KR-102961388-B1 - MULTILAYER CERAMIC ELECTRONIC COMPONENT

KR102961388B1KR 102961388 B1KR102961388 B1KR 102961388B1KR-102961388-B1

Abstract

Providing a multilayer ceramic electronic component capable of further suppressing crack formation in the laminate while also improving moisture resistance. As a multilayer ceramic electronic component (1), the lower electrode layer (501) on the cross-sectional side includes a first lower electrode layer (51) with a high porosity and a second lower electrode layer (52) on the cross-sectional side with a lower porosity than that of the first lower electrode layer (51), and the lower electrode layer (502) on the main surface side includes a layer with a lower porosity than that of the first lower electrode layer (51).

Inventors

카지하라 야스카즈

Assignees

가부시키가이샤 무라타 세이사쿠쇼

Dates

Publication Date: 20260508
Application Date: 20241220
Priority Date: 20240327

Claims (5)

A laminated body comprising a plurality of stacked ceramic layers and a plurality of internal conductor layers, having a first main surface and a second main surface facing in the height direction, a first side surface and a second side surface facing in the width direction orthogonal to the height direction, and a first end surface and a second end surface facing in the length direction orthogonal to the height direction and the width direction, A first external electrode disposed on the first cross-section above, and A multilayer ceramic electronic component having a second external electrode disposed on the second cross-section, The first external electrode comprises a first cross-section side external electrode disposed on the first cross-section, and a first main surface side external electrode connected to the first cross-section side external electrode and disposed on a part of the first cross-section side on the first main surface and the second main surface. The second external electrode comprises a second cross-section side external electrode disposed on the second cross-section, and a second main surface side external electrode connected to the second cross-section side external electrode and disposed on a part of the second cross-section side on the first main surface and the second main surface. The above-mentioned first cross-sectional side external electrode and the above-mentioned second cross-sectional side external electrode comprise a cross-sectional side lower electrode layer, and A cross-sectional conductive resin layer disposed on the lower electrode layer on the cross-sectional side, and It includes a cross-sectional plating layer disposed on the cross-sectional conductive resin layer, and The first main surface side external electrode and the second main surface side external electrode comprise a main surface side lower electrode layer disposed on the first main surface and the second main surface, and A main side conductive resin layer disposed on the main side lower electrode layer above, and It includes a main side plating layer disposed on the main side conductive resin layer, and The above-mentioned cross-sectional lower electrode layer comprises a first cross-sectional lower electrode layer having a high porosity and a second cross-sectional lower electrode layer having a lower porosity than that of the first cross-sectional lower electrode layer. A multilayer ceramic electronic component, wherein the lower electrode layer on the main surface side comprises a layer with a lower porosity than the lower electrode layer on the first cross-sectional side.
In paragraph 1, The first external electrode comprises a first side-side external electrode that is connected to the first cross-sectional side external electrode and disposed on a part of the first cross-sectional side on the first side and the second side, and The second external electrode comprises a second side external electrode that is connected to the second cross-sectional side external electrode and is disposed on a part of the second cross-sectional side on the first side and the second side, and The first side external electrode and the second side external electrode comprise a side lower electrode layer disposed on the first side and the second side, a side conductive resin layer disposed on the side lower electrode layer, and a side plating layer disposed on the side conductive resin layer. A multilayer ceramic electronic component, wherein the above-mentioned side lower electrode layer comprises a layer having a lower porosity than the above-mentioned first cross-sectional side lower electrode layer.
In paragraph 1 or 2, A multilayer ceramic electronic component in which the second cross-sectional lower electrode layer is disposed on the first cross-sectional lower electrode layer.
In paragraph 1 or 2, A multilayer ceramic electronic component in which the lower electrode layer on the main surface side is formed substantially continuously with the lower electrode layer on the second cross-sectional side.
In paragraph 4, A multilayer ceramic electronic component, wherein the lower electrode layer on the main surface side is a single layer formed by a layer continuous with the lower electrode layer on the second cross-sectional side.

Description

Multilayer Ceramic Electronic Components The present invention relates to a multilayer ceramic electronic component. Recently, multilayer ceramic capacitors as multilayer ceramic electronic components are required to have durability under harsh environments, such as bending stress caused by thermal expansion, and in response to this, a technology using a thermosetting conductive resin paste on the external electrode of a multilayer ceramic capacitor is known. Patent Document 1 can be cited as an example of this type of technology. Patent Document 1 describes a multilayer ceramic capacitor having an external electrode having a layer composition in which an electrode layer coated by dipping and baking a conductive paste, a conductive epoxy-based thermosetting resin layer, a nickel plating layer, and a tin-based layer are sequentially stacked. FIG. 1 is an external perspective view of a multilayer ceramic capacitor of the present embodiment. Figure 2 is a cross-sectional view along line II-II of the multilayer ceramic capacitor shown in Figure 1. Figure 3 is a cross-sectional view along line III-III of the multilayer ceramic capacitor shown in Figure 2. Figure 4 is a cross-sectional view along line IV-IV of the multilayer ceramic capacitor shown in Figure 2. Figure 5 is an enlarged view of the V portion of the multilayer ceramic capacitor shown in Figure 2, and is a schematic diagram for explaining the porosity of the lower electrode layer on the cross-sectional side and the lower electrode layer on the main surface side of the multilayer ceramic capacitor. FIG. 6 is an enlarged view of part VI of the multilayer ceramic capacitor shown in FIG. 4, and is a schematic diagram for explaining the porosity of the cross-sectional lower electrode layer and the side-sectional lower electrode layer of the multilayer ceramic capacitor. FIG. 7 is a schematic diagram illustrating the cross-sectional lower electrode layer and the main-side lower electrode layer of a multilayer ceramic capacitor of the second embodiment. FIG. 8 is a schematic diagram illustrating the porosity of the cross-sectional lower electrode layer and the side-side lower electrode layer of a multilayer ceramic capacitor of the second embodiment. FIG. 9 is a schematic diagram illustrating the cross-sectional lower electrode layer and the main-side lower electrode layer of a multilayer ceramic capacitor of the third embodiment. FIG. 10 is a schematic diagram illustrating the porosity of the cross-sectional lower electrode layer and the side-sectional lower electrode layer of a multilayer ceramic capacitor of the third embodiment. FIG. 11 is a schematic diagram showing an example of the configuration of a double-layered ceramic capacitor. FIG. 12 is a schematic diagram showing an example of the configuration of a triple-layer ceramic capacitor. FIG. 13 is a schematic diagram showing an example of the configuration of a 4-row multilayer ceramic capacitor. <Embodiment> Hereinafter, a multilayer ceramic capacitor (1) as a multilayer ceramic electronic component according to the first embodiment of the present disclosure will be described using FIGS. 1 to 4. FIG. 1 is an external perspective view of the multilayer ceramic capacitor (1) of the present embodiment. FIG. 2 is a cross-sectional view along line II-II of the multilayer ceramic capacitor (1) of FIG. 1. FIG. 3 is a cross-sectional view along line III-III of the multilayer ceramic capacitor (1) of FIG. 2. FIG. 4 is a cross-sectional view along line IV-IV of the multilayer ceramic capacitor (1) of FIG. 2. Meanwhile, drawings may be schematically simplified to explain the content of the invention, and the dimensional ratios of the depicted components or between components may not match the dimensional ratios described in the specification. Additionally, there may be cases where components described in the specification are omitted from the drawings, or where the number is omitted. For example, the number of internal electrode layers described in FIGS. 2 and FIGS. 3 is 10 layers for convenience of explanation, but this does not represent the actual number of internal electrode layers (30). Meanwhile, regarding terms used in the present invention to specify shapes, geometric conditions, and their degrees, such as 'parallel,' 'orthogonal,' 'identical,' and values of length or angle, etc., they are not bound by their strict meanings but are interpreted to include a range that allows for similar functions to be expected. A multilayer ceramic capacitor (1) has a laminate (10) and an external electrode (40). FIGS. 1 to 4 show an XYZ orthogonal coordinate system. The length direction (L) of the multilayer ceramic capacitor (1) and the laminate (10) corresponds to the X direction. The width direction (W) of the multilayer ceramic capacitor (1) and the laminate (10) corresponds to the Y direction. The stacking direction (T) as the height direction of the multilayer ceramic capacitor (1) and the laminate (10) corre