KR-102961391-B1 - COLD PLATE

KR102961391B1KR 102961391 B1KR102961391 B1KR 102961391B1KR-102961391-B1

Abstract

The present invention relates to a cold plate, comprising a cold plate body having a heat dissipation portion that contacts a heating element and cools the heating element, and a plurality of channel plates that form a cooling fluid flow path through which a cooling fluid flows, wherein the cooling fluid flow path comprises a macro channel through which the cooling fluid flows in a first direction which is the stacking direction of the plurality of channel plates, and a micro channel through which the cooling fluid flows in a second direction which is orthogonal to the first direction.

Inventors

이장욱

Assignees

2767309 알버타 아이엔씨

Dates

Publication Date: 20260511
Application Date: 20260107

Claims (15)

It includes a cold plate body that is diffusion-bonded and has a heat dissipation portion that contacts a heating element and cools the heating element, and a plurality of channel plates that form a cooling fluid flow path through which a cooling fluid flows are stacked. The above cooling fluid flow path comprises a macro channel in which the cooling fluid flows in a first direction which is the stacking direction of a plurality of channel plates, and a micro channel in which the cooling fluid flows in a second direction which is orthogonal to the first direction, a cold plate.
In paragraph 1, The above channel plate is, A first channel plate having a plurality of first through holes formed at intervals on the plate surface through which the cooling fluid flows; and A cold plate comprising a plurality of second through holes formed at intervals on the plate surface to partially communicate with a plurality of first through holes, through which the cooling fluid flows, and a second channel plate laminated to the first channel plate and partially diffusely bonded.
In paragraph 2, A cold plate in which a plurality of the first channel plates and a plurality of the second channel plates are alternately stacked and diffusion-bonded.
In paragraph 3, The first channel plate and the second channel plate are, A cold plate that is stacked and diffusely bonded such that a plurality of the first through holes and a plurality of the second through holes partially communicate along the stacking direction of the first channel plate and the second channel plate, and at the same time partially communicate along the plate surface direction of the first channel plate and the second channel plate.
In paragraph 4, The first channel plate and the second channel plate are, The first channel plate and the second channel plate partially overlap, and the first channel plate and the second channel plate partially diffusely bonded along the plate surfaces of the first channel plate and the second channel plate so that the first through hole and the second through hole are in communication. The above macro channel is formed such that the first through hole and the second through hole are partially connected along the stacking direction of the first channel plate and the second channel plate, and The above microchannel is a cold plate in which the first through hole and the second through hole are formed by partially communicating along the plate surface direction of the first channel plate and the second channel plate, excluding the joint.
In paragraph 2, A cold plate further comprising a pair of guide members, each provided on the outer side of a channel plate positioned on the outer side between a plurality of channel plates, shielding the macro channel and guiding the cooling fluid flowing through the macro channel to flow toward the micro channel while changing direction.
In paragraph 6, The above guide member includes a plurality of guide plates, and A plurality of the above guide plates are diffusion-bonded together with the channel plate, forming a cold plate.
In paragraph 6, A cold plate further comprising a pair of discharge passage members, each provided on the outer side of the guide members with the pair of guide members in between, forming a discharge passage through which the cooling fluid flowing through the microchannel is discharged.
In paragraph 8, The above discharge passage member includes a plurality of discharge passage plates in which the discharge passage is formed, and A plurality of the above-mentioned discharge passage plates are diffusion-bonded with the guide member, and A cold plate having a discharge hole formed in each of the above channel plate and the above guide member, through which a cooling fluid is discharged and which communicates with the discharge passage of the above discharge passage member.
In Paragraph 9, A cold plate further comprising a pair of cover members, each provided on the outer side of the discharge passage member, shielding the discharge passage and diffusion bonding with the discharge passage member.
In Paragraph 10, The above cover member includes a plurality of cover plates, and A plurality of the above cover plates are cold plates that are diffusion-bonded with the discharge passage member.
In Paragraph 9, The above cold plate body is, An inlet port into which the above cooling fluid flows into the cooling fluid flow path; and A cold plate further comprising a discharge port through which the cooling fluid that has flowed through the cooling fluid flow path is discharged.
In Paragraph 12, In some of the plurality of channel plates, an inlet guide hole is formed that communicates with the inlet port so that the cooling fluid flows into the cooling fluid flow path, and A cold plate in which, among a plurality of the above channel plates, the same channel plate in which the inflow guide hole is formed, another part of the above channel plate, or any one of the above discharge passage members, a discharge guide hole is formed that communicates with the discharge port so as to discharge the cooling fluid that has flowed along the discharge passage.
In Paragraph 13, The above-mentioned inlet guide hole is formed in communication with a portion of the first through hole and a portion of the second through hole of a plurality of channel plates located vertically below the inlet port, and The above discharge guide hole is formed in communication with the discharge hole of a plurality of channel plates located vertically below the discharge port, or is formed in communication with the discharge passage of the discharge passage member, a cold plate.
In Paragraph 10, A cold plate in which the channel plate, the guide member, the discharge passage member, and the cover member have the same or different dimensions in width, length, and thickness, and are diffusion-bonded.

Description

Cold Plate The present invention relates to a cold plate that comes into contact with a heating element and cools the heating element. As modern electronic devices rapidly advance in performance and miniaturization, the amount of heat generated per unit area is increasing dramatically, and consequently, the importance of effective thermal management technology is growing even more. In particular, precise temperature control is essential for stable operation in high-heat electronic components such as CPUs (Central Processing Units), GPUs (Graphic Processor Units), and power semiconductors. To meet these thermal management requirements, various cooling technologies have been developed in the past. Air cooling methods have the advantages of a simple structure and low cost, but they have limitations in terms of cooling performance in high heat density environments. Liquid cooling is widely used for cooling high-heat components due to its superior heat transfer characteristics compared to air; however, conventional simple channel structures have a problem in that the flow of the cooling fluid is unevenly distributed. In particular, most conventional cold plates have a two-dimensional structure in which the cooling fluid flows in only one direction, so the cooling fluid flow path is formed monotonously and uniformly, and the contact time between the cooling fluid and the heating element is limited, which has the problem of not being able to provide sufficient cooling heat to the heating element and not being able to provide sufficient cooling performance in the local high-temperature region of the heating element. In addition, due to thermal deviation and flow velocity deviation in the cooling fluid flow path of the cold plate, a non-uniform heat distribution occurs, making it difficult to cool heating elements with complex shapes or electronic components with high heat density with a uniform temperature distribution. In addition, due to the vaporization of the cooling fluid and pressure imbalance in the cooling fluid flow path of the cold plate, localized bubbles and cavitation occur, leading to problems such as reduced heat transfer and vibration. In addition, there are technical limitations in precisely implementing the cooling fluid flow path of the cold plate as a complex three-dimensional flow path using the conventional skiving method for manufacturing cold plates, and in particular, there are significant difficulties in implementing a multi-layered heat transfer mechanism by simultaneously implementing micro-scale channels and macro-scale channels. Accordingly, the applicant has developed a new structure of cold plate capable of maximizing the contact area and time with a heating element while allowing the cooling fluid to flow in multiple directions, and simultaneously improving heat transfer efficiency. FIG. 1 is a perspective view of a cold plate according to one embodiment of the present invention, FIG. 2 is a drawing showing the state in which the inlet nipple and the outlet nipple of FIG. 1 are separated. FIG. 3 is a cross-sectional view along line AA of FIG. 2, FIG. 4 is an exploded perspective view of FIG. 2, FIG. 5 is a drawing illustrating a state in which a first channel plate and a second channel plate are diffusion-bonded according to one embodiment. FIG. 6 is an exploded perspective view of FIG. 5. FIG. 7 is a diagram illustrating the flow of the cooling fluid in FIG. 5. FIG. 8 is a drawing illustrating a state in which a first channel plate and a second channel plate are diffusion-bonded according to another embodiment, FIG. 9 is an exploded perspective view of FIG. 8. FIG. 10 is a diagram illustrating the flow of the cooling fluid in FIG. 8. FIG. 11 is a drawing illustrating the flow of a cooling fluid of a cold plate according to an embodiment of the present invention using FIG. 2, FIGS. 12 and FIGS. 13 are drawings illustrating the simulated results of a cold plate according to the present invention. The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the present invention, and the present invention is defined only by the scope of the claims. The terms used in this specification are for describing embodiments and are not intended to limit the invention. In this specification, the singular form includes the plural form unless specifically stated otherwise in the text. The terms "comprises" and/or "comprising" used in this specification do not exclude the presence or addition of one or more other components in addition to the components mentioned.