KR-102962160-B1 - Laminate for transparent conductive film, transparent conductive film, and method for manufacturing transparent conductive film

KR102962160B1KR 102962160 B1KR102962160 B1KR 102962160B1KR-102962160-B1

Abstract

The present invention provides a laminate for a transparent conductive film that is thin, has excellent heat resistance, allows the process film to be easily peeled off, and has good characteristics. The laminate for a transparent conductive film is a laminate for a transparent conductive film used to form a transparent conductive film, and comprises a process film and a cured resin layer in this order, wherein the cured resin layer is a layer formed of a cured product of a curable resin composition containing a polymer component (A) and a curable monomer (B), the absolute value of the thermal deformation rate of the cured resin layer by raising the temperature to 150°C is 1.2% or less, and the thickness of the cured resin layer is 20 μm or less, the process film has a first surface on which a peeling layer may be formed and a second surface on which a peeling layer is not formed, and the cured resin layer is formed on the second surface of the process film.

Inventors

기노시타 히로키
나가나와 사토시

Assignees

린텍 가부시키가이샤

Dates

Publication Date: 20260507
Application Date: 20210326
Priority Date: 20200327

Claims (9)

As a laminate for a transparent conductive film used to form a transparent conductive film, A process film and a cured resin layer are provided in this order, and The above-mentioned cured resin layer is a layer composed of a cured product of a curable resin composition containing a polymer component (A) and a curable monomer (B), and The absolute value of the thermal deformation rate of the above-mentioned cured resin layer due to a temperature increase of 150°C is 1.2% or less, and The thickness of the above-mentioned cured resin layer is 20 μm or less, and The above process film has a first surface on which a release layer may be formed and a second surface on which a release layer is not formed, The above cured resin layer is formed on a second surface of the process film, and A laminate for a transparent conductive film, wherein the glass transition temperature of the above polymer component (A) is 250°C or higher.
In Article 1, A laminate for a transparent conductive film, wherein the glass transition temperature of the above polymer component (A) is 290°C or higher.
In Article 1 or Article 2, A laminate for a transparent conductive film, wherein the weight average molecular weight of the above polymer component (A) is 100,000 or more.
In Article 1 or Article 2, A laminate for a transparent conductive film, wherein the above polymer component (A) is a polyimide resin.
In Article 4, The above polyimide resin is a laminate for a transparent conductive film that is soluble in methyl ethyl ketone.
In Article 4, The above polyimide resin is a laminate for a transparent conductive film having a fluoro group in its molecule.
In Article 1 or Article 2, A laminate for a transparent conductive film having a fracture elongation of 2.5% or more of the above-mentioned cured resin layer.
A transparent conductive film having a laminate for a transparent conductive film as described in claim 1 or 2, and a transparent conductive layer formed on the cured resin layer of the laminate for a transparent conductive film.
A method for manufacturing a transparent conductive film, comprising: a process of forming a conductive material layer on a cured resin layer of a laminate for a transparent conductive film described in claim 1 or 2; and a process of heating the conductive material layer to 140°C or higher to form a transparent conductive layer.

Description

Laminate for transparent conductive film, transparent conductive film, and method for manufacturing transparent conductive film The present invention relates to a laminate for a transparent conductive film used to form a transparent conductive layer, a transparent conductive film using the same, and a method for manufacturing a transparent conductive film. Transparent conductive films are used in liquid crystal displays, EL (electroluminescence) displays, EC (electrochromic) displays, solar cells, electronic shielding films for electronic shields, transparent touch panels, and film sensors, such as those in which a transparent conductive layer is formed on the surface of a substrate film. In the manufacturing process of transparent conductive films, processing is often carried out under harsh conditions involving heating, such as sputtering of metal compounds and subsequent annealing. For this reason, high heat resistance is required for the laminate that serves as the substrate on which the transparent conductive layer is formed. Therefore, it is possible to solve this problem by using a laminate containing a film formed using a high heat-resistant resin such as polyimide resin (e.g., a resin with a glass transition temperature of 250°C or higher). In addition, recently, there is a demand to reduce the thickness of high-heat-resistant resin films for purposes such as improving transparency or flexibility or reducing weight. For example, prior art 1 discloses a polyimide resin that is soluble in solvents and can produce a highly transparent film by a solution casting method. FIG. 1 is a schematic cross-sectional view showing an example of the configuration of a laminate for a transparent conductive film related to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing an example of the configuration of a transparent conductive film related to an embodiment of the present invention. Figure 3 is a process diagram showing an example of a method for manufacturing a laminate for a transparent conductive film. Figure 4 is a process diagram showing an example of a method for manufacturing a transparent conductive film. In this specification, the description “XX ~ YY” means “XX or more and YY or less.” In this specification, for example, “(meth)acrylic acid” refers to both “acrylic acid” and “methacrylic acid,” and other similar terms are used. Hereinafter, a laminate for a transparent conductive film related to an embodiment of the present invention will be described. 1. Laminate for transparent conductive film A laminate for a transparent conductive film related to an embodiment of the present invention comprises a process film and a cured resin layer in this order. The cured resin layer is a layer formed from a cured product of a curable resin composition containing a polymer component (A) and a curable monomer (B), and has an absolute value of thermal deformation rate of 1.2% or less upon heating to 150°C, and a thickness of 20 μm or less. Additionally, the process film has a first surface, and a release layer may or may not be formed on the first surface. The cured resin layer is formed on a second surface opposite to the surface of the process film having the release layer, and a release layer is not formed on the second surface. As a result of careful examination by the inventors, the following matters have been discovered: (i) obtaining a curable resin layer from a curable resin composition containing a polymer component (A) and a curable monomer (B); and (ii) forming the curable resin layer on a surface of a process film that does not have a release layer, thereby allowing the curable resin composition to be applied well onto the process film and the curable resin layer to be formed well, and even if the curable resin layer is formed with a thickness of 10 μm or less, the curable resin layer can be easily peeled off from the process film. In addition, (iii) by making the thermal deformation rate of the curable resin layer 1.2% or less when heated to 150°C, the curable resin layer can withstand the thermal load when forming a transparent conductive layer on the curable resin layer, thus preventing deformation of the curable resin layer. As a result, the deterioration of the performance of the transparent conductive layer is suppressed, and a transparent conductive film having good characteristics is obtained. Hereinafter, for the sake of ease of understanding, the composition of each layer or film will be described by appropriately referring to the drawings or using the symbols shown in the drawings, but the present invention is not limited to the embodiments illustrated. A specific configuration example of a laminate for a transparent conductive film related to an embodiment of the present invention is shown in FIG. 1. The laminate (10A) for a transparent conductive film shown in FIG. 1 (a) has a process film (1) on one side of a cured resin layer (2). As described later