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KR-102961410-B1 - Apparatus for bonding wire

KR102961410B1KR 102961410 B1KR102961410 B1KR 102961410B1KR-102961410-B1

Abstract

A wire bonding device according to an embodiment of the present invention comprises a bonding stage, a capillary that guides a bonding wire to a bonding pad of a semiconductor chip placed on the bonding stage, a clamp on which the capillary is rotatably installed, and a bonding arm connected to the clamp to raise and lower the clamp. The clamp comprises a housing having an internal space, a first member fixedly installed at the upper end of the internal space of the housing and having a first gear portion on its bottom surface, a second member fixedly installed at the lower end of the internal space of the housing so as to be spaced apart from the first member and having a second gear portion on its top surface, a third member disposed between the first member and the second member and raised and lowered and having a third gear portion corresponding to the first gear portion and a fourth gear portion corresponding to the second gear portion, and an elastic member connected to the third member to provide a restoring force to the third member. The capillary is fixedly installed on the third member and can rotate in conjunction with the third member.

Inventors

  • 허대웅

Assignees

  • 삼성전자주식회사

Dates

Publication Date
20260508
Application Date
20220728

Claims (10)

  1. Bonding stage; A capillary that guides a bonding wire to a bonding pad of a semiconductor chip mounted on the bonding stage; A clamp in which the above capillary is rotatably installed; and A bonding arm connected to the clamp and raising or lowering the clamp; Includes, The above clamp Housing having an internal space; A first member fixedly installed at the upper part of the internal space of the above housing and having a first gear portion provided on its bottom surface; A second member fixedly installed at the lower end of the internal space of the housing so as to be spaced apart from the first member, and having a second gear portion provided on its upper surface; A third member disposed between the first member and the second member and raised and lowered, and having a third gear part corresponding to the first gear part and a fourth gear part corresponding to the second gear part; and An elastic member connected to the third member and providing a restoring force to the third member; Includes, The above capillary is a wire bonding device fixedly installed on the third member and rotated in conjunction with the third member.
  2. In paragraph 1, The above third member is a wire bonding device that rotates in one direction when the first gear part and the third gear part are combined, and when the second gear part and the fourth gear part are combined.
  3. In paragraph 1, A wire bonding device in which the teeth of the first gear section and the third gear section have a cross-sectional shape of a right triangle.
  4. In paragraph 3, A wire bonding device in which the teeth of the first gear section and the third gear section have the same gear ratio.
  5. In paragraph 1, A wire bonding device in which the teeth of the second gear section and the fourth gear section have a cross-section in the shape of a right triangle.
  6. In paragraph 5, A wire bonding device in which the teeth of the second gear section and the fourth gear section have the same gear ratio.
  7. In paragraph 1, A wire bonding device having a protrusion in the capillary that is inserted and disposed in the coupling groove of the third member.
  8. In paragraph 1, A wire bonding device in which a spring is connected to the above-mentioned capillary to allow the capillary to return to a certain position.
  9. In paragraph 1, The above elastic member is composed of a coil spring, and A wire bonding device in which one end of the elastic member is supported on an upper surface disposed inside the third gear portion of the third member, and the other end of the elastic member is supported on a protruding projection protruding into the inner surface of the first member.
  10. A capillary that guides the bonding wire to the bonding pad of a semiconductor chip; A clamp in which the above capillary is rotatably installed; and Includes, The above clamp Housing having an internal space; A first member fixedly installed at the upper part of the internal space of the above housing and having a first gear portion provided on its bottom surface; A second member fixedly installed at the lower end of the internal space of the housing so as to be spaced apart from the first member, and having a second gear portion provided on its upper surface; A third member positioned between the first member and the second member, which is raised and lowered and in which the capillary is fixedly installed; and An elastic member connected to the third member and providing a restoring force to the third member; Includes, The third member is rotated by the first gear part of the first member when rising and rotated by the second gear part of the second member when falling, and The above third member is a wire bonding device that rotates in only one direction.

Description

Wire bonding apparatus The present invention relates to a wire bonding device. Semiconductor packages are manufactured through multiple process stages. For example, semiconductor packages are manufactured through processes such as sawing, die bonding, wire bonding, molding, and marking. Here, the wire bonding process is a process of connecting the pads of a semiconductor chip to the leads of a lead frame with bonding wires, or connecting the pads of each semiconductor chip with bonding wires. The capillary is an important component of the wire bonding device that performs the bonding process, and it is necessary to extend the lifespan of the capillary to improve the productivity of the bonding process. FIG. 1 is a schematic diagram showing a wire bonding device according to an exemplary embodiment. FIG. 2 is an exploded perspective view showing a clamp and a capillary according to an exemplary embodiment. FIG. 3 is a cross-sectional view showing a clamp according to an exemplary embodiment. FIGS. 4 to 6 are explanatory diagrams for illustrating the operation of a clamp and a capillary according to an exemplary embodiment. Preferred embodiments of the present invention will be described below with reference to the attached drawings. FIG. 1 is a schematic diagram showing a wire bonding device according to an exemplary embodiment. Referring to FIG. 1, a wire bonding device (100) according to an exemplary embodiment includes a bonding stage (110), a bonding arm (120), a capillary (130), and a clamp (200). A substrate (101) may be placed on the bonding stage (110), and a semiconductor chip (102) is mounted on the substrate (101). At this time, the leads (101a) of the substrate (101) and the bonding pads (102a) of the semiconductor chip (102) may be electrically connected by a bonding wire (W). Meanwhile, the bonding wire (W) may include a conductive material such as gold (Au), silver (Ag), platinum (Pt), aluminum (Al), copper (Cu), palladium (Pd), nickel (Ni), cobalt (Co), chromium (Cr), titanium (Ti), etc. Additionally, the semiconductor chip (102) may include, for example, various memory chips, control chips, driver chips, microprocessor chips, etc. Furthermore, the semiconductor chip (C) may include display devices such as LCD devices and LED devices, or chips manufactured using all types of semiconductor processes that require semiconductor processes. Meanwhile, the substrate (101) may include a substrate used in memory devices such as a memory substrate, a control substrate, a memory stick card, a smart media card (SM), a secure digital card (SD), a mini secure digital card (mini SD), or a multimedia card (MMC). For example, the bonding stage (110) can heat the bonding pad (102a) of the semiconductor chip (102) and the lead (101a) of the lead frame when the wire bonding process is performed. In this way, thermal energy heated by the bonding stage (110) is transferred to the bonding wire (W) so that a ball can be formed. Additionally, for example, the bonding stage (110) may be movable on the XY plane. However, it is not limited thereto, and the capillary (130) may move between the areas to be bonded and guide the bonding wire (W) to the areas to be bonded. A bonding arm (120) has a clamp (200) fixedly installed at its end and is configured to be rotatable so that a capillary (130) installed on the clamp (200) can be raised and lowered. Meanwhile, the bonding arm (120) is equipped with an ultrasonic horn (not shown) so that the capillary (130) can be driven through the ultrasonic horn. The capillary (130) guides the bonding wire (W) to the bonding pad (102a) of the semiconductor chip (102) placed on the bonding stage (110) and the lead (101a) of the substrate (101) so that the bonding pad (102a) and the lead (101a) are electrically connected. To this end, the capillary (130) may be provided with a through hole (not shown) that penetrates in the direction of the centerline. Then, the bonding wire (W) can be guided through the through hole to the bonding pad (102a) of the semiconductor chip (102) and the lead (101a) of the substrate (101). A capillary (130) is rotatably installed in the clamp (200) and can be fixedly installed at the end of the bonding arm (130). Below, we will examine the clamp (200) in more detail with reference to the drawings. FIG. 2 is an exploded perspective view showing a clamp and a capillary according to an exemplary embodiment, and FIG. 3 is a cross-sectional view showing a clamp according to an exemplary embodiment. Referring to FIGS. 2 and 3, the clamp (200) includes, as an example, a housing (210), a first member (220), a second member (230), a third member (240), and an elastic member (250). The housing (210) has an internal space. In addition, a first member (220), a second member (230), a third member (240), and an elastic member (250) are arranged in the internal space of the housing (210), and a bonding wire (W) can pass through the housing (210). For example, the housing (21