KR-102961800-B1 - INSERT, BURN-IN BOARD COMPRISING SAME AND METHOD FOR GRIPPING ELECTRONIC COMPONENT

KR102961800B1KR 102961800 B1KR102961800 B1KR 102961800B1KR-102961800-B1

Abstract

The present invention relates to an insert, a burn-in board including the same, and a method for gripping an electronic component. Specifically, according to one embodiment of the present invention, an insert may be provided comprising: an insert base configured to allow an electronic component to be inserted; a gripping assembly supported on the insert base so as to be rotatable in a predetermined rotational axis direction, and including a support contact member for gripping the electronic component inserted in the insert base; and a pressing member supported on the insert base so as to be movable in an up-and-down direction by an external force, and pressing the gripping assembly on the opposite side of the support contact member when moving downward.

Inventors

손승표
박수창

Assignees

(주)테크윙

Dates

Publication Date: 20260508
Application Date: 20210723

Claims (9)

An insert base configured to allow electronic components to be inserted; A gripping assembly comprising a support contact for gripping the electronic component inserted into the insert base, and supported on the insert base so as to be rotatable in a predetermined rotational axis direction; and It is supported on the insert base so as to be movable in the up and down direction by an external force, and includes a pressing part that presses the gripping assembly on the opposite side of the support contact part when moving downward. The above-mentioned gripping assembly is, When the above-mentioned pressure member moves downward, the gripping assembly rotates in the forward direction so that the angle of inclination relative to the ground increases in the direction in which the support contact member moves upward, and when the above-mentioned pressure member moves downward, the gripping assembly rotates in the reverse direction so that the angle of inclination decreases. Insert.
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In Article 1, A further comprising an elastic body disposed between the insert base and the pressure member, which provides a restoring force to the pressure member in the direction in which the upper pressure member moves upward when the pressure member moves downward. Insert.
In Article 1, The above-mentioned gripping assembly is, A gripping body rotatably supported on the above insert base; and A gripping projection supported on the gripping body to be movable in a direction protruding from the gripping body, including the support contact member for gripping the side of the electronic component; and A gripping elastic member comprising a gripping body disposed between the gripping body and the gripping projection and providing a restoring force to the gripping projection in a direction protruding relative to the gripping body. Insert.
In Article 4, At the end of the above-mentioned gripping projection, An electronic component receiving groove is formed in a recess to contact the side of the electronic component so as to prevent the electronic component inserted in the above insert base from moving arbitrarily in the thickness direction. Insert.
In Article 5, The electronic component receiving groove has a shape extending in a direction perpendicular to the thickness direction and is formed so that the electronic component inserted into the insert base is placed in an upright position. The upright state of the above electronic component is a state in which the thickness direction is perpendicular to the vertical direction. Insert.
In Article 1, It further includes a guide pin that provides a projection having a shape protruding from the above-mentioned gripping assembly, and A guide groove is formed in the above-mentioned pressure part to guide the guide pin so that the guide pin moves relative to the pressure part in a direction perpendicular to the rotation axis and perpendicular to the up-and-down direction, and When the above-mentioned pressure part moves downward, the gripping assembly rotates relative to the pressure part around the guide pin, and the guide pin moves along the guide groove. Insert.
Base part; and It includes a plurality of inserts arranged in a grid pattern on the base portion, on which electronic components are mounted. The above insert is, An insert base configured to allow electronic components to be inserted; A gripping assembly comprising a support contact for gripping the electronic component inserted into the insert base, and supported on the insert base so as to be rotatable in a predetermined rotational axis direction; and It is supported on the insert base so as to be movable in the up and down direction by an external force, and includes a pressing part that presses the gripping assembly on the opposite side of the support contact part when moving downward. The above-mentioned gripping assembly is, When the above-mentioned pressure member moves downward, the gripping assembly rotates in the forward direction so that the angle of inclination relative to the ground increases in the direction in which the support contact member moves upward, and when the above-mentioned pressure member moves downward, the gripping assembly rotates in the reverse direction so that the angle of inclination decreases. Burn-in board.
Insertion step in which an electronic component is inserted into an insert base; A pressing step in which a pressing member supported on the insert base so as to be movable in the up-and-down direction by an external force presses the gripping assembly downward from the opposite side of the support contact member; and The method includes a gripping step in which, when the above external force is released, the pressurizing member is raised and lowered, and the support contact member included in the gripping assembly grips the electronic component inserted into the insert base. The above-mentioned gripping assembly is, When the above-mentioned pressure member moves downward, the gripping assembly rotates in the forward direction so that the angle of inclination relative to the ground increases in the direction in which the support contact member moves upward, and when the above-mentioned pressure member moves downward, the gripping assembly rotates in the reverse direction so that the angle of inclination decreases. Method for gripping electronic components.

Description

Insert, Burn-in Board Comprising Same, and Method for Gripping Electronic Components The present invention relates to an insert, a burn-in board including the same, and a method for gripping an electronic component. Generally, electronic components, such as semiconductor devices manufactured through a specified manufacturing process, undergo specific tests and are classified by grade based on the test results. These tests can be performed by electrically connecting the electronic components to an electronic component test device. For electronic components that have been electrically inspected using such a test device and deemed to be good, a burn-in test process for reliability verification may be performed. In this burn-in test process, defects in the electronic components are detected by applying thermal and electrical stresses to them. The electronic components are loaded onto a burn-in board for the burn-in test and the test is performed while seated in inserts provided on the board. Furthermore, after the test process is completed, the electronic components are unloaded from the inserts on the burn-in board and sorted according to the test results. As such, electronic components loaded into the inserts of a burn-in board need to be fixedly supported on the board until they are unloaded. However, while conventional burn-in boards are equipped with separate support devices to hold electronic components, these devices could only support components of a pre-set size. In other words, conventional support devices had a problem in that they could not accurately support electronic components of different sizes if their dimensions changed. FIG. 1 is a perspective view of a burn-in board according to one embodiment of the present invention. FIG. 2 is a perspective view of an insert according to one embodiment of the present invention. Figure 3 is an exploded view of the insert of Figure 2. Figure 4 is a cross-sectional view taken along A-A' of Figure 2. Figure 5 is a cross-sectional view showing the electronic component of Figure 4 being held. Figure 6 is a cross-sectional view showing the appearance of an electronic component that is wider than the electronic component of Figure 4 before being gripped. Figure 7 is a cross-sectional view showing the gripped electronic component of Figure 6. FIG. 8 is a cross-sectional view showing an electronic component that is wider than the electronic component of FIG. 7 being held by a gripping assembly in a state where the gripping assembly is rotated at a predetermined angle. FIG. 9 is a flowchart schematically illustrating a method for gripping electronic components according to one embodiment of the present invention. Hereinafter, specific embodiments for implementing the technical concept of the present invention will be described in detail with reference to the drawings. In addition, in describing the present invention, if it is determined that a detailed description of related known components or functions may obscure the essence of the invention, such detailed description is omitted. Furthermore, when it is mentioned that one component is 'connected', 'supported', 'grasped', or 'pressed' to another component, it should be understood that while it may be directly connected, supported, grasped, or pressed to that other component, there may also be other components present in between. The terms used in this specification are used merely to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. Additionally, terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but such components are not limited by such terms. These terms are used solely for the purpose of distinguishing one component from another. The meaning of "comprising" as used in the specification is to specify certain characteristics, regions, integers, steps, actions, elements, and/or components, and does not exclude the existence or addition of other specific characteristics, regions, integers, steps, actions, elements, components, and/or groups. In addition, it should be noted in advance that expressions such as upward, downward, forward, and rear in this specification are described based on the drawings, and may be expressed differently if the direction of the object changes. Meanwhile, in this specification, the upward direction is defined as the +z direction shown in FIG. 2, the downward direction as the -z direction, the forward direction as the +y direction, and the rear direction as the -y direction. Accordingly, the +x direction is defined as the right direction, and the -x direction as the left direction. Hereinafter, the specific configuration of a burn-in board (1) according to an embodiment of the present invention will be described with reference to the drawings. Referring to FIGS. 1 to 3 below, a burn-in board (1) according to one