KR-102961130-B1 - DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME

Abstract

A display substrate comprising a display area and a non-display area according to one embodiment; a film substrate positioned to overlap at least partially with the non-display area of the display substrate and having a driving chip disposed thereon; a film layer positioned on one side of the display substrate; an adhesive layer positioned between the film layer and one side of the film substrate; and a resin layer covering the other side of the film substrate and a portion of the upper surface of the display substrate, wherein a portion of the resin layer and a portion of the film substrate are bent toward the side of the display substrate.

Inventors

• 이준영
• 송시준

Assignees

• 삼성디스플레이 주식회사

Dates

Publication Date

20260507

Application Date

20210820

Claims (20)

1. A display substrate including a display area and a non-display area; A film substrate positioned to overlap at least partially with the non-display area of the display substrate, on which a driving chip is disposed, and which contacts the upper surface of the display substrate; A film layer located on the entire surface of one side of the above-mentioned display substrate; An adhesive layer located between the above film layer and one surface of the above film substrate; and It includes a resin layer covering the other side of the film substrate and a portion of the upper surface of the display substrate, and A display device in which a portion of the resin layer and a portion of the film substrate are bent to the side of the display substrate.
2. In paragraph 1, An overcoat layer located on the upper surface of the display substrate and overlapping at least partially with the display substrate; and A display device further comprising a protective film located on the upper surface of the overcoat layer and overlapping at least partially with the overcoat layer.
3. In paragraph 2, A display device in which the resin layer covers the other side of the film substrate and a portion of the overcoat layer, and is positioned to be in contact with one side of the protective film.
4. In Paragraph 3, A display device in which the resin layer is positioned to fill the space between the overcoat layer and the film substrate.
5. In Paragraph 4, A display device in which the upper surface of the resin layer and the upper surface of the protective film are located on the same plane.
6. In paragraph 1, The above film layer is a display device in which polyethylene terephthalate.
7. In paragraph 1, The above adhesive layer is an optically transparent adhesive layer in a display device.
8. A step of preparing a display substrate and a film substrate that overlaps at least partially with the upper surface of a non-display area of the display substrate and contacts the upper surface, and attaching a guide film comprising a support layer, a film layer, and an adhesive layer sequentially laminated on a portion of the lower surface of the film substrate; A step of applying a resin layer on the upper surface of the film substrate and a portion of the upper surface of the display substrate; A step of removing the support layer, which is part of the guide film, so that the lower surface of the film substrate is not exposed from the lower surface of the film substrate; and A method for manufacturing a display device comprising the step of bending a portion of the resin layer, a portion of the guide film, and a portion of the film substrate to the side of the display substrate.
9. In paragraph 8, A method for manufacturing a display device in which the guide film is attached such that the upper surface of the adhesive layer is positioned on the lower surface of the film substrate.
10. delete
11. In Paragraph 9, A method for manufacturing a display device in which the above resin layer is applied by a slit nozzle method.
12. In Paragraph 11, A method for manufacturing a display device further comprising the step of removing a portion of the guide film and irradiating the upper surface of the resin layer with ultraviolet light.
13. In Paragraph 11, A method for manufacturing a display device further comprising the step of bending a portion of the guide film and a portion of the film substrate toward the side of the display substrate, and irradiating ultraviolet rays onto the upper surface of the resin layer.
14. A step of preparing a display substrate and a film substrate that overlaps at least partially with the upper surface of a non-display area of the display substrate and contacts the upper surface, and attaching a guide film comprising a support layer, a film layer, an ink layer, and an adhesive layer sequentially laminated on a portion of the lower surface of the film substrate; A step of applying a resin layer on the upper surface of the film substrate and a portion of the upper surface of the display substrate; A step of removing the support layer, which is part of the guide film, so that the lower surface of the film substrate is not exposed from the lower surface of the film substrate; and The method includes the step of bending a portion of the resin layer, a portion of the guide film, and a portion of the film substrate toward the side of the display substrate. The above guide film comprises a support layer, a film layer, an ink layer, and an adhesive layer sequentially laminated, and A method for manufacturing a display device in which the guide film is attached such that the upper surface of the adhesive layer is positioned on the lower surface of the film substrate.
15. delete
16. A display substrate including a display area and a non-display area; A film substrate positioned to overlap at least partially with the non-display area of the display substrate, on which a driving chip is disposed, and which contacts the upper surface of the display substrate; A film layer located on the entire surface of one side of the above-mentioned display substrate; An adhesive layer located between the above film layer and one surface of the above film substrate; An ink layer located between the above film layer and the above adhesive layer; and It includes a resin layer covering the other side of the film substrate and a portion of the upper surface of the display substrate, and A display device in which a portion of the resin layer and a portion of the film substrate are bent to the side of the display substrate.
17. In Paragraph 16, An overcoat layer located on the upper surface of the display substrate and overlapping at least partially with the display substrate; and A display device further comprising a protective film located on the upper surface of the overcoat layer and overlapping at least partially with the overcoat layer.
18. In Paragraph 17, A display device in which the resin layer covers the other side of the film substrate and a portion of the overcoat layer, and is positioned to be in contact with one side of the protective film.
19. In Paragraph 18, A display device in which the resin layer is positioned to fill the space between the overcoat layer and the film substrate.
20. In Paragraph 19, A display device in which the upper surface of the resin layer and the upper surface of the protective film are located on the same plane.

Description

Display device and manufacturing method of the same The present invention relates to a display device and a method for manufacturing the same. As interest in information displays intensifies and the demand for portable information media rises, the demand for and commercialization of display devices are becoming a major focus. FIG. 1 is a schematic plan view illustrating a display device according to one embodiment. FIG. 2 is a cross-sectional view illustrating a display device according to one embodiment. FIGS. 3 to 10 are drawings illustrating a method for manufacturing a display device according to one embodiment. FIGS. 11 and FIGS. 12 are perspective views illustrating a method for manufacturing a display device according to one embodiment. FIG. 13 is a cross-sectional view illustrating a display device according to another embodiment. FIGS. 14 to 17 are drawings illustrating a method for manufacturing a display device according to another embodiment. FIG. 18 is a cross-sectional view illustrating a pixel of a display device according to one embodiment. The present invention is capable of various modifications and may take various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the invention to the specific disclosed forms, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. A singular expression includes a plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "having" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Furthermore, when a part such as a layer, film, region, or plate is described as being "on" another part, this includes not only cases where it is "immediately above" the other part, but also cases where there is another part in between. Additionally, in this specification, when a part such as a layer, film, region, or plate is described as being formed "on" another part, the direction in which it is formed is not limited to the upward direction only, but includes cases where it is formed in the lateral or downward direction. Conversely, when a part such as a layer, film, region, or plate is described as being "below" another part, this includes not only cases where it is "immediately below" the other part, but also cases where there is another part in between. Hereinafter, the first direction (DR1) may refer to the horizontal direction of the component, the second direction (DR2) may refer to the vertical direction of the component in a direction perpendicular to the first direction (DR1), and the third direction (DR3) may refer to the thickness direction of the component in a direction perpendicular to the first direction (DR1) and the second direction (DR2). Hereinafter, a display device according to an embodiment of the present invention will be described with reference to the drawings related to the embodiments of the present invention. FIG. 1 is a schematic plan view illustrating a display device according to one embodiment. Referring to FIG. 1, a display device according to one embodiment may include a display substrate (100), a film substrate (210), a driving chip (220), and a printed circuit board (300). A display substrate (100) may include a base layer comprising a transparent insulating material, a driving circuit located on the base layer, a display element, etc. The base layer may include a rigid material or a flexible material. In one embodiment, the base layer may be implemented as a glass display substrate comprising a rigid material. The display substrate (100) may include a display area (DA) for displaying an image and a non-display area (NDA) for not displaying an image. The display area (DA) may include pixels (PX) for displaying an image. Each pixel (PX) may include a plurality of transistors, light-emitting elements, and capacitors. A non-display area (NDA) may be provided on at least one side of a display area (DA). The non-display area (NDA) may surround the perimeter of the display area (DA). In the non-display area (NDA), wiring electrically connected to pixels (PX) and a plurality of pads connected to the wiring may