KR-102961831-B1 - Device for semiconductor testing

KR102961831B1KR 102961831 B1KR102961831 B1KR 102961831B1KR-102961831-B1

Abstract

A connection device for testing semiconductors is disclosed. A connection device for testing semiconductors according to one aspect of the present invention may include: a first spring wound so as to be spaced apart from each other; a second spring extending from one side of the first spring, wound so as to be in contact with each other, and connected to a substrate for testing semiconductors; and a third spring extending from the other side of the first spring, wound so as to be in contact with each other, and in contact with the semiconductor.

Inventors

전진국
표은형
이수호

Assignees

주식회사 오킨스전자

Dates

Publication Date: 20260507
Application Date: 20231214

Claims (6)

A semiconductor test device comprising a housing on which a semiconductor is mounted so as to be tested, a semiconductor test substrate disposed on the lower side of the housing, and a semiconductor test connection device that electrically connects the semiconductor and the semiconductor test substrate, The above-mentioned connection device for semiconductor testing is, A first spring wound so as to be spaced apart from each other; A second spring extending from one side of the first spring, wound to come into contact with one another, connected to the semiconductor test substrate, and having an outer diameter smaller than the outer diameter of the first spring; and A third spring extending from the other side of the first spring, wound to come into contact with one another, in contact with the semiconductor, and having an outer diameter smaller than the outer diameter of the first spring; Includes, The above housing includes a first unit housing disposed on one side of the first spring and a second unit housing disposed on the other side of the first spring and coupled with the first unit housing. In the above housing, A first receiving groove that accommodates the first spring and guides the first spring when the first spring moves due to elastic force; A second receiving groove that accommodates the second spring, guides the second spring when it moves by elastic force, and is formed with a step, having an inner diameter smaller than the inner diameter of the first receiving groove to restrict the movement of the first spring; and A third receiving groove that accommodates the third spring, guides the third spring when it moves due to elastic force, and is formed with a step, having an inner diameter smaller than the inner diameter of the first receiving groove, so as to restrict the movement of the first spring; This is provided, A semiconductor test device in which a portion of the other side of the second spring and a portion of the one side of the third spring are received in the first receiving groove.
In Article 1, One side of the first spring is formed to be inclined at a first angle with respect to the outer surface of the second spring, and A semiconductor test device in which the other side of the first spring is formed to be inclined at a second angle with respect to the outer surface of the third spring.
In Article 2, A semiconductor test device in which the first angle and the second angle are identical.
delete
In Article 1, A portion of the first spring is spaced apart from each other at a first interval, and A semiconductor test device in which another part of the first spring is spaced apart from each other by a second interval.
In Article 5, A semiconductor test device in which the first interval and the second interval are identical.

Description

Semiconductor testing device The present invention relates to a connection device for semiconductor testing, and more specifically, to a connection device for semiconductor testing in which the reliability of the semiconductor connection is improved. Generally, BGA (ball grid array) type semiconductors undergo various electrical tests by semiconductor test devices. In other words, these test devices inspect whether the electrical characteristics of the semiconductor fall below standards. At this time, a test connection device is used to electrically connect the printed circuit board of the semiconductor test device and the semiconductor. These test connection devices are configured in multiple units, and the multiple test connection devices individually contact the multiple contact balls of the semiconductor. Recently, as the spacing between the multiple contact balls has narrowed, there is a need to reduce the size of the multiple test connection devices so that they individually contact the multiple contact balls. FIG. 1 is a perspective view showing the external appearance of a semiconductor test device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing a semiconductor test device according to an embodiment of the present invention. FIG. 3 is a drawing focusing on a semiconductor test connection device mounted on a semiconductor test device according to an embodiment of the present invention. FIG. 4 is a perspective view showing a connection device for semiconductor testing according to an embodiment of the present invention. FIG. 5 is a side view showing a connection device for semiconductor testing according to an embodiment of the present invention. Hereinafter, embodiments of the present invention are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts unrelated to the description in the drawings have been omitted, and the same reference numerals have been used throughout the specification for identical or similar components. The words and terms used in this specification and claims are not limited to their ordinary or dictionary meanings, but should be interpreted in a meaning and concept consistent with the technical spirit of the invention in accordance with the principles by which the inventor defines terms and concepts to best describe his invention. Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to preferred embodiments of the present invention and do not represent all technical concepts of the present invention; thus, various equivalents and modifications that may replace such configurations may exist at the time of filing the present invention. In this specification, terms such as “comprising” or “having” are intended to describe the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should not be understood as precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. The statement that a component is "in front," "rear," "upper," or "lower" of another component includes, unless there are special circumstances, not only being positioned "in front," "rear," "upper," or "lower" in direct contact with the other component, but also cases where another component is positioned in between. Furthermore, the statement that a component is "connected" to another component includes, unless there are special circumstances, not only being directly connected to each other, but also being indirectly connected to each other. Hereinafter, a connection value for semiconductor testing according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing the exterior of a semiconductor test device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a semiconductor test device according to an embodiment of the present invention. Referring to FIGS. 1 and 2, a semiconductor test device (10) according to an embodiment of the present invention includes a housing (11), a substrate for semiconductor testing (12), and a connection device (100) for semiconductor testing. A semiconductor (20) is mounted on the upper side of the housing (11). Here, the semiconductor is a BGA (ball grid approx.) type semiconductor. The semiconductor test device (10) tests the electrical characteristics of the semiconductor (20). The above semiconductor test substrate (12) is placed on the lower side of the housing (11). Here, the semiconductor test substrate (12) may be a printed circuit board (PCB). The above-describ