KR-102961521-B1 - CHUCK FOR DIE LEVEL TESTING

Abstract

A chuck for die level testing may include a mobile chuck, a chuck base disposed below the mobile chuck and supporting the mobile chuck, and a temperature sensor unit disposed inside the mobile chuck.

Inventors

• 신병현
• 박기택
• 나준선
• 신진아

Assignees

• 주식회사 쎄믹스

Dates

Publication Date

20260507

Application Date

20250702

Priority Date

20241231

Claims (11)

1. Mobile Chuck; A chuck base comprising a body portion disposed below the mobile chuck and supporting the mobile chuck, and a lower electrode portion disposed on the upper surface of the body portion; and A temperature sensor unit comprising an upper electrode portion disposed inside the mobile chuck and adjacent to the lower surface of the mobile chuck, and A die level test chuck in which the lower electrode portion and the upper electrode portion come into contact with each other when the mobile chuck is placed on the chuck base.
2. In Article 1, The above temperature sensor unit is, A measuring part adjacent to the upper surface of the mobile chuck; and A chuck for die level testing further comprising a connecting line that electrically connects the upper electrode part and the measuring part.
3. In Article 2, The above chuck base is, A body portion positioned below the above-mentioned mobile chuck; A lower electrode portion disposed on the upper surface of the body portion; and A chuck for die level testing that further includes a power line connected to the lower electrode portion.
4. delete
5. In Article 1, The above mobile chuck is a chuck for die level testing that is placed directly on the upper surface of the chuck base.
6. A mobile chuck having a plurality of vacuum suction holes defined on the upper surface and supporting a plurality of dies; A chuck base positioned below the mobile chuck to support the mobile chuck; and It includes a temperature sensor unit disposed between the mobile chuck and the chuck base, and The above temperature sensor unit is a chuck for die level testing that measures the temperature caused by heat generated from the dies and conducted through the mobile chuck.
7. In Article 6, The above mobile chuck is, Plate; and It includes a mobile protrusion disposed on the lower surface of the plate and extending toward the chuck base, The above temperature sensor unit is a chuck for die level testing that contacts the mobile protrusion.
8. In Article 7, A base groove corresponding to the mobile protrusion is defined on the upper surface of the chuck base, and A die level test chuck in which the temperature sensor portion is disposed inside the base groove, and the mobile protrusion contacts the temperature sensor portion when the mobile protrusion is inserted into the base groove.
9. In Article 6, The above chuck base is, Body part; and It includes a base protrusion extending from the upper surface of the body portion toward the mobile chuck, and The above temperature sensor portion is a chuck for die level testing placed on the base protrusion.
10. In Article 9, The above mobile chuck is, A mobile groove corresponding to the base protrusion is defined on the lower surface, and A die level test chuck in which, when the mobile chuck is placed on the chuck base, the temperature sensor portion is placed within the mobile groove and contacts the inner surface of the mobile chuck defining the mobile groove.
11. In Article 6, The above temperature sensor unit is, Measurement unit; A power line positioned below the above-mentioned measuring unit; and A chuck for die level testing comprising an elastic part surrounding a portion of the power line.

Description

Chuck for die level testing The present invention relates to a chuck for die level testing. After the manufacturing process is completed, the quality of semiconductor devices is determined through electrical characteristic testing. During this process, the die under test is loaded into test equipment, and the test is performed through contact with each probe tip of a probe card. The probe tip contacts the electrode pad or solder bump of the die and determines electrical characteristics such as conduction status by applying a test signal to the electrical circuit connected to each electrode. When the die is inspected by the probe tip, the die may heat up. To prevent damage to the die, the temperature of the die can be measured and controlled by a temperature sensor. FIG. 1 is a perspective view of a chuck for die level testing according to one embodiment of the present invention. FIG. 2 is a cross-sectional view of a chuck for die level testing corresponding to the line I-I' shown in FIG. 1. FIG. 3 is a plan view of an inspection equipment including a chuck for die level testing shown in FIG. 1. FIGS. 4a to 4k are cross-sectional views illustrating the sorter chamber shown in FIG. 3. FIG. 5 is a plan view of the mobile chuck and dies shown in FIG. 4k. FIG. 6 is a plan view illustrating a mobile chuck being transported by a loader. Figure 7 is a cross-sectional view illustrating the testing of electrical characteristics of dies within a test chamber. FIG. 8a is a perspective view of a chuck for die level testing according to one embodiment of the present invention. FIG. 8b is a cross-sectional view corresponding to the line II-II' shown in FIG. 8a. FIG. 9a is a perspective view of a chuck for die level testing according to one embodiment of the present invention. FIG. 9b is a cross-sectional view corresponding to the line III-III' shown in FIG. 9a. Hereinafter, embodiments of the present invention are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts unrelated to the description in the drawings have been omitted, and the same reference numerals have been used throughout the specification for identical or similar components. The words and terms used in this specification and claims are not limited to their ordinary or dictionary meanings, but should be interpreted in a meaning and concept consistent with the technical spirit of the invention in accordance with the principles by which the inventor defines terms and concepts to best describe his invention. Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to preferred embodiments of the present invention and do not represent all technical ideas of the present invention; thus, various equivalents and modifications that may replace such configurations may exist at the time of filing the present invention. In the following description, descriptions of some components may be omitted to clarify the features of the present invention. In the following description, the term "connection" refers to one or more members being connected to each other in a manner that allows for fluid communication. In one embodiment, the connection may be formed by members such as a conduit, a pipe, or a piping system. In the following description, the term "connection" may be used interchangeably with the meaning that one or more members are "fluidly connected" to each other. In the following description, the term "conduction" means that one or more components are connected to each other to transmit current or electrical signals. In one embodiment, the conduction may be formed in a wired form by a conductor member, etc., or in a wireless form such as Bluetooth, Wi-Fi, or RFID. In one embodiment, the conduction may include the meaning of "communication." As used in the following description, the term "fluid" refers to any form of substance that flows due to an external force and whose shape or volume, etc., can be deformed. In one embodiment, the fluid may be a liquid such as water or a gas such as air. The terms "upper side," "lower side," "left side," "right side," "front side," and "rear side" used in the following description shall be understood by referring to the coordinate system depicted throughout the attached drawings. FIG. 1 is a perspective view of a chuck for die level testing according to one embodiment of the present invention. FIG. 2 is a cross-sectional view of a chuck for die level testing corresponding to the line I-I' shown in FIG. 1. Referring to FIGS. 1 and 2, a die level test chuck (1) may include a mobile chuck (11), a chuck base (12), and a temperature sensor unit (13). For example, the mobile chuck (11) may have a disc shape. The upper surface o