KR-102962295-B1 - Film For Encapsulating Optoelectronic Device, Optoelectronic Cell Having The Same, And Apparatus and Method For Encapsulating Optoelectronic Device Using The Same

KR102962295B1KR 102962295 B1KR102962295 B1KR 102962295B1KR-102962295-B1

Abstract

The photovoltaic encapsulation film comprises a release film, a conductive adhesive layer spaced apart and bonded to the release film, a conductive film bonded to the conductive adhesive layer, a heat-pressed film inserted into the spaced-apart space between the conductive adhesive layer and the conductive film, and a barrier film bonded to the heat-pressed film and the conductive film.

Inventors

이도규

Assignees

동우 화인켐 주식회사

Dates

Publication Date: 20260507
Application Date: 20240325

Claims (13)

Release film; A conductive adhesive layer spaced and bonded to the above-mentioned release film; A conductive film bonded to the above conductive adhesive layer; A heat-pressed film inserted and filled into the gap between the above conductive adhesive layer and the protruding laminate of the conductive film; and A photovoltaic device encapsulation film comprising a barrier film bonded to the above-mentioned heat-pressed film and conductive film.
In claim 1, the conductive adhesive layer A photoelectric device encapsulation film containing conductive particles, having a thickness of 5 to 100 μm and an adhesion strength of 0.1 N/25 mm or more.
In claim 1, the conductive film is A bus-bar photoelectric device encapsulation film.
A photoelectric device encapsulation film according to any one of claims 1 to 3; A photoelectric element that is compressed and embedded in the above-mentioned heat-pressed film and inserted into the above-mentioned spaced space; A transparent electrode coupled to the lower part of the above-mentioned photoelectric element; A photovoltaic cell comprising a substrate coupled to the lower part of the above-mentioned transparent electrode.
In paragraph 4, the above description is Flexible photovoltaic cell.
In paragraph 5, the above photoelectric element An electron transport layer coupled to the above transparent electrode; A photoactive layer coupled to the electron transport layer above; A hole transport layer coupled to the above photoactive layer; and A photovoltaic cell comprising an inverted organic solar cell including an upper electrode coupled to the hole transport layer.
In paragraph 6, the above photoelectric element Photovoltaic cells, multiple cells connected in series.
An encapsulation film unwinding roll for unwinding an optoelectronic device encapsulation film comprising: a release film; a conductive adhesive layer spaced apart and bonded to the release film; a conductive film bonded to the conductive adhesive layer; a heat-pressing film inserted into the spaced-apart space between the conductive adhesive layer and the conductive film; and a barrier film bonded to the heat-pressing film and the conductive film; A first guide roll that peels off the release film from the moving photovoltaic encapsulation film and changes the direction of movement of the release film; A second guide roll for changing the direction of movement of the photoelectric device encapsulation film from which the above release film has been peeled off; A device film winding roll for winding a photoelectric device film comprising a substrate, a transparent electrode coupled to the substrate, and a photoelectric device coupled to the transparent electrode; A third guide roll for changing the movement direction of the above-mentioned photovoltaic film; A pair of nip rolls that change the direction of movement while bringing the moving photovoltaic encapsulation film and the photovoltaic film into close contact; A photoelectric device encapsulation device comprising a compression roll that compresses the photoelectric device encapsulation film and the photoelectric device film, which move in close contact, and inserts the photoelectric device into the heat-compressed film.
In paragraph 8, A photoelectric device encapsulation device comprising a release film winding roll for winding the peeled release film.
In paragraph 8, the above-mentioned compression roll A photoelectric device encapsulation device, which is a thermal compression roll that applies pressure and heat simultaneously.
In any one of paragraphs 8 through 10, A photovoltaic encapsulation device comprising the above-mentioned compressed photovoltaic encapsulation film and a compressed film winding roll for winding the photovoltaic film.
A step of preparing a photovoltaic device encapsulation film comprising: a release film; a conductive adhesive layer spaced apart and bonded to the release film; a conductive film bonded to the conductive adhesive layer; a heat-pressed film inserted into the spaced-apart space between the conductive adhesive layer and the conductive film; and a barrier film bonded to the heat-pressed film and the conductive film; A step of preparing a photoelectric device film comprising a substrate, a transparent electrode coupled to the substrate, and a photoelectric element coupled to the transparent electrode; A method for encapsulating a photovoltaic device, comprising the step of moving the photovoltaic device encapsulation film while removing the release film on one side, moving the photovoltaic device film on the other side, and then bonding the photovoltaic device encapsulation film to the photovoltaic device film while inserting the photovoltaic device into the heat-press film of the photovoltaic device encapsulation film by heat-pressing.
In claim 12, the step of bonding the photovoltaic encapsulation film to the photovoltaic film A step of removing the release film from the photovoltaic encapsulation film using a first guide roll; A step of changing the direction of movement of the photoelectric device encapsulation film using a second guide roll; A step of changing the direction of movement of the photoelectric device film using a third guide roll; A step of changing the direction of movement while bringing the photovoltaic encapsulation film and the photovoltaic film into close contact using a pair of nip rolls; A method for encapsulating a photovoltaic device, comprising the step of heat-pressing the photovoltaic device encapsulating film and the photovoltaic device film that are in close contact using a heat-pressing roll.

Description

Photovoltaic device encapsulation film, and photovoltaic cell using the same, photovoltaic device encapsulation apparatus and encapsulation method The present invention relates to a photovoltaic device, and more specifically, to a photovoltaic device encapsulation film, a photovoltaic cell using the same, a photovoltaic device encapsulation apparatus, and an encapsulation method. Photovoltaic devices, such as solar cells, are photoelectric conversion devices that convert solar energy into electrical energy. Optoelectronic devices can be broadly classified into inorganic and organic optoelectronic devices, but organic optoelectronic devices are typically utilized. Organic optoelectronic devices, such as organic solar cells, contain organic materials like organic semiconductors; since these organic materials can easily degrade due to oxygen or moisture, it is essential to isolate (seal) them from the external environment. This sealing process involves bonding a barrier film to optoelectronic device films, such as PV (Photovoltaic) elements, using a roll-to-roll printing method. However, in the process of bonding a barrier film to a photovoltaic film, forming the common electrode bus bar in a continuous process is difficult in roll-to-roll printing, which causes productivity issues. Furthermore, if a separate, discontinuous process is performed to form the bus bar, the organic material is more likely to be exposed to oxygen or moisture, which can lead to durability problems. [Prior Patent] 1. Korean Patent Registration No. 10-1648760 (Electron transfer buffer layer polymer material and organic electronic device applying the same) 2. Korean Patent Publication No. 10-2017-0038473 (Apparatus for manufacturing an organic solar cell module, method for manufacturing, and organic solar cell module manufactured thereby) FIG. 1 is a cross-sectional view of a photovoltaic encapsulation film according to the present invention and a photovoltaic cell manufactured using the same. FIG. 2 illustrates an apparatus and method for encapsulating a photovoltaic element using a photovoltaic element encapsulation film according to the present invention. The present invention will be described in detail below with reference to the attached drawings. FIG. 1 is a cross-sectional view of a photovoltaic encapsulation film according to the present invention and a photovoltaic cell manufactured using the same. As illustrated in FIG. 1(a), the photoelectric device encapsulation film (10) according to the present invention may include a release film (11), a conductive adhesive layer (12), a conductive film (13), a heat-pressed film (14), a barrier film (15), etc. The release film (11) protects the conductive adhesive layer (12), heat-pressed film (14), etc. that are bonded to the upper part, and can be bonded to the lower part of them. The release film (11) may be, for example, a polyimide film on which a silicone release layer (adhesive layer) is formed. The silicone release layer may be a composition for forming a silicone release layer containing a silicone resin. The silicone resin may be a curable silicone resin and may include addition type, condensation type, UV curing type, electron beam curing type, etc. The silicone resin may be a modified silicone resin modified by graft polymerization with an organic resin such as a urethane resin, epoxy resin, or alkyd resin. The composition for forming a silicone release layer may additionally include a curing agent. Any curing agent capable of curing the silicone resin may be used, for example, an isocyanate-based curing agent, an epoxy-based curing agent, a metal curing agent, etc. The composition for forming a silicone release layer may additionally include a catalyst, an adhesion enhancer, etc., as needed. The conductive adhesive layer (12) simultaneously implements adhesive and conductive functions and can be spaced and bonded on a release film. The conductive adhesive layer (12) may be composed of a naturally curable conductive paste composition comprising conductive particles (fillers), a binder containing a catechol-based compound and a laccase enzyme, and a solvent that disperses the conductive particles and is miscible with the binder. The conductive particles may be conductive metal powders such as silver (Ag), copper (Cu), or nickel (Ni) of micro or nano size. The conductive adhesive layer (12) may have a thickness of 5 to 100 μm and an adhesive strength of 0.1 N/25 mm or more. If the thickness of the conductive adhesive layer (12) is less than 5 μm, the content of conductive particles is limited, making it difficult to function as a contact electrode, and if the thickness exceeds 100 μm, the contact distance becomes longer, which may increase resistance. If the adhesive strength of the conductive adhesive layer (12) is less than 0.1 N/25 mm, it is easy to peel off, making it difficult to achieve sufficient electrode contact. The conductive film (13) is an electric conductor and ca