KR-102961522-B1 - CHUCK FOR DIE LEVEL TESTING

Abstract

A chuck for die level testing comprises a mobile chuck supporting a plurality of dies, a chuck base disposed below the mobile chuck and supporting the mobile chuck, and a heating unit disposed inside the mobile chuck and the chuck base, wherein the heating unit may include a heat source disposed inside the mobile chuck, an upper electrode electrically connected to the heat source and facing the upper surface of the chuck base, and a lower electrode disposed between the mobile chuck and the chuck base and in contact with the upper electrode.

Inventors

• 신병현
• 나준선
• 신진아

Assignees

• 주식회사 쎄믹스

Dates

Publication Date

20260507

Application Date

20250703

Priority Date

20241231

Claims (10)

1. Mobile chuck supporting multiple dies; A chuck base positioned below the mobile chuck to support the mobile chuck; and It includes a heating element disposed inside the mobile chuck and the chuck base, and The heating unit above is, A heat source disposed inside the mobile chuck above; An upper electrode electrically connected to the heat source and facing the upper surface of the chuck base; A lower electrode disposed between the mobile chuck and the chuck base and in contact with the upper electrode; and It includes an elastic part disposed below the lower electrode, and The above elastic member is a chuck for die level testing disposed inside a groove defined on the upper surface of the chuck base.
2. delete
3. In Article 1, When the mobile chuck is spaced apart from the chuck base, the lower electrode is positioned outside the groove, and A die level test chuck in which the lower electrode is disposed inside the groove when the mobile chuck is placed on the upper surface of the chuck base.
4. In Paragraph 3, A die level test chuck in which the elastic part is compressed when the mobile chuck is placed on the chuck base.
5. In Article 1, The above elastic member is a chuck for die level testing including a coil spring.
6. In Article 1, The heating unit above is, Connecting wiring connecting the upper electrode and the heat source to each other; and A chuck for die level testing that further includes a power line connected to the lower electrode.
7. In Article 1, The above mobile chuck is, Plate; and A chuck for die level testing comprising a coating layer disposed on the lower surface of the above plate.
8. In Article 1, It further includes a temperature sensor unit disposed between the mobile chuck and the chuck base, and The above temperature sensor unit is, A measuring unit disposed inside the above mobile chuck; An upper sensor electrode electrically connected to the above measuring unit and facing the chuck base; and It includes a lower sensor electrode disposed between the mobile chuck and the chuck base, and A die-level test chuck in which the upper sensor electrode and the lower sensor electrode come into contact with each other when the mobile chuck is placed on the chuck base.
9. In Article 8, The above temperature sensor unit is, A chuck for die level testing further comprising a sensor elastic member positioned below the lower sensor electrode.
10. In Article 1, A die level test chuck in which the upper electrode and the lower electrode come into contact with each other when the mobile chuck is placed on the chuck base.

Description

Chuck for die level testing The present invention relates to a chuck for die level testing. After the manufacturing process is completed, the quality of semiconductor devices is determined through electrical characteristic testing. During this process, the die under test is loaded into test equipment, and the test is performed through contact with each probe tip of a probe card. The probe tip contacts the electrode pad or solder bump of the die and determines electrical characteristics such as conduction status by applying a test signal to the electrical circuit connected to each electrode. When the die is inspected by a probe tip, the die may heat up. To prevent damage to the die, the die temperature can be measured by a temperature sensor. If the measured temperature is lower than or equal to a set temperature, the die temperature can be controlled. The die temperature can be controlled through a heating unit including a heater. FIG. 1 is a perspective view of a chuck for die level testing according to one embodiment of the present invention. FIGS. 2a and 2b are cross-sectional views of a chuck for die level testing corresponding to the line I-I' shown in FIG. 1. FIG. 3 is a plan view of an inspection equipment including a chuck for die level testing shown in FIG. 1. FIGS. 4a to 4k are cross-sectional views illustrating the sorter chamber shown in FIG. 3. FIG. 5 is a plan view of the mobile chuck and dies shown in FIG. 4k. FIG. 6 is a plan view illustrating a mobile chuck being transported by a loader. Figure 7 is a cross-sectional view illustrating the testing of electrical characteristics of dies within a test chamber. FIG. 8a is a perspective view of a chuck for die level testing according to one embodiment of the present invention. FIG. 8b is a cross-sectional view corresponding to the line II-II' shown in FIG. 8a. FIG. 9 is a cross-sectional view of a chuck for die level testing according to one embodiment of the present invention. Hereinafter, embodiments of the present invention are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts unrelated to the description in the drawings have been omitted, and the same reference numerals have been used throughout the specification for identical or similar components. The words and terms used in this specification and claims are not limited to their ordinary or dictionary meanings, but should be interpreted in a meaning and concept consistent with the technical spirit of the invention in accordance with the principles by which the inventor defines terms and concepts to best describe his invention. Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to preferred embodiments of the present invention and do not represent all technical ideas of the present invention; thus, various equivalents and modifications that may replace such configurations may exist at the time of filing the present invention. In the following description, descriptions of some components may be omitted to clarify the features of the present invention. In the following description, the term "connection" refers to one or more members being connected to each other in a manner that allows for fluid communication. In one embodiment, the connection may be formed by members such as a conduit, a pipe, or a piping system. In the following description, the term "connection" may be used interchangeably with the meaning that one or more members are "fluidly connected" to each other. In the following description, the term "conduction" means that one or more components are connected to each other to transmit current or electrical signals. In one embodiment, the conduction may be formed in a wired form by a conductor member, etc., or in a wireless form such as Bluetooth, Wi-Fi, or RFID. In one embodiment, the conduction may include the meaning of "communication." As used in the following description, the term "fluid" refers to any form of substance that flows due to an external force and whose shape or volume, etc., can be deformed. In one embodiment, the fluid may be a liquid such as water or a gas such as air. The terms "upper side," "lower side," "left side," "right side," "front side," and "rear side" used in the following description shall be understood by referring to the coordinate system depicted throughout the attached drawings. FIG. 1 is a perspective view of a chuck for die level testing according to one embodiment of the present invention. FIG. 2a and FIG. 2b are cross-sectional views of a chuck for die level testing corresponding to the line I-I' shown in FIG. 1. For example, in FIG. 2a, the mobile chuck is separated from the chuck base, and in FIG. 2b, the mobile chuck is p