KR-102962115-B1 - BONDING MACHINE BOND HEAD HAVING SIX DEGREES OF FREEDOM

KR102962115B1KR 102962115 B1KR102962115 B1KR 102962115B1KR-102962115-B1

Abstract

A bonding head having a bonding tool for bonding electronic components includes a rotary motion mechanism and a linear positioning mechanism coupled to the rotary motion mechanism. The rotary motion mechanism operates to rotate the bonding tool to adjust the angular orientation of the electronic component held by the bonding tool. The rotary motion mechanism includes a rotation assembly that operates to rotate the bonding tool around a first rotation axis and a bending rotation table that operates to rotate the bonding tool around a second and third rotation axis, respectively, wherein the first, second, and third rotation axes are orthogonal to each other. The linear positioning mechanism operates to drive the bonding tool to move parallel to the first rotation axis and along a first plane parallel to a second plane where the second and third rotation axes are located, in order to adjust the position of the electronic component.

Inventors

막 쿠옥 항
가우네카르 아지트 쉬리만
유 츠 킷
콴 카 싱

Assignees

에이에스엠피티 싱가포르 피티이. 엘티디.

Dates

Publication Date: 20260511
Application Date: 20240923
Priority Date: 20230927

Claims (17)

As a bonding head for a bonding machine having a bonding tool for bonding electronic components, A rotational motion mechanism comprising a combined rotational assembly and a bending rotational table, which operates to rotate the bonding tool to adjust the angular orientation of an electronic component held by the bonding tool, The rotational assembly operates to rotate the bonding tool around a first rotation axis, and the bending rotation table operates to rotate the bonding tool around respective second and third rotation axes, wherein the first, second, and third rotation axes are orthogonal to each other, the rotational motion mechanism; and It includes a linear positioning mechanism coupled to the above-mentioned rotational motion mechanism and operating to drive the bonding tool to move parallel to the first rotation axis as well as along a first plane parallel to the second plane where the second and third rotation axes are located, A bonding head comprising a plurality of bending joints arranged symmetrically with respect to the second and third rotation axes on the second plane, thereby enabling the bonding tool to rotate about the second and third rotation axes.
In claim 1, the rotating assembly or the bending rotating table is a bonding head that is directly coupled to the bonding tool.
A bonding head according to claim 1, wherein the bending rotary table comprises a first rotatable stage, a second rotatable stage and a base plate, a first bending joint coupled between the first rotatable stage and the base plate to allow the first rotatable stage to rotate about the second rotation axis, and a second bending joint coupled between the first and second rotatable stages to allow the second rotatable stage to rotate about the third rotation axis.
In paragraph 3, the bonding head comprises a first pair of bending hinges arranged on opposite sides of the first rotatable stage between the first rotatable stage and the base plate, such that the first bending joint is operable to bend synchronously about the second rotation axis.
In claim 4, the bonding head comprises a second pair of bending hinges arranged on the sides opposite to the second rotatable stage between the first and second rotatable stages, such that the second bending joint is operable to bend synchronously about the third rotation axis.
In paragraph 5, each bending hinge comprises a bonding head including two cross plate springs.
In claim 5, a bonding head in which the line passing through the first pair of bending hinges is perpendicular to the line passing through the second pair of bending hinges.
In claim 7, the linear positioning mechanism is configured to drive the bonding tool to move along the first plane in a first linear motion axis and a second linear motion axis, and the first and second linear motion axes are each positioned at an angle of 45° with respect to the second and third rotation axes, a bonding head.
In paragraph 3, the rotational motion mechanism further comprises a first drive system, the first drive system being installed on the base plate of the bending rotation table and bonding head coupled to the first arm protruding from the first rotatable stage by an elastic member to provide force to the first arm to rotate the first rotatable stage around the first bending joint.
In claim 9, the rotational motion mechanism further comprises a second drive system, the second drive system being installed on the first rotatable stage and bonding head being coupled to the second arm protruding from the second rotatable stage by an elastic member to provide force to the second arm to rotate the second rotatable stage around the second bending joint.
In claim 10, the bonding head comprises an elastic member including a pair of pre-loaded expansion springs.
In claim 10, a bonding head comprising, wherein at least one of the first and second drive systems comprises a cam drive assembly comprising an eccentric cam and a rotary motor coupled to the first and/or second arm.
In paragraph 12, the rotational motion mechanism further comprises a rotational encoder integrated with the rotational motor to measure the angular displacement of the rotational motor, the angular displacement being then used to determine the corresponding linear displacement of the eccentric cam, a bonding head.
In paragraph 3, the bending rotary table comprises a bonding head having a hollow section sized to accommodate and mount the rotary assembly and to connect the bonding tool to the rotary motion mechanism.
In claim 1, the linear positioning mechanism comprises a first linear motion assembly, a second linear motion assembly disposed on the first linear motion assembly, and a third linear motion assembly disposed on the second linear motion assembly, wherein the first, second, and third motion assemblies each drive the bonding tool to move along three orthogonal axes in a Cartesian coordinate system, a bonding head.
A bonding machine comprising a bonding head having a bonding tool for bonding electronic components, The bonding head above is, A rotational motion mechanism that operates to rotate the bonding tool to adjust the angular orientation of an electronic component held by the bonding tool, wherein the rotational motion mechanism comprises a rotational assembly that operates to rotate the bonding tool around a first rotational axis and a bending rotational table that operates to rotate the bonding tool around respective second and third rotational axes, wherein the first rotational axis is orthogonal to the second and third rotational axes; and It includes a linear positioning mechanism coupled to the above-mentioned rotational motion mechanism and operating to drive the bonding tool to move parallel to the first rotation axis, as well as along a first plane parallel to the second plane where the second and third rotation axes are located, and A bonding machine, wherein the bending rotary table comprises a plurality of bending joints arranged symmetrically with respect to the second and third rotation axes on the second plane, thereby enabling the bonding tool to rotate about the second and third rotation axes.
A method for manufacturing an electronic package including electronic components bonded to the surface of an electronic package using a bonding tool, A step of rotating the bonding tool around a first rotation axis using a rotational motion mechanism to adjust the angular orientation of the electronic component held by the bonding tool; A step of rotating the bonding tool around at least one of the second and third rotation axes using a bending rotation table, wherein the first rotation axis is orthogonal to the second and third rotation axes, and the bending rotation table includes a plurality of bending joints arranged symmetrically with respect to the second and third rotation axes on a second plane, thereby enabling the bonding tool to rotate around the second and third rotation axes; A step of moving the bonding tool along a first plane parallel to the first rotation axis and parallel to the second plane where the second and third rotation axes are located, using a linear positioning mechanism coupled to the rotational motion mechanism; and A method comprising the step of bonding the electronic component to the surface using the bonding tool.

Description

Bonding Machine Bond Head Having Six Degrees of Freedom The present invention relates to a bonding head of a bonding device or machine having 6 degrees of freedom (DOF), and in particular to such a bonding head incorporating a tip-tilt mechanism enabling 6 DOF, a bonding machine comprising said bonding head, and a bonding method utilized by said bonding head. Adhesive bonding is a critical packaging process in the manufacturing of electronic devices, and this technology has been widely used to electrically connect electronic components using adhesives. The quality of adhesive bonding plays a critical role in the thermal performance, reliability, and lifespan of electronic devices. For example, the thickness, uniformity, and coverage of the adhesive layer must be well controlled during the bonding process to ensure the performance of the electronic device. The quality of such adhesive-based bonding can be affected by variations in geometric features occurring at the mating surfaces between the electronic components and the base members to be joined or connected. Strict tolerances for the dimensions and geometric features of electronic components are typically implemented to minimize any excessive variation. However, this is not a cost-effective approach, and sometimes it is not feasible to find technical solutions to achieve such strict tolerances. In particular, the miniaturization of electronic devices demands much higher accuracy and precision to meet the strict tolerances required for electronic assembly. This makes the bonding process more challenging, and consequently, improved processes and equipment are required to cope with excessive variations and imperfections in the geometric features of electronic components used in electronic assembly. In conventional technology, various bonding machines have been specifically designed to automate the adhesive bonding process to ensure quality. In these machines, conventional bonding heads are designed to adjust the orientation and position of electronic components along three orthogonal linear motion axes and one rotational axis. However, these conventional 4-axis bonding heads do not possess sufficient degrees of freedom to adjust the orientation of electronic components in three dimensions before placement to ensure accurate bonding to the base member. Essentially, conventional 4-axis bonding heads lack two degrees of freedom: the tip direction and the tilt direction. The lack of the ability to adjust the bonding head in the tip and tilt directions can lead to poor coplanarity between the two mating surfaces. Consequently, the load applied by the bonding head during the bonding process may not be uniformly distributed to the adhesive sandwiched between the mating surfaces, resulting in the adhesive failing to evenly cover the designated bonding area. As a result, partial coverage and uneven thickness of the adhesive layer can occur in bonded electronic assemblies, and ultimately, this will significantly reduce the heat dissipation, reliability, and lifespan of the electronic device. Therefore, it would be beneficial to provide a greater degree of freedom to adjust the orientation of electronic components before they are bonded. Accordingly, the object of the present invention is to provide a more effective and cost-effective solution for adjusting the orientation of electronic components in three-dimensional space to compensate for changes in the geometric features of electronic components that may affect the parallelism between matching surfaces. Such a solution can dramatically reduce the dependence of assembly accuracy on the geometric tolerances of electronic components. According to a first aspect of the present invention, a bonding head for a bonding machine having a bonding tool for bonding electronic components is provided. The bonding head includes a rotational motion mechanism that operates to rotate the bonding tool to adjust the angular orientation of an electronic component held by the bonding tool. The rotational motion mechanism includes a rotational assembly that operates to rotate the bonding tool around a first rotational axis and a bending rotational table that operates to rotate the bonding tool around a second and third rotational axis, respectively, wherein the first, second, and third rotational axes are orthogonal to each other; and, the bonding tool includes a linear positioning mechanism coupled to the rotational motion mechanism and operated to drive the bonding tool to move parallel to the first rotational axis as well as along a first plane parallel to a second plane in which the second and third rotational axes are located. The linear positioning mechanism may be used to adjust the position of an electronic component held by the bonding tool along three axes of a Cartesian coordinate system. With this bonding head, the orientation of electronic components held by the bonding tool of the head can be adjusted around three rotation