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KR-102961367-B1 - WAFER THREE-DIMENSIONAL REVIEW OPTICAL SYSTEM USING CHROMATIC CONFOCAL METHOD

KR102961367B1KR 102961367 B1KR102961367 B1KR 102961367B1KR-102961367-B1

Abstract

The present invention relates to a chromatic confocal wafer 3D review optical system, and aims to provide a chromatic confocal wafer 3D review optical system that uses a chromatic confocal method in a semiconductor wafer inspection process to identify the 3D shape of a defective wafer and simultaneously verify it with a vision system. To this end, a wafer 3D review optical system of a chromatic confocal method according to one embodiment of the present invention is configured such that a 2D image acquisition means is formed to verify a 2D image of a sample on an image sensor via a tube lens connected to an objective lens that generates an image of the sample on a semiconductor wafer that is a sample for inspection, and a 3D image acquisition means is formed to verify a 3D image of the sample on a chromatic confocal sensor via a scanner connected to the objective lens.

Inventors

  • 박상빈
  • 오용수
  • 엄명선

Assignees

  • (주)뮤텍코리아

Dates

Publication Date
20260508
Application Date
20240221

Claims (5)

  1. A 2D image acquisition means configured to verify a 2D image of a test sample on an image sensor via a tube lens connected to an objective lens that generates an image of the test sample on the upper surface of a semiconductor wafer that is a test sample, and a 3D image acquisition means configured to verify a 3D image of the test sample on a chromatic confocal sensor via a scanner connected to the objective lens are integrally formed and configured; The above 3D image acquisition means is, An objective lens that is installed on the upper part of a wafer inspection sample as a lens having magnification and generates an image of the inspection sample, and A double telecentric relay lens provided such that the actual image of a semiconductor wafer inspection sample generated by the objective lens is incident parallelly via a beam splitter while positioned at a point perpendicular to the objective lens, and A scanner that enables a 3D image to be realized through optical path conversion by moving an embedded mirror through a predetermined driving means while positioned at a point perpendicular to the above-mentioned double telecentric relay lens, and A collimation lens that performs a collimation action on a 3D image realized through the above scanner, and A chromatic confocal wafer 3D review optical system characterized by comprising a chromatic confocal sensor that reads information of a semiconductor wafer inspection sample input through the collimation lens and enables verification of a 3D image.
  2. In Article 1, The above 2D image acquisition means is, A source that emits light to provide light toward the semiconductor wafer, which is the inspection sample, and An objective lens that is installed on the upper part of a wafer inspection sample as a lens having magnification and generates an image of the inspection sample, and A tube lens configured together with the above objective lens to form a focus with a camera on the actual image of a semiconductor wafer inspection sample generated by the above objective lens, and A chromatic confocal wafer 3D review optical system characterized by comprising an image sensor that reads information of a semiconductor wafer inspection sample input through the above-mentioned tube lens and enables verification of a 2D image.
  3. In Paragraph 2, A chromatic confocal wafer 3D review optical system characterized in that the source is positioned at a point perpendicular to the optical path between the objective lens and the tube lens, and is configured to irradiate light through a pair of illumination lenses and a beam splitter.
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  5. In Article 1, The above double telecentric relay lens is, A chromatic confocal wafer 3D review optical system characterized by comprising: a first lens connected to the objective lens via a beam splitter while positioned at a point perpendicular to the objective lens; and a second lens connected to the first lens via a mirror while positioned at a point perpendicular to the first lens.

Description

Wafer 3D Review Optical System Using Chromatic Confocal Method The present invention relates to a chromatic confocal wafer 3D review optical system, and more specifically, to a chromatic confocal wafer 3D review optical system that enables the identification of the 3D shape of a defective wafer through a chromatic confocal method during semiconductor wafer inspection and the simultaneous verification of this shape using vision. As is well known, a semiconductor device is constructed by forming complex and diverse functional layers consisting of semiconductors, insulators, and conductors on a single-crystal silicon wafer as a substrate, and forming multiple circuit elements and wirings by processing the material films constituting the various functional layers through various methods such as patterning and ion implantation. In order to form the complex structure of the semiconductor device, the wafer undergoes numerous physical and chemical processes, among which the photolithography process is the most important process for increasing the density of the device by forming a complex pattern on a narrow plane. In the manufacturing process of such semiconductor devices, defects and contaminants that may occur through various pathways have a significant impact on the yield of the semiconductor devices, so a highly clean working environment and precise control are required. Furthermore, due to the high integration of semiconductor devices resulting from the advancement of semiconductor process technology, the size of defects detected in the inspection process is becoming very small. Consequently, there is an urgent need for highly precise and rapid inspection to achieve high yields in detecting wafer defects. FIG. 1 is a block diagram showing the configuration of a chromatic confocal wafer 3D review optical system according to an embodiment of the present invention, FIG. 2 is a block diagram showing the configuration of a 2D image acquisition means applied to a chromatic confocal wafer 3D review optical system according to an embodiment of the present invention, FIG. 3 is a block diagram showing the configuration of a 3D image acquisition means applied to a chromatic confocal wafer 3D review optical system according to an embodiment of the present invention. Hereinafter, the present invention configured as described above will be explained in detail with reference to the attached drawings. FIG. 1 is a block diagram showing the configuration of a chromatic confocal wafer 3D review optical system according to an embodiment of the present invention, FIG. 2 is a block diagram showing the configuration of a 2D image acquisition means applied to a chromatic confocal wafer 3D review optical system according to an embodiment of the present invention, and FIG. 3 is a block diagram showing the configuration of a 3D image acquisition means applied to a chromatic confocal wafer 3D review optical system according to an embodiment of the present invention. First, the chromatic confocal wafer 3D review optical system according to the present invention is implemented so that when inspecting a semiconductor wafer, the chromatic confocal method is used to identify the 3D shape of a defective wafer and simultaneously enable verification by vision. To this end, the chromatic confocal wafer 3D review optical system according to the present invention is installed on a semiconductor wafer inspection sample (100) on which a predetermined defect inspection process is performed, and is provided with a 2D image acquisition means (A) configured to enable viewing a 2D image of the inspection sample through an image sensor (40) via a tube lens (30) connected to an objective lens (50) that generates an image of the inspection sample above the semiconductor wafer inspection sample (100), and a 3D image acquisition means (B) configured to enable viewing a 3D image of the inspection sample through a chromatic confocal sensor (90) via a scanner (70) connected to the objective lens (50), formed as an integrated structure. Referring to FIG. 2, the 2D image acquisition means (A) is configured to include a source (10), an illumination lens (12), a first beam splitter (20), a second beam splitter (22), an AF (Auto Focus, 14), an objective lens (50), a tube lens (30), and an image sensor (40). The source (10) emits light to provide light toward the semiconductor wafer inspection sample (100) for inspection, and the illumination lens (12) is configured to be arranged as a pair of lenses so that the light emitted from the source (10) acts to irradiate toward the semiconductor wafer inspection sample (100). The first beam splitter (20) is installed in front of a pair of illumination lenses (12) to allow light emitted from the source (10) and passing through the pair of illumination lenses (12) to pass through, and is configured to form a path for AF (14) which is installed in a direction perpendicular to the source (10) to provide an autofocus function for