KR-102961365-B1 - APPARATUS FOR MEASURING A TEMPERATURE IN PROCESS CHAMBER FOR SEMICONDUCTOR MANUFACTURING PROCESS EQUIPMENT

Abstract

The temperature measuring device for a process chamber for semiconductor manufacturing process equipment disclosed in the present invention comprises a temperature measuring wafer housed in a semiconductor manufacturing process chamber, a temperature sensor measuring a temperature at multiple points on the temperature measuring wafer, a plurality of wires electrically connected to the temperature sensor, a flexible circuit board (FPCB) electrically connected to the plurality of wires and located at one end of the temperature measuring wafer, a temperature measuring device electrically connected to the flexible circuit board, and a fixing part for fixing the flexible circuit board onto the temperature measuring wafer, wherein the fixing part comprises a pair of fixing bars installed at one end of the temperature measuring wafer and having a height such that the flexible circuit board and the temperature measuring wafer are spaced apart, and a support part formed to extend from both sides of the flexible circuit board and supported by the fixing bars. Thus, the problem of wire breakage or wire concentration being damaged due to concentrated load at the wire concentration point when using conventional thick wires is resolved, and the problem of wire breakage can be resolved by using a flexible circuit board that bends flexibly when moving to be housed in a process chamber, and the problem of wires being affected by high temperature heat due to the wires being concentrated inside a high-temperature process chamber can also be resolved since there is no need to provide a wire concentration point.

Inventors

• 손호원
• 이중원

Assignees

• (주)알더블유

Dates

Publication Date

20260508

Application Date

20240205

Claims (3)

1. A temperature measuring wafer housed in a process chamber for semiconductor manufacturing process equipment; A temperature sensor that measures temperature at multiple points on the above-mentioned temperature-measuring wafer; A plurality of wires electrically connected to the above temperature sensor; A flexible circuit board (FPCB) electrically connected to the above wires and located at one end of the temperature measuring wafer; A temperature measuring device electrically connected to the above flexible circuit board; and A fixing part for fixing the flexible circuit board on the above temperature measuring wafer; Includes, The above fixed part is, A pair of fixing bars installed at one end of the temperature measuring wafer, having a height that separates the flexible circuit board and the temperature measuring wafer, and formed of a material having the same coefficient of thermal expansion as the temperature measuring wafer; and A support member formed to protrude on both sides in the width direction of the flexible circuit board, with both ends fixed to the upper portion between the fixing bars; A temperature measuring device for a process chamber of semiconductor manufacturing process equipment, characterized by including
2. delete
3. In paragraph 1, The above fixing bar has a fastening groove formed therein, and A temperature measuring device for a process chamber of semiconductor manufacturing equipment, characterized in that support grooves formed at both ends of the support member are screw-fastened with the fastening groove.

Description

Temperature measuring device for a process chamber for semiconductor manufacturing process equipment {APPARATUS FOR MEASURING A TEMPERATURE IN PROCESS CHAMBER FOR SEMICONDUCTOR MANUFACTURING PROCESS EQUIPMENT} The present invention relates to a temperature measuring device for a process chamber of semiconductor manufacturing process equipment, and more specifically, to a temperature measuring device for a process chamber of semiconductor manufacturing process equipment that allows the temperature to be measured after housing the temperature measuring device inside the process chamber. Generally, semiconductors are manufactured through multiple processes such as photoresist film formation, development, and etching, and most of these processes are carried out in a process chamber that maintains a vacuum. In addition, semiconductors can be manufactured stably only if the temperature inside the process chamber is maintained at a set state; to achieve this, it is necessary to regularly measure the temperature inside the process chamber. delete For this temperature measurement, a temperature-measuring wafer is placed on a heater chuck, and temperature sensors are attached to multiple points on the wafer under conditions identical to the actual semiconductor manufacturing process to measure the temperature at various points. delete FIGS. 1a and 1b show a temperature measuring device (10) for a process chamber of conventional semiconductor manufacturing equipment, in which a temperature measuring wafer (5) is placed on a heater chuck (3) inside a process chamber (1) in which a vacuum is maintained, and the wafer (5) is heated by an electric resistance type or a lamp heating type to raise the temperature inside the process chamber (1) to the process temperature and measure the temperature of the temperature measuring wafer (5) inside the process chamber (1). To this end, temperature sensors (6) are provided at various points on the temperature measuring wafer (5) and connected to a temperature measuring device (9) outside the process chamber (1) by a thin metal wire-shaped wire (7). And a wire concentrating section (8) is provided to collect and concentrate wires (7) connected to temperature sensors (6) at various points. However, when the user lifts the temperature measuring device (10) to check the temperature inside the process chamber (1) frequently and to house the temperature measuring device (10) inside the process chamber (1), a concentrated load is applied to the wire concentration part (8), and as a result, the wire concentration part (8) may detach from the temperature measuring wafer (5) or the wire (7) may be damaged. In addition, the wire (7) is affected by temperature inside the high-temperature process chamber (1). Since multiple strands of wire (7) are concentrated in the wire concentration section (8), heat is not dissipated, and there is a problem of being affected by high-temperature heat. In addition, there is a problem in that the wire strands (7) are installed in contact with the temperature measuring wafer (5) at the part where the wire (7) is concentrated, and are therefore more affected by high temperature heat. FIGS. 1A and 1B are drawings showing a temperature measuring device for a process chamber of conventional semiconductor manufacturing process equipment. FIG. 2 is a perspective view showing a temperature measuring device for a process chamber for semiconductor manufacturing process equipment according to a preferred embodiment of the present invention. FIG. 3 is a drawing showing a temperature measuring device viewed from arrow A in FIG. 2. FIG. 4 is a plan view of the temperature measuring device shown in FIG. 2, Figure 5 is a diagram illustrating the structure of a temperature measuring device for a process chamber for semiconductor manufacturing process equipment shown in Figure 2. The above objects, other objects, features, and advantages of the present invention will be easily understood through the following preferred embodiments associated with the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed content is thorough and complete, and to ensure that the spirit of the present invention is sufficiently conveyed to those skilled in the art. In this specification, when a component is described as being on another component, it means that it may be formed directly on the other component or that a third component may be interposed between them. Additionally, in the drawings, the thicknesses of the components are exaggerated for the effective explanation of the technical content. Where terms such as "first," "second," etc. are used in this specification to describe components, these components shall not be limited by such terms. These terms are used merely to distinguish one component from another. The embodime