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KR-102962254-B1 - Jig for clamping, method for manufacturing a jig for clamping, and cleaning device

KR102962254B1KR 102962254 B1KR102962254 B1KR 102962254B1KR-102962254-B1

Abstract

A clamping jig according to the present disclosure comprises a support portion, a gripping portion located at one end of the support portion and gripping the outer periphery of a substrate, and a base located at the other end of the support portion and supporting the support portion. At least the base comprises ceramics having silicon carbide as the main component. The upper main surface of the base has a smaller average value of the cutting level difference (Rδcl), which represents the difference between the cutting level at a load length ratio of 25% and the cutting level at a load length ratio of 75% in the roughness curve along the longitudinal direction of the base, than the lower main surface of the base.

Inventors

  • 하마시마 히로시

Assignees

  • 교세라 가부시키가이샤

Dates

Publication Date
20260508
Application Date
20210924
Priority Date
20201007

Claims (17)

  1. Landlords and, A gripping part located at one end of the above-mentioned support member and gripping the outer periphery of the substrate, and It includes a base located at the other end of the above-mentioned support member and supporting the above-mentioned support member, and At least the above-mentioned base comprises ceramics having silicon carbide as the main component, and A clamp jig having a smaller average value of the cutting level difference (Rδcl) representing the difference between the cutting level at a load length rate of 25% in the longitudinal roughness curve of the base and the cutting level at a load length rate of 75% in the roughness curve, on the upper surface of the base than on the lower surface of the base.
  2. In Article 1, A clamp jig in which the difference between the average value of the cutting level difference (Rδcl) on the upper surface of the base and the average value of the cutting level difference (Rδcl) on the lower surface of the base is 0.16 μm or more.
  3. In Article 2, A clamp jig having an average value of a cutting level difference (Rδcl) of 0.35 μm or less, which represents the difference between the cutting level at a load length rate of 25% and the cutting level at a load length rate of 75% in the roughness curve along the longitudinal direction of the lower main surface of the base.
  4. Landlords and, A gripping part located at one end of the above-mentioned support member and gripping the outer periphery of the substrate, and It includes a base located at the other end of the above-mentioned support member and supporting the above-mentioned support member, and At least the above-mentioned base comprises ceramics having silicon carbide as the main component, and A clamp jig having a smaller average value of the cutting level difference (Rδcs) representing the difference between the cutting level at a load length rate of 25% in the width direction of the roughness curve of the base and the cutting level at a load length rate of 75% in the roughness curve, on the upper surface of the base than on the lower surface of the base.
  5. In Article 4, A clamp jig in which the difference between the average value of the cutting level difference (Rδcs) on the upper surface of the base and the average value of the cutting level difference (Rδcs) on the lower surface of the base is 0.16 μm or more.
  6. In Article 4 or Article 5, A clamp jig having an average value of a cutting level difference (Rδcs) of 0.35 μm or less, which represents the difference between the cutting level at a load length rate of 25% and the cutting level at a load length rate of 75% in the roughness curve of the lower main surface of the base in the width direction of the base.
  7. In any one of paragraphs 1 to 5, The upper surface of the above-mentioned base is a mirror or polished surface, and A clamp jig having a ratio (Ra1/Ra2) of the average value of the arithmetic mean roughness (Ra1) in the length direction of the base and the average value of the arithmetic mean roughness (Ra2) in the width direction of the base of 0.9 or more and 1.3 or less.
  8. In Article 7, A clamp jig having a cutting mark along at least one of the width direction and length direction of the base on the mirror surface or the polished surface.
  9. In any one of paragraphs 1 to 5, A clamp jig in which the upper surface of the above-mentioned base and at least one side of the above-mentioned base are connected by a curved surface.
  10. In Article 9, A clamp jig having a plurality of grooves along the width direction of the base on the above curved surface.
  11. In Article 10, A clamp jig in which the above-mentioned groove is a U-groove.
  12. In Article 9, A clamp jig having an average value of the arithmetic mean roughness (Ra3) of the curved surface in the above length direction of 0.1㎛ or more and 0.8㎛ or less.
  13. In any one of paragraphs 1 to 5, A clamp jig in which the above-mentioned support portion comprises ceramics having silicon carbide as the main component, and at least the above-mentioned support portion and the above-mentioned base are integrally formed.
  14. In any one of paragraphs 1 to 5, A clamp jig comprising at least 6% of area and 15% of area of granular silicon carbide particles having an area of 170㎛ or more on at least the upper surface of the above-mentioned base.
  15. In Article 14, The above-mentioned assembled silicon carbide particles are a clamp jig comprising at least one of open pores and closed pores.
  16. A process of obtaining a molded body by filling granules with silicon carbide as the main component into a molding die and molding, and A process of obtaining a precursor by cutting the above-mentioned molded body, and A process of obtaining a sintered body by calcining the above precursor, and The method includes a process of buffing and polishing a portion that becomes the upper main surface of at least the base of the sintered body, and In the above buffing process, the average value of the cutting level difference (Rδcl), which represents the difference between the cutting level at a load length rate of 25% and the cutting level at a load length rate of 75% in the longitudinal roughness curve of the base, is made smaller on the upper main surface of the base than on the lower main surface of the base, or A method for manufacturing a clamp jig in which the average value of the cutting level difference (Rδcs), which represents the difference between the cutting level at a load length ratio of 25% in the width direction of the base and the cutting level at a load length ratio of 75% in the base, is made smaller on the upper main surface of the base than on the lower main surface of the base.
  17. A cleaning device comprising a clamp jig described in any one of claims 1 to 5.

Description

Jig for clamping, method for manufacturing a jig for clamping, and cleaning device The present invention relates to a jig for a clamp and a cleaning device. Conventionally, in order to remove contamination such as particles, organic contaminants, and metal impurities attached to a semiconductor substrate, as well as polymers after etching treatment, a cleaning device is used to clean the semiconductor substrate with a cleaning solution such as a predetermined chemical solution or pure water. As a liquid treatment device including such a cleaning device, Patent Document 1 discloses a liquid treatment device having a holding means for maintaining a substrate horizontally, and the holding means having a claw that maintains the end surface of the substrate. Additionally, as a holding means for maintaining a substrate horizontally, Patent Document 2 discloses a clamp that presses the substrate from above, and it is described that the material of the clamp is silicon carbide. A clamping jig according to the present disclosure comprises a support portion, a gripping portion located at one end of the support portion and gripping the outer periphery of a substrate, and a base portion located at the other end of the support portion and supporting the support portion. At least the base portion comprises ceramics having silicon carbide as the main component. The upper surface of the base portion has a smaller average value of the cutting level difference (Rδcl), which represents the difference between the cutting level at a load length ratio of 25% and the cutting level at a load length ratio of 75% in the roughness curve along the longitudinal direction of the base portion, than the lower surface of the base portion. Another clamp jig according to the present disclosure comprises a support portion, a gripping portion located at one end of the support portion and gripping the outer periphery of a substrate, and a base located at the other end of the support portion and supporting the support portion. At least the base comprises ceramics having silicon carbide as the main component. The upper surface of the base has a smaller average value of the difference in cutting level (Rδcs), which represents the difference between the cutting level at a load length ratio of 25% and the cutting level at a load length ratio of 75% in the roughness curve in the width direction of the base, than the lower surface of the base. A method for manufacturing a clamp jig according to the present disclosure comprises: a process of filling a molding die with granules having silicon carbide as the main component and molding to obtain a molded body; a process of cutting the molded body to obtain a precursor; a process of firing the precursor to obtain a sintered body; and a process of buffing at least the upper main surface of the sintered body. In addition, the cleaning device according to the present disclosure includes the clamp jig. FIG. 1 is a schematic diagram showing the schematic configuration of a cleaning device equipped with a clamp jig according to one embodiment of the present disclosure. FIG. 2 is an enlarged view showing a jig for a clamp according to one embodiment of the present disclosure. In the case where a clamping jig formed of a ceramic with silicon carbide as the main component is used as a maintenance means, as in the liquid treatment device of Patent Document 1 above, if an object to be cleaned, such as a semiconductor substrate, is repeatedly cleaned over a long period of time using an acid containing fluorine, such as hydrofluoric acid or hypofluoric acid, the fluorine adheres to the carbon on the surface of the clamping jig and causes whitening. Therefore, there is a need for a clamping jig that does not cause whitening on the surface even when an object to be cleaned is repeatedly cleaned over a long period of time using an acid containing fluorine, such as hydrofluoric acid or hypofluoric acid. As described above, the clamping jig according to the present disclosure has a smaller average value of the cutting level difference (Rδcl), which represents the difference between the cutting level at a load length ratio of 25% in the roughness curve in the longitudinal direction of the base and the cutting level at a load length ratio of 75% in the roughness curve, on the upper surface of the base than on the lower surface of the base. Alternatively, the average value of the cutting level difference (Rδcs), which represents the difference between the cutting level at a load length ratio of 25% in the roughness curve in the width direction of the base and the cutting level at a load length ratio of 75% in the roughness curve, is smaller on the upper surface of the base than on the lower surface of the base. As a result, according to the clamping jig according to the present disclosure, even if the object to be cleaned is repeatedly cleaned over a long period of time using a fluorine-containing acid such as hydrofluoric aci