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KR-102961186-B1 - Plastic card providing optical patterns and three dimensional aesthetics and method for manufacturing the same

KR102961186B1KR 102961186 B1KR102961186 B1KR 102961186B1KR-102961186-B1

Abstract

The present invention relates to a plastic card, and more specifically, to a plastic card that provides an optical pattern and a three-dimensional aesthetic by comprising a UV pattern layer and a deposition layer to provide an optical pattern and a three-dimensional aesthetic, and to a method for manufacturing the same by applying a PCPMMA material to increase surface strength and transmittance and enhance reliability.

Inventors

  • 이기승
  • 김영덕

Assignees

  • (주)세경하이테크

Dates

Publication Date
20260508
Application Date
20231227

Claims (9)

  1. Step of preparing the first PCPMMA layer; A step of forming a printed layer on the lower part of the first PCPMMA layer; A step of forming a deposition layer on the lower part of the above-mentioned printed layer; A step of forming a UV pattern layer on the lower part of the above-deposited layer; A step of forming a substrate layer below the above UV pattern layer; A step of forming a shielding printed layer on the lower part of the above substrate layer; and The method comprises the step of forming a second PCPMMA layer on the lower portion of the shielding printed layer; and The thickness of the first PCPMMA layer and the second PCPMMA layer is formed to be 0.04 to 0.3 μm, respectively. The first PCPMMA layer and the second PCPMMA layer each have a surface pencil hardness of 3H or higher and a transmittance of 90% or higher, and The above printed layer is formed by digital printing (DDP) and offset printing methods, and The above-mentioned deposition layer is formed in the form of an inorganic thin film using a non-conductive vacuum metallization (NCVM) method including a physical or chemical deposition method, and A method for manufacturing a plastic card, characterized in that the above UV pattern layer is formed through an index molding process using a coating resin for pattern formation, and the index molding process is performed through an index molding device comprising a turntable, an ejection unit, a roll pressing unit, and a UV curing unit.
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  6. In paragraph 1, A method for manufacturing a plastic card, characterized in that the above-mentioned substrate layer is an inlay substrate layer and is composed of one or more materials selected from the group consisting of polycarbonate (PC), polymethyl methacrylate (PMMA), polyvinyl chloride (PVC), acrylonitrile-butadiene-styrene resin (ABS), polypropylene (PP), polystyrene (PS), and polyethylene terephthalate (PET); glass or glastic; a metal including aluminum (Al) or stainless steel (SUS); and an alloy including duralumin.
  7. 1st PCPMMA layer; A printed layer located below the first PCPMMA layer; A deposition layer located below the above-mentioned printing layer; A UV pattern layer located below the above-mentioned deposition layer; A substrate layer located below the above UV pattern layer; A shielding printed layer located below the above substrate layer; and A second PCPMMA layer located below the shielding printed layer; comprising The thickness of the first PCPMMA layer and the second PCPMMA layer is each formed to be 0.04 to 0.3 μm, and The first PCPMMA layer and the second PCPMMA layer each have a surface pencil hardness of 3H or higher and a transmittance of 90% or higher, and The above printed layer is formed by digital printing (DDP) and offset printing methods, and The above-mentioned deposition layer is formed in the form of an inorganic thin film using a non-conductive vacuum metallization (NCVM) method including a physical or chemical deposition method, and A plastic card characterized in that the UV pattern layer is formed through an index molding process using a coating resin for pattern formation, and the index molding process is performed through an index molding device comprising a turntable, an ejection unit, a roll pressing unit, and a UV curing unit.
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  9. In Paragraph 7, The above-mentioned card is a plastic card characterized by including one or more types selected from credit cards, smart cards, electronic cards, authentication cards, ID cards, and business cards.

Description

Plastic card providing optical patterns and three-dimensional aesthetics and method for manufacturing the same The present invention relates to a plastic card, and more specifically, to a plastic card that provides an optical pattern and a three-dimensional aesthetic by comprising a UV pattern layer and a deposition layer to provide an optical pattern and a three-dimensional aesthetic, and to a method for manufacturing the same by applying a PCPMMA material to increase surface strength and transmittance and enhance reliability. With the recent shift toward a credit society, various types of cards, such as credit cards, medical cards, membership cards, and parking cards, have been developed and are in use. In response to the increased use of these cards, there are various efforts to develop new cards. Generally, a card is manufactured by bonding sheets composed of various materials, such as synthetic resin, metal, or film, and then cutting them to a thickness of about 0.8 mm, thereby producing a base substrate that serves as the main body of the card. In addition, various information related to the card is printed on the front and back surfaces of this main body of the card, and a thin synthetic resin film is coated on the printed surfaces to protect them. Furthermore, the surface of the card is decorated, for example, by a printing method. Of course, while various designs are presented through printing, there are limitations in satisfying the aesthetic or functional needs of users due to the constraints of the method itself. FIG. 1 is a schematic diagram showing the stacking structure of a card according to one embodiment of the present invention. Figure 2 is a schematic diagram showing the stacking structure of a conventional card. FIG. 3 is an actual photograph showing the surface of a card actually manufactured according to one embodiment of the present invention. Figure 4 is an actual photograph showing the surface of a conventional card. The present invention will be described in detail below with reference to the embodiments and drawings. These embodiments are presented merely as examples to explain the invention more specifically, and it will be obvious to those skilled in the art that the scope of the invention is not limited by these embodiments. Furthermore, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which the present invention pertains, and in the event of a conflict, the description in this specification, including the definitions, shall prevail. To clearly explain the proposed invention in the drawings, parts unrelated to the description have been omitted, and similar parts throughout the specification have been given similar reference numerals. Furthermore, when a part is described as "comprising" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components. Additionally, the term "part" as described in the specification refers to a single unit or block that performs a specific function. In each step, identification codes (1st, 2nd, etc.) are used for convenience of explanation and do not describe the order of the steps; the steps may be performed differently from the specified order unless a specific order is clearly indicated in the context. That is, the steps may be performed in the same order as specified, substantially simultaneously, or in the reverse order. In the present invention and in this specification, the term “card” may collectively refer to all plastic cards capable of exchanging various information, such as credit cards, debit cards, transportation cards, medical record cards, smart cards, authentication cards, ID cards, business cards, etc. Hereinafter, embodiments and examples of the present invention will be described in detail with reference to the attached drawings. However, the present invention may not be limited to these embodiments and examples and drawings. FIG. 1 is a schematic diagram showing the stacking structure of a card according to one embodiment of the present invention. Referring to FIG. 1, a card according to one embodiment of the present invention may include: a first PCPMMA layer (500); a printing layer (400) located below the first PCPMMA layer (500); a deposition layer (300) located below the printing layer (400); a UV pattern layer (200) located below the deposition layer (300); a substrate layer (100) located below the UV pattern layer (200); a shielding printing layer (90) located below the substrate layer (100); and a second PCPMMA layer (80) located below the shielding printing layer (90). First, a first PCPMMA layer (500) may be prepared. The first PCPMMA layer (500) is a layer constituting the outermost surface of a plastic card and may replace the structure in which the hard coating layer and overlay of the existing plastic card are laminated. The firs