KR-102961520-B1 - Wafer tester

KR102961520B1KR 102961520 B1KR102961520 B1KR 102961520B1KR-102961520-B1

Abstract

A wafer tester is provided. A wafer tester according to one embodiment of the present invention comprises: a probing disk on which a wafer is mounted; and an upper plate on which the probing disk is seated; wherein the upper plate is provided with a cooler for cooling the wafer.

Inventors

김건
고성민

Assignees

주식회사 쎄믹스

Dates

Publication Date: 20260507
Application Date: 20250530
Priority Date: 20250121

Claims (16)

Probing disk mounted on a wafer; A test plate on which the above-mentioned probing disc is seated; and A hot chuck that contacts the upper surface of the probing disk and heats the wafer; comprising, The above hot chuck includes a heating surface in contact with one surface of the probing disc, and On the heating surface, a first sealing member formed of an elastic material and a sealing groove in which the first sealing member is disposed are formed. The first sealing member protrudes above the heating surface while positioned in the sealing groove, A wafer tester in which the first sealing member is compressed into the sealing groove while being pressed by one side of the probing disk.
In Article 1, The above test plate is equipped with a cooler, and The above test plate is, It includes an upper plate having a conductive member in contact with the probing disk, and a lower plate located below the upper plate, The above cooler is a wafer tester formed on the lower plate.
In Article 2, The above cooler is, A wafer tester formed at a position corresponding to the position where the upper plate is seated within the lower plate.
In Article 2, The above cooler includes an inlet path through which refrigerant flows in and an outlet path through which the inlet refrigerant flows out, wherein A wafer tester in which the inlet and outlet paths form a spiral path and extend parallel to each other.
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In Article 1, On the above test plate, a moving assembly for moving the hot chuck is formed, The above-described moving assembly is a wafer tester, the lower end of which is fixed on the test plate and the upper end of which is fixed to the hot chuck.
In Article 6, The above hot chuck is positioned at a predetermined first position that does not come into contact with the upper surface of the probing disc while the probing disc is seated on the test plate, and A wafer tester in which, after the probing disk is placed on the test plate, it is moved by the moving assembly to a second position in contact with the upper part of the probing disk.
In Article 6, The above hot chuck includes a hot chuck body and a cap plate covering the hot chuck body, and The above cap plate is formed to have a radius larger than that of the hot chuck body, A wafer tester having a holder supporting the cap plate at one end of the above-mentioned moving assembly.
In Article 8, A wafer tester, wherein the holder includes a protrusion in which the lower part of the holder protrudes toward the cap plate, and the protrusion supports the lower surface of the cap plate.
In Article 9, A wafer tester in which the holder does not restrict the downward movement of the hot chuck when the hot chuck is positioned above the probing disc while the probing disc is seated on the test plate.
In Article 6, The above-mentioned moving assembly is positioned at a plurality of locations on the test plate, A wafer tester that supports multiple parts of the above hot chuck.
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In Article 1, The above sealing groove extends in a shape forming a predetermined closed curve on the heating surface, and The first sealing member extends along the sealing groove along a path corresponding to the closed curve, and A wafer tester in which, when one side of the probing disk and the heating surface are in contact, the first sealing member fluidly isolates the space within the closed curve and the space outside the closed curve.
In Article 1, The above probing disc is, It includes a probe card having a first surface and a second surface, and a wafer chuck having a third surface and a fourth surface on which the wafer is placed, wherein the third surface is coupled with the first surface. The second surface of the probe card is in contact with the test plate, and A wafer tester in which the fourth surface of the wafer chuck contacts the hot chuck.
In Article 14, The above probing disc is formed such that the wafer chuck and the probe card are combined in a state where the third surface of the wafer chuck faces in a direction opposite to the direction of gravity, and A wafer tester in which the probing disk is seated on the test plate while rotated so that the third surface faces the direction of gravity.
In Article 1, A cooler formed on the above test plate, and A hot chuck that contacts the probing disk and heats the wafer; comprising, A wafer tester in which the cooler is positioned in the direction of gravity with respect to the probing disk, and the hot chuck is positioned on the opposite side of the direction of gravity with respect to the probing disk.

Description

Wafer tester The present invention relates to a wafer tester, and more specifically, to a wafer tester capable of temperature control at the tester unit level. Generally, burn-in tests are conducted to evaluate the reliability and lifespan of chips manufactured on semiconductor wafers. A burn-in test is a method that applies thermal or electrical stress to a semiconductor chip to detect early failures or long-term defects. Conventionally, a method has primarily been applied in which multiple wafers are housed simultaneously in a single chamber, a specific temperature is set, and the wafers are collectively exposed to that thermal environment. In this case, since the set temperature conditions are applied uniformly to the entire chamber, it has been pointed out that granular control is difficult even if the temperature requirements for each wafer differ. For example, assuming that some wafers rapidly develop defects at high temperatures while others exhibit specific defects in a relatively low temperature range, it is difficult to implement both conditions simultaneously using the conventional single-chamber method. Consequently, performing tests requiring different temperature conditions entails the inconvenience of having to procure multiple pieces of equipment or conduct tests sequentially. Furthermore, when multiple wafers are placed in a single chamber, variations in actual temperature or heat distribution may occur depending on the location. This can be a factor that lowers the accuracy and reproducibility of test results, as it is difficult to assume that each wafer is placed under exactly the same conditions, even if the test is conducted at the same temperature. As such, due to temperature variation issues, it is difficult to conduct burn-in tests tailored to specific temperature profiles for each wafer, and performing multiple types of test conditions simultaneously inevitably leads to excessive increases in equipment costs and installation space. Therefore, a new structural and technical approach is required that can efficiently test multiple wafers while independently setting the temperature conditions required for each wafer. FIG. 1 is a perspective view of a wafer tester according to one embodiment of the present invention. FIG. 2 is an enlarged view illustrating a partial structure of a wafer tester according to one embodiment of the present invention. Figure 3 is a diagram illustrating the arrangement of the wafer interface and tester interface of a conventional probe card. FIG. 4 is a diagram illustrating the arrangement of the wafer interface and the tester interface of a probe card according to one embodiment of the present invention. FIG. 5 is an exploded view illustrating the coupling relationship between a probing disc, a hot chuck, and an upper plate according to one embodiment of the present invention. FIG. 6 is an exploded perspective view of a probing disk according to one embodiment of the present invention. FIG. 7 is an exploded view illustrating the coupling relationship between a probing disc, a hot chuck, and an upper plate according to one embodiment of the present invention. FIG. 8 is a front view illustrating the combined relationship of a probing disc, a hot chuck, and an upper plate according to one embodiment of the present invention. FIG. 9 is a cross-sectional view illustrating the appearance of a probing disk according to one embodiment of the present invention before assembly. FIG. 10 is a cross-sectional view illustrating the combination of a probe card and a wafer chuck of a probing disk according to another embodiment of the present invention. FIG. 11 is a cross-sectional view illustrating a rotated probing disk according to one embodiment of the present invention. FIG. 12 is a perspective view illustrating a lower plate of a wafer tester according to one embodiment of the present invention. FIG. 13 is a lower perspective view illustrating a hot chuck according to one embodiment of the present invention seated on a holder of a movable assembly. FIG. 14 is an enlarged cross-sectional view illustrating a portion of the structure of a hot chuck according to one embodiment of the present invention. FIG. 15 is a cross-sectional view showing an enlarged view of part A of FIG. 14. FIG. 16 is a cross-sectional view illustrating the probing disc coming into contact with a part of the structure of the hot chuck shown in FIG. 15. Hereinafter, embodiments of the present invention are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. In the drawings, parts unrelated to the explanation have been omitted to clearly explain the present invention, and the same reference numerals have been used for identical or similar components throughout the specification. The words and terms