KR-102961909-B1 - A curable circuit board for vehicle daylight lamps with improved restoration properties
Abstract
The present invention relates to a substrate that transmits electrical and electronic signals to a plurality of LED elements (L) by being mounted adjacent to the bottom of a reflector (1) of a vehicle daytime running light lamp, and as a feature of its configuration, a coverlay plate (10) in which a polyimide film (PI) (11) and a halogen-free adhesive (13) are sequentially laminated adjacent to the bottom of the reflector (1); and a copper clad laminate (CCL; Copper Clad Laminate) (20) in which a copper foil (21), a halogen-free adhesive (23), and a polyimide film (PI-Base) (25) are sequentially laminated adjacent to the bottom of the coverlay plate (10). It is characterized by comprising a hardenability sheet (30) that is laminated below the copper clad laminate (CCL; Copper Clad Laminate) (20) to limit the resilience of the coverlay plate (10) and the copper clad laminate (CCL; Copper Clad Laminate) (20) and maintain the shape. Accordingly, the present invention improves the shape recovery properties of existing flexible printed circuit boards, making it possible to produce a circuit board that captures the flexible advantages of flexible printed circuit boards and changes after bending operations. Furthermore, due to the curing characteristics of the curable sheet during bending, it can prevent the circuit board from returning to its original state by capturing the properties of shape recovery after bending, thereby simplifying assembly with the curved mechanism and improving work efficiency. In particular, by using a material that possesses the flexible advantages of flexible printed circuit boards, is resistant to shock and vibration with an integrated circuit and communication line structure, and has curable properties after curing, it has the effect of securing mechanical stability when designing a bending structure.
Inventors
- 최상인
- 박정권
Assignees
- 세운물산주식회사
- 주식회사 코젼트솔루션
Dates
- Publication Date
- 20260512
- Application Date
- 20240627
Claims (5)
- In a substrate that transmits electrical and electronic signals to a plurality of LED elements (L) by mounting it adjacent to the bottom of a reflector (1) of a vehicle daytime running light lamp: A coverlay plate (10) having a polyimide film (PI) (11) and a halogen-free adhesive (13) sequentially laminated so as to be adjacent to the lower side of the above-mentioned reflector (1); Copper Clad Laminate (CCL) (20) in which a copper foil (21), a halogen-free adhesive (23), and a polyimide film (PI-Base) (25) are sequentially laminated so as to be adjacent to the lower side of the above coverlay plate (10); and A hardenability sheet (30) is provided to be laminated below the copper clad laminate (CCL; Copper Clad Laminate) (20) to limit the restorability of the coverlay plate (10) and the copper clad laminate (CCL; Copper Clad Laminate) (20) and to maintain the shape; A curable circuit board for a vehicle daytime running light lamp with improved restoration, characterized in that the above coverlay plate (10), copper clad laminate (20), and curable sheet (30) are formed in a vacuum quick press under conditions of a temperature of 160 to 180°C, a processing time of 1 to 2 minutes, a pressure of 1 to 2 MPa, and a vacuum time of 10 to 30 seconds, and then formed in an oven cure under conditions of a temperature of 140°C and a processing time of 60 minutes to be integrally combined, or formed in a multi-stage press under conditions of a temperature of 160°C, a processing time of 60 minutes, and a pressure of 3 MPa.
- In paragraph 1, A curable circuit board for a vehicle daytime running light lamp with improved restoreability, characterized in that the above coverlay plate (10) is composed of a polyimide film (PI) (11) 12.5 μm and a halogen-free adhesive (13) 25 μm, with a total thickness of approximately 37.5 ± 3 μm.
- In paragraph 1, The above copper foil laminate (20) is characterized by being composed of a copper foil (21) of 35 μm, a halogen-free adhesive (23) of 10 μm, and a polyimide film (25) of 25 μm, with a total thickness of approximately 70 ± 5 μm, and is a curable circuit board for a vehicle daytime running light lamp with improved restoration.
- In paragraph 1, The above-mentioned curable sheet (30) is characterized by being made of one of the materials selected from epoxy, glass epoxy, urethane, and acrylic, and having a total thickness of approximately 25 μm ± 4 μm, thereby improving the resilience of the curable circuit board for a vehicle daytime running light lamp.
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Description
A curable circuit board for vehicle daylight lamps with improved restoration properties The present invention relates to a curable circuit board for a daytime running light lamp, and more specifically, to a curable circuit board for a vehicle daytime running light lamp that improves the shape recovery properties of a flexible printed circuit board currently in use, thereby enabling the production of a circuit board that captures the flexible advantages of a flexible printed circuit board and changes after bending, and prevents the original state from returning due to the curing characteristics of the curable sheet during bending, thereby simplifying assembly with a curved mechanism and improving work efficiency. In particular, it relates to a curable circuit board for a vehicle daytime running light lamp that possesses the flexible advantages of a flexible printed circuit board, is resistant to shock and vibration with an integrated circuit and communication line structure, and uses a material that has curable properties after curing to ensure mechanical stability when designing a bending structure. Recently, with the trend toward integration, miniaturization, thinning, high density, and high flexibility of electronic products, the need for printed circuit boards that can be easily embedded even in confined spaces has increased. In response to these market demands, flexible printed circuit boards capable of miniaturization and high density, as well as repetitive flexibility, have been developed. The demand for these flexible printed circuit boards is increasing further as their use is rapidly growing due to technological advancements in smartphones, portable mobile electronic devices (smartwatches, smart glasses, etc.). In particular, the use of eco-friendly LED lighting has recently been increasing in terms of luminous efficiency and lifespan. Lamps utilizing LEDs as light sources, which generate high efficiency with low power consumption, are gaining popularity, especially in the automotive sector. Basically, automotive lamps are used as headlamps, day running lights, and rear combination lamps to ensure visibility in the front and rear, as well as visibility during daytime driving; this requires high-intensity LED lamps. Since these high-intensity LED light sources release 70–80% of the input energy as heat, it is necessary for high-intensity LED lamps to effectively dissipate the generated heat. If the generated heat is not effectively dissipated, the rising temperature interferes with the normal operation of LED elements, increases the failure rate of components, and reduces luminous efficiency and lifespan. Furthermore, it can cause damage to mechanical parts and malfunctions due to thermal stress or thermal expansion. Accordingly, in order to manufacture LED headlamps with excellent heat dissipation characteristics, the use of high-efficiency LED chips and circuit boards with excellent heat dissipation characteristics is required. In addition, there are attempts to use flexible printed circuit boards (FPCBs) capable of implementing three-dimensional designs as circuit boards for application in vehicle exterior LED lamps. In this case, flexible copper clad laminates (FCCLs) with excellent heat dissipation characteristics are required. In this regard, prior art such as Korean Published Patent Application No. 10-2017-0099723 (Prior Art 1) and Korean Published Patent Application No. 10-2017-0099725 (Prior Art 2) is proposed. Prior art document 1 presents a flexible copper foil laminate for a vehicle LED lamp, wherein a copper foil layer and a composite polyimide layer are laminated, the composite polyimide layer comprises a polyimide layer and a plurality of thermoplastic polyimide layers, the outermost layer of the composite polyimide layer is composed of a thermoplastic polyimide layer, and with respect to the total thickness of the composite polyimide layer, the total thickness of the plurality of thermoplastic polyimide layers is 10 to 50%, the total thickness of the polyimide layer is 50 to 90%, the thickness of the copper foil layer is 30 to 80 μm, and the total thickness of the composite polyimide layer is 10 to 15 μm. Prior art document 2 presents a flexible copper foil laminate in which a first copper foil layer, a composite polyimide layer, and a second copper foil layer are sequentially laminated, wherein the composite polyimide layer comprises a polyimide layer and a plurality of thermoplastic polyimide layers, and the outermost layer of the composite polyimide layer is composed of a thermoplastic polyimide layer, wherein, with respect to the total thickness of the composite polyimide layer, the total thickness of the plurality of thermoplastic polyimide layers is 15 to 50%, the thickness of the polyimide layer is 50 to 85%, the thickness of the first copper foil layer and the second copper foil layer is 30 to 80 μm each, and the total thickness of the composite polyimide layer is 40 to 60 μm