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KR-102962346-B1 - TEST SOCKET

KR102962346B1KR 102962346 B1KR102962346 B1KR 102962346B1KR-102962346-B1

Abstract

The present invention relates to a test socket, and more specifically, to a test socket in which an adapter module has a two-stage mounting structure of an under adapter member and an upper adapter member, and the upper adapter member is connected to the under adapter member so that a device to be tested is accurately aligned on the adapter module and accurate contact is possible between the package terminal of the device to be tested and the contact member of the adapter module.

Inventors

  • 나형주

Assignees

  • (주)마이크로컨텍솔루션

Dates

Publication Date
20260508
Application Date
20241213

Claims (7)

  1. In a test socket where a test of a device under test is performed, Socket base; A separator module mounted on the above socket base and having a contact member mounted thereon; An adapter module that is combined with the above-mentioned separator module and is equipped with a device to be tested; A latch module disposed on the adapter module above; and A test socket comprising: a cover disposed on the socket base and displaced vertically to open and close the latch module; The above adapter module is, Under adapter member including a first seating surface An upper adapter member having a second seating surface and disposed on the under adapter member; and An elastic member disposed between the under adapter member and the upper adapter member and elastically biasing the upper adapter member upward; comprising, The above under adapter member is, having a mounting space provided on the upper surface, The upper adapter member is mounted in the above mounting space, and The upper adapter member is positionally variable in the vertical direction relative to the under adapter member, and The above upper adapter member is, The lifting state raised by the above elastic member, and The position varies between the lowered state caused by a downward external force, and The above under adapter member is, It is equipped with an insertion body protruding downward from the lower part, The above separator module is, It has an insertion groove that is recessed downward on the upper surface and into which the insertion body is inserted, and The above upper adapter member includes a hook, and The above under adapter member includes a hook hole into which the hook is inserted, and The above hook includes a hook bar extending downward and a hook projection protruding horizontally, and The above hook hole is located in the mounting space and penetrates the above insertion body in the vertical direction, and A catch projection is provided on the inner surface of the above hook hole to which the above hook projection is caught, and The above separator module is, A first separator region and a second separator region on which a contact member is mounted, and It includes a dummy separator disposed between the first separator region and the second separator region, and The above interpolation groove is a test socket provided in the above dummy separator.
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  5. In claim 1, The above under adapter member is, A test socket including an insertion groove into which the above elastic member is inserted.
  6. In claim 1, The above under adapter member is, It includes a contact hole formed on the first seating surface and penetrating vertically, and A contact member is exposed upward through the above contact hole, and The above contact hole is a test socket located in the periphery of the above mounting space.
  7. In claim 1, One of the above under adapter member and the above upper adapter member includes a guide body that extends vertically, and the other includes a guide hole that penetrates vertically. A test socket that guides the vertical displacement of the upper adapter member through the guide body and the guide hole.

Description

Test Socket The present invention relates to a test socket, and more specifically, to a test socket in which an adapter module has a two-stage mounting structure of an under adapter member and an upper adapter member, and the upper adapter member is connected to the under adapter member so that a device to be tested is accurately aligned on the adapter module and accurate contact is possible between the package terminal of the device to be tested and the contact member of the adapter module. A test socket is a socket used for testing a device under test, such as a semiconductor package. The test socket is equipped with a component, such as an adapter, on which the device under test can be mounted. FIG. 16 is a diagram illustrating the structure of an adapter module (1) of a test socket according to the prior art, FIG. 17 is a diagram illustrating a device (P) under test that is tested by the test socket, and FIG. 18 is an enlarged diagram illustrating at least a part of the device (P) under test. The device under test (P) may include, for example, a ball-shaped package terminal (B) on its bottom surface. The adapter module (1) of the LGA test socket has a structure in which the device under test (P) is mounted in a seated manner on a fixed mounting surface (2). Therefore, in this case, if the device under test (P) is mounted in a tilted or shifted state, the package terminal (B) of the device under test (P) may interfere with the mounting surface (2) of the adapter module (1). If such interference occurs, a loading miss may occur between the package terminal (B) and the contact member (4) within the contact hole (3) of the adapter module (1). This is illustrated in drawings as shown in FIGS. 19 to 21. FIG. 19 is a drawing showing a state in which a device to be tested (P) is mounted on an adapter module (1) of a test socket according to the prior art, and FIGS. 20 and 21 are drawings showing that a package terminal (B) interferes with a part of the adapter module (1) while a device to be tested (P) is mounted on an adapter module (1) of a test socket according to the prior art. Such contact misses occur when the device under test (P) is mounted on the adapter module (1), due to a mounting environment in which the package terminal (B) of the device under test (P) first comes into contact with a part of the adapter module (1). Therefore, a means to solve these problems is needed. FIG. 1 is an exploded view showing the structure of a test socket according to an embodiment of the present invention. FIG. 2 is an exploded view of a test socket according to an embodiment of the present invention. FIG. 3 is a drawing showing a separator module of a test socket according to an embodiment of the present invention. FIG. 4 is a drawing showing an adapter module of a test socket according to an embodiment of the present invention, and FIG. 5 and 6 are exploded views of an adapter module of a test socket according to an embodiment of the present invention. Figure 7 is a magnified view of part Q of Figure 5. Fig. 8 is a cross-sectional view of DD of Fig. 4. FIGS. 9 to 13 are drawings illustrating the operation of a test socket according to an embodiment of the present invention. FIGS. 14 and 15 are drawings showing the assembly structure of a test socket according to an embodiment of the present invention. FIG. 16 is a diagram illustrating the structure of an adapter module of a test socket according to the prior art. FIG. 17 is a drawing illustrating a device under test that is tested by a test socket, and FIG. 18 is an enlarged drawing illustrating at least a part of the device under test. FIG. 19 is a drawing showing a state in which a device to be tested is mounted on an adapter module of a test socket according to the prior art, and FIG. 20 and 21 are drawings showing that a package terminal interferes with a part of the adapter module while a device to be tested is mounted on an adapter module of a test socket according to the prior art. Hereinafter, a preferred embodiment according to the present invention will be described with reference to the attached drawings. FIG. 1 is an exploded view showing the structure of a test socket according to an embodiment of the present invention. FIG. 2 is an exploded view of a test socket according to an embodiment of the present invention. A test socket according to an embodiment of the present invention may include a socket base (10), a separator module (20), an adapter module (30), a latch module (40), and a cover (50). The socket base (10) is a component having a mounting space (12) in which an adapter module (30) can be mounted. The socket base (10) may be provided with a specific elastic member that elastically biases the cover (50), which will be described later, upward. The separator module (20) is mounted within the mounting space (12) of the socket base (10) and is a member on which a contact member can be mounted. The adapter module (30) can be combined with the separa