and scope of the invention, even if they are not explicitly described or illustrated in this specification. Furthermore, all conditional terms and embodiments listed in this specification are, in principle, explicitly intended only for the purpose of enabling an understanding of the concept of the invention and should be understood as not being limited to the embodiments and conditions specifically listed elsewhere. The aforementioned objectives, features, and advantages will become clearer through the following detailed description in conjunction with the attached drawings, and accordingly, a person skilled in the art to which the invention pertains will be able to easily implement the technical concept of the invention. In addition, in describing the invention, if it is determined that a detailed description of known technology related to the invention may unnecessarily obscure the essence of the invention, such detailed description will be omitted. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. FIG. 1 is a flowchart illustrating a plating method according to one embodiment of the present invention. The plating method according to the present embodiment can be performed in a three-step process. In the plating method according to the present invention, the object may be composed of a polymer material. For example, the polymer material may be one or more mixtures selected from the group consisting of polyethylene, polypropylene, polystyrene, polycarbonate, acrylonitrile butadiene styrene