KR-102962338-B1 - SUBSTRATE INSPECTION METHOD AND SUBSTRATE INSPECTION DEVICE

Abstract

The present invention provides a technology capable of detecting abnormalities on the back surface of a substrate. A substrate inspection method according to one embodiment of the present disclosure comprises: a process of capturing an image of the back surface of the substrate using a line camera having a plurality of light-receiving elements arranged along a width direction orthogonal to the conveying direction while conveying the substrate with a fork; a process of generating a corrected image by correcting the image captured in the capturing process based on trajectory information of the fork while conveying the substrate; and a process of determining feature information including the location of an abnormal part existing on the back surface of the substrate based on the corrected image.

Inventors

• 다오다, 이사무

Assignees

• 도쿄엘렉트론가부시키가이샤

Dates

Publication Date

20260508

Application Date

20250124

Priority Date

20210511

Claims (1)

1. A process of conveying a substrate with a fork and capturing the back surface of the substrate using a line camera having multiple light-receiving elements arranged along a width direction orthogonal to the conveying direction, and A process for generating a corrected image by correcting an image captured in the capturing process based on trajectory information of the fork when the substrate is being transported, and A process for specifying feature information including the location of an abnormal part existing on the back surface of the substrate based on the above correction image. Includes, The above substrate is a substrate that has undergone plasma treatment, and The above feature information includes at least one of the location and size of the discharge mark, and A substrate inspection method further comprising a process of issuing an alarm according to the specified abnormal part or controlling the substrate so as not to return it to the next process.

Description

Substrate Inspection Method and Substrate Inspection Device The present disclosure relates to a substrate inspection method and a substrate inspection apparatus. A technology is known for determining the presence or absence of foreign matter by comparing an image of the back side of a wafer obtained by photographing the back side of a wafer being transported with a line scan camera with a reference image of the back side of a wafer that has been previously registered (see, for example, Patent Document 1). FIG. 1 is a drawing illustrating an example of a processing system of an embodiment. FIG. 2 is a top view of an example of a substrate inspection device of an embodiment. FIG. 3 is a side view of an example of a substrate inspection device of an embodiment. Figure 4 is a flowchart illustrating an example of a substrate inspection method of an embodiment. Figure 5 is a diagram illustrating the imaging process. Figure 6 is a drawing illustrating an example of an image. Figure 7 is a drawing illustrating an example of a corrected image. Figure 8 is a drawing illustrating an example of an output image. Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the attached drawings. In all of the attached drawings, identical or corresponding members or parts are denoted by identical or corresponding reference numerals, and redundant descriptions are omitted. [Processing System] Referring to FIG. 1, an example of a processing system of an embodiment will be described. The processing system (PS) is equipped with a processing device (PM1 to PM4), a vacuum return chamber (VTM), a load lock chamber (LL1 to LL3), an air return chamber (LM), a load port (LP1 to LP3), an overall control unit (CU), etc. Each processing unit (PM1 to PM4) is connected to a vacuum transport chamber (VTM) through a gate valve (G11 to G14). The processing units (PM1 to PM4) have their interiors depressurized to a vacuum atmosphere and receive a substrate (W) to perform various processing. The substrate (W) includes, for example, a semiconductor wafer. Various processing includes, for example, plasma processing. In addition, the number of processing units (PM1 to PM4) is not limited to four, but may be three or fewer, or five or more. The vacuum conveying chamber (VTM) is depressurized to a vacuum atmosphere inside. A conveying mechanism (TR1) is provided inside the vacuum conveying chamber (VTM). The conveying mechanism (TR1) holds and supports the substrate (W) with forks (FK11, FK12) and conveys it to the processing devices (PM1 to PM4) and load lock chambers (LL1 to LL3). The load lock chambers (LL1 to LL3) are each connected to the vacuum return chamber (VTM) through gate valves (G21 to G23) and connected to the atmospheric return chamber (LM) through gate valves (G31 to G33). The interior of the load lock chambers (LL1 to LL3) can be switched between an atmospheric atmosphere and a vacuum atmosphere. In addition, the number of load lock chambers (LL1 to LL3) is not limited to three, but may be two or fewer, or four or more. The atmosphere of the atmosphere transfer chamber (LM) is an atmosphere inside, and, for example, a downflow of clean air is formed. Inside the atmosphere transfer chamber (LM), a substrate inspection device (10) and a transfer mechanism (TR2) are provided. The transfer mechanism (TR2) holds and supports the substrate (W) with a fork (FK21) and transfers it to the carrier (C) of the load lock chambers (LL1 to LL3) and load ports (LP1 to LP3), and to the substrate inspection device (10). Additionally, the substrate inspection device (10) may be provided outside the atmosphere transfer chamber (LM), for example, on the wall of the short side of the atmosphere transfer chamber (LM). The substrate inspection device (10) will be described later. Load ports (LP1 to LP3) are provided on the long side wall of the waiting return room (LM). A carrier (C) is installed in the load ports (LP1 to LP3). The carrier (C) includes, for example, a FOUP (Front Opening Unified Pod). The overall control unit (CU) may be, for example, a computer. The overall control unit (CU) is equipped with a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), auxiliary storage device, etc. The CPU operates based on a program stored in the ROM or auxiliary storage device and controls each part of the processing system (PS). For example, the overall control unit (CU) controls the operation of processing devices (PM1 to PM4), the operation of return mechanisms (TR1, TR2), the opening and closing of gate valves (G11 to G14, G21 to G23, G31 to G33), and the switching of the atmosphere within load lock chambers (LL1 to LL3). [Board Inspection Device] Referring to FIGS. 2 and FIGS. 3, an example of a substrate inspection device (10) equipped with a processing system (PS) of an embodiment will be described. The substrate inspection device (10) is configured to detect abnormalitie