KR-102961450-B1 - Silicone rubber pad with excellent uniformity and adhesion

Abstract

A silicone resin pad is provided, which is manufactured by curing a liquid silicone resin containing dimethylsiloxane and methylvinylsiloxane, and is characterized by having perylene coated on the surface of the silicone resin pad.

Inventors

• 정구찬
• 박기웅
• 박서정

Assignees

• 주식회사리온

Dates

Publication Date

20260507

Application Date

20250711

Claims (6)

1. A silicone resin pad manufactured by curing a liquid silicone resin containing dimethylsiloxane and methylvinylsiloxane, After hardening, the elongation is 400 to 700%, the permanent compression set is 0.5 to 0.6%, the weight-average molecular weight is 40,000 to 60,000 g/mol, and the number-average molecular weight is 1,500 to 2,000 g/mol, and A silicone resin pad characterized by having a uniformity with a step difference of within 70㎛ when pressurized at 90kgf/cm² while having a width and length of 50cm or more and 100cm or less, and having a perylene coating layer formed on the surface of the silicone resin pad.
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4. In Article 1, The above silicone resin pad is characterized as being a compression pad for semiconductor packaging.
5. In Paragraph 4, The above silicone resin pad is characterized by being in contact with and pressurized by a PET (Polyethylene terephthalate) film.
6. In Paragraph 5, A silicone resin pad characterized by the thickness of the perylene coating being at a level that blocks contact between the oil of oil bleeding occurring from the silicone resin pad and the PET (Polyethylene terephthalate) film.

Description

Silicone rubber pad with excellent uniformity and adhesion The present invention relates to a silicone resin pad having excellent uniformity and adhesion, and more specifically, to a silicone resin pad that can be pressed and mounted with excellent uniformity when pressing electronic devices such as semiconductor chips, and has uniform adhesion even over a large area. Various packaging technologies are being developed in response to the miniaturization of semiconductor linewidths. However, the technology of stacking chips in multiple layers is essential in these packaging processes, and rubber-based pads, such as silicone resin, are used for this purpose. However, as these silicone resin pads become larger in area, there is a problem with reduced uniformity across the entire surface when pressurized for mounting electronic components such as chips. Therefore, it is necessary to develop a new silicone resin pad capable of solving this problem. Furthermore, due to the large surface area, a problem arises where achieving uniform adhesion between the insulating layer (e.g., ABF) and the rubber pad (silicone pad) used to pressurize the insulating layer becomes more difficult. This can occur due to subtle variations in the interface characteristics between the pad and the film, or due to minute non-uniformities in temperature and pressure during the pressurization process. Such non-uniform adhesion leads to wasted insulating films, such as expensive ABF films, due to poor separation. Additionally, non-uniform stress generated during carrier film separation is transferred to the fine semiconductor chips stacked underneath, posing a risk of causing microscopic cracks or damage to the chips. Figures 1 to 4 show the results of the compression test of the silicone pad. FIGS. 5 to 7 are the results of measuring the uniformity of pads measured while simultaneously increasing the length and width from 10 cm to 50 cm and 100 cm in the example, comparative example 1, and comparative example 3, respectively. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. Before describing the present invention in detail, the terms and words used in this specification should not be interpreted as being unconditionally limited to their ordinary or dictionary meanings, and the inventor of the present invention may appropriately define and use the concepts of various terms to best describe their invention. Furthermore, it should be understood that these terms or words should be interpreted in a meaning and concept consistent with the technical spirit of the present invention. In other words, the terms used in this specification are used merely to describe preferred embodiments of the invention and are not intended to specifically limit the content of the invention. It should be noted that these terms are defined in consideration of the various possibilities of the present invention. Additionally, in this specification, singular expressions may include plural expressions unless the context clearly indicates a different meaning. In addition, you should be aware that even if it is expressed in the plural, it may contain a singular meaning. Throughout this specification, where it is stated that a component "includes" another component, unless specifically stated otherwise, this may mean that it does not exclude any other component but may include any other component. In one embodiment of the present invention, it was discovered that the combination of the permanent compression rate and the elongation rate of the silicone rubber significantly affects the uniformity of the pad during compression. The present invention will be explained in more detail through the following examples. Example 1 In one embodiment of the present invention, liquid silicone rubber (LSR) was cured at a temperature of 100 degrees Celsius to a size of 100 x 100 cm and a thickness of 3 mm. In the present invention, liquid silicone rubber was prepared by curing 50 to 60 parts by weight of methyl vinyl siloxane with respect to 100 parts by weight of dimethyl siloxane in a curing mold at 150°C for 5 minutes in the presence of a platinum catalyst (5 parts by weight). As a comparative example, the above silicone resin is an LSR, which is a liquid silicone rubber resin composed of dimethyl and methyl vinylsiloxane copolymers, with a different molecular weight. To this end, liquid silicone rubber was prepared by using 10 parts by weight of methyl vinyl siloxane (Comparative Example 1) and 100 parts by weight of methyl vinyl siloxane, respectively, with respect to 100 parts by weight of dimethyl siloxane, and curing in a curing mold at 150°C for 5 minutes with a platinum catalyst (5 parts by weight) (Comparative Example 2). In addition, unlike this, the curing time was set to 20 minutes instead of 5 minutes, and curing was carried out with 200 parts by weight of methyl vinylsiloxane per 100 parts by weigh