KR-102961573-B1 - Cooling device for semiconductor switching elements using ferrofluid

Abstract

The present invention relates to a cooling device for a semiconductor switching device using a magnetic fluid, comprising: a main heat dissipation unit having one side surface in surface contact with the semiconductor switching device and having a main channel formed therein through which a magnetic fluid flows; an auxiliary heat dissipation unit branching from the main channel of the main heat dissipation unit and having an auxiliary channel through which a magnetic fluid flows; an electromagnet provided in the auxiliary heat dissipation unit adjacent to the auxiliary channel; a temperature sensor distributed around the semiconductor switching device to measure temperature; and a control unit that turns the electromagnet on/off according to the result measured by the temperature sensor.

Inventors

• 주성남
• 김민수
• 문태양
• 김유진
• 허준호

Assignees

• (주)인텍에프에이

Dates

Publication Date

20260507

Application Date

20251202

Claims (5)

1. A main heat dissipation unit having one side in surface contact with a semiconductor switching element and a main channel formed therein through which a magnetic fluid flows; An auxiliary heat dissipation unit branched from the main channel of the above-mentioned main heat dissipation unit and having an auxiliary channel formed through which a magnetic fluid flows; An electromagnet provided in the auxiliary heat dissipation unit adjacent to the above auxiliary channel; A temperature sensor distributed around the periphery of the semiconductor switching element to measure temperature; and A control unit that turns the electromagnet on/off according to the result measured by the temperature sensor; is included, A cooling device for a semiconductor switching element using a magnetic fluid, characterized in that a plurality of electromagnets are provided in an auxiliary heat dissipation unit along the auxiliary channel, and each electromagnet is individually turned on/off by the control unit.
2. In claim 1, the main channel is An inlet channel through which a magnetic fluid flows into the main heat dissipation unit; and A cooling device for a semiconductor switching device using magnetic fluid, characterized by including: an exhaust channel connected to the inlet channel and the Euro, through which magnetic fluid is discharged from the main heat dissipation unit.
3. In claim 2, the auxiliary channel is A cooling device for a semiconductor switching device using a magnetic fluid, characterized by connecting the above-mentioned inlet channel and outlet channel and arranging them in a straight line, curve, zigzag, radial, or a combination thereof.
4. In claim 2, the auxiliary channel is A cooling device for a semiconductor switching device using a magnetic fluid, characterized by forming independent flow paths in which the magnetic fluid is introduced and discharged in the inlet channel and the outlet channel, and each having an electromagnet provided in an auxiliary channel that forms the independent flow path.
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Description

Cooling device for semiconductor switching elements using ferrofluid The present invention relates to a cooling device for a semiconductor switching device using a magnetic fluid, and more specifically, to a cooling device for a semiconductor switching device using a magnetic fluid capable of measuring the temperature of a heat-generating part of the semiconductor switching device individually and controlling the flow of the magnetic fluid according to the measured temperature to cool the heat generation deviation of the heat-generating part in real time. Generally, power inverter devices that supply power to electrical equipment such as construction machinery and vehicles generate heat due to the operation of semiconductor switching elements; if this heat generation becomes excessive, the semiconductor switching elements suffer thermal damage, leading to failure. Accordingly, a cooling device is installed on the semiconductor switching device to absorb and release the heat generated by the semiconductor switching device. Such cooling devices can be classified, for example, into air-cooled and water-cooled types. In the air-cooled type, a heat dissipation outlet having a plurality of heat dissipation fins is brought into contact with a semiconductor switching device to dissipate heat generated from the semiconductor switching device to the outside through the heat dissipation fins, thereby cooling the device. Depending on the case, this air-cooled type may be equipped with a blower fan that supplies air toward the heat dissipation fins. In addition, for water cooling, a plurality of channels are formed inside a heat dissipation hole in contact with a semiconductor switching element, and cooling water is supplied to the channels so that the cooling water flows along the channels and exchanges heat with the semiconductor switching element to cool it. However, the air-cooled and water-cooled cooling devices described above have a structure in which the heat dissipation holes come into surface contact across the entire surface area of the heat-generating part of the semiconductor switching device to cool it, which presents a problem in that it cannot control the cooling of the heat variation in the heat-generating part in real time. FIG. 1 is a schematic diagram showing a cooling device for a semiconductor switching element using a magnetic fluid according to the present invention. FIG. 2 is a perspective view showing a cooling device for a semiconductor switching element using a magnetic fluid according to the present invention. FIG. 3 is a cross-sectional view showing a cooling device for a semiconductor switching device using a magnetic fluid according to the present invention. FIG. 4 is a cross-sectional view showing another embodiment of an electromagnet in a cooling device for a semiconductor switching device using a magnetic fluid according to the present invention. FIG. 5 is a cross-sectional view showing another embodiment of an auxiliary channel in a cooling device for a semiconductor switching device using a magnetic fluid according to the present invention. FIG. 6 is a side cross-sectional view showing another embodiment of an auxiliary channel in a cooling device for a semiconductor switching device using a magnetic fluid according to the present invention. Terms and words used in this specification and claims should not be interpreted as being limited to their ordinary or dictionary meanings, but should be interpreted in a meaning and concept consistent with the technical spirit of the invention, based on the principle that the inventor can appropriately define the concept of the terms to best describe their invention. Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings. FIG. 1 is a schematic diagram showing a cooling device for a semiconductor switching element using a magnetic fluid according to the present invention. Referring to the drawings, the cooling device according to the present invention comprises a main heat dissipation unit (100) having a main channel (110) through which a magnetic fluid flows, an auxiliary heat dissipation unit (200) having an auxiliary channel (210) branched from the main channel (110), an electromagnet (300) provided adjacent to the auxiliary channel (210), a plurality of temperature sensors (not shown) installed around a semiconductor switching element (10) to measure temperature, and a control unit (400) that turns the electromagnet (300) on/off according to the measurement results of the temperature sensors. According to this configuration, when the semiconductor switching element (10) operates and generates heat, a temperature sensor distributed around the semiconductor switching element (10) measures the temperature of the semiconductor switching element (10) in each zone, and based on this result, the control unit (400) operates the electromagnet (300) provided in the overheated zone to dra