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KR-102962387-B1 - Composition for improving adhesion

KR102962387B1KR 102962387 B1KR102962387 B1KR 102962387B1KR-102962387-B1

Abstract

The present invention relates to an adhesion-improving composition and a method for bonding a metal to a substrate using the same. The adhesion-improving composition according to the present invention, for example, chemically bonds metal particles and a polymer substrate to significantly improve adhesion, and a metal laminate using the same can be applied as a communication PCB with excellent performance.

Inventors

  • 최영민
  • 김태수
  • 이수연
  • 정성묵
  • 윤동한

Assignees

  • 한국화학연구원

Dates

Publication Date
20260512
Application Date
20231024
Priority Date
20221117

Claims (13)

  1. An adhesion-improving composition comprising a compound represented by the following chemical formula 1, wherein the composition is used to improve adhesion between a substrate and a metal coated with an organic binder selected from polyvinylpyrrolidone (PVP), polyvinyl alcohol (PVA), polyethylene glycol (PEG), polystyrene (PS), oleic acid, and oleyl amine. [Chemical Formula 1] [In the above chemical formula 1, L1 is a C1-C5 straight-chain alkylene or a C3-C5 branched-chain alkylene; R1 to R3 are C1-C7 straight-chain alkyl, C3-C7 branched-chain alkyl, C1-C7 straight-chain alkoxy, or C3-C7 branched-chain alkoxy; At least one of R1 to R3 is a C1-C7 straight-chain alkoxy or a C3-C7 branched-chain alkoxy.
  2. In paragraph 1, R1 to R3 of the above chemical formula 1 are C1-C5 straight-chain alkyl, C3-C5 branched-chain alkyl, C1-C5 straight-chain alkoxy, or C3-C5 branched-chain alkoxy; An adhesion-improving composition, wherein at least one of R1 to R3 is a C1-C5 straight-chain alkoxy or a C3-C5 branched-chain alkoxy.
  3. In paragraph 1, R1 to R3 of the above chemical formula 1 are C1-C3 straight-chain alkyl, C3 branched-chain alkyl, C1-C3 straight-chain alkoxy, or C3 branched-chain alkoxy; An adhesion-improving composition, wherein at least one of R1 to R3 is a C1-C3 straight-chain alkoxy or a C3 branched-chain alkoxy.
  4. delete
  5. In paragraph 1, The above description is a polymeric composition for improving adhesion.
  6. A step of introducing a compound represented by the following chemical formula 1 onto a substrate; A step of forming a metal particle layer by applying a metal particle solution coated with an organic binder selected from polyvinylpyrrolidone (PVP), polyvinyl alcohol (PVA), polyethylene glycol (PEG), polystyrene (PS), oleic acid, and oleylamine onto a substrate having a compound represented by the above chemical formula 1; and A method for bonding a metal-substrate, comprising a heat treatment step. [Chemical Formula 1] [In the above chemical formula 1, L1 is a C1-C5 straight-chain alkylene or a C3-C5 branched-chain alkylene; R1 to R3 are C1-C7 straight-chain alkyl, C3-C7 branched-chain alkyl, C1-C7 straight-chain alkoxy, or C3-C7 branched-chain alkoxy; At least one of R1 to R3 is a C1-C7 straight-chain alkoxy or a C3-C7 branched-chain alkoxy.
  7. In paragraph 6, A method for bonding a metal-substrate, further comprising the step of modifying the surface of the above-mentioned substrate with a hydroxyl group or a carboxyl group.
  8. In paragraph 6, A method for bonding a metal-substrate, wherein the above heat treatment is performed at 110 to 250 ℃ for 10 minutes to 5 hours.
  9. In paragraph 6, A method of bonding a metal-substrate, wherein the metal particles are one or more selected from Cu, Ag, Ni, Au, Pt, Ru, Fe, Co, In, Sn, W, and Zn.
  10. In paragraph 6, A metal-substrate bonding method in which the particle size of the metal particles is 10 to 500 nm.
  11. delete
  12. In paragraph 6, The above description describes a method of bonding a metal-substrate, wherein the metal-substrate is a polymer substrate.
  13. A metal laminate comprising: a substrate; an adhesive layer formed from an adhesion-improving composition selected from any one of claims 1 to 3 and 5, positioned above the substrate; and a metal particle layer formed from metal particles coated with an organic binder selected from polyvinylpyrrolidone (PVP), polyvinyl alcohol (PVA), polyethylene glycol (PEG), polystyrene (PS), oleic acid, and oleyl amine, positioned above the adhesive layer.

Description

Composition for improving adhesion The present invention relates to a composition for improving adhesion, a method for bonding a metal to a substrate using the same, and a metal laminate. A printed circuit board (PCB) refers to a circuit board in which many different types of components are densely mounted on a board, and the circuits connecting these components are fixed in a densely packed manner. A PCB is manufactured by attaching a thin metal sheet, such as copper, to one side of the board, etching it according to the wiring pattern to form the necessary circuits, and drilling holes to attach and mount the components. Recently, due to the miniaturization and thinning of communication devices and home appliances, PCBs are becoming multilayered and thinned to increase integration density, and accordingly, superior adhesive strength is required for the metal materials constituting the PCB. In particular, PCBs applied to 5G communication must transmit high-frequency signals (Sub-6 and 29 GHz bands), so copper foil with low surface roughness is mainly used to minimize signal loss in high-frequency bands. This is because most of the current flows along the surface of the copper foil due to the skin effect. Copper-clad laminates (CCL), which are clad with a metal conductive layer such as copper or copper alloy, previously improved adhesion by physically attaching to the substrate through the high surface roughness of the copper foil; however, this method of manufacturing CCL resulted in a large amount of signal loss, which presented a problem as it was not suitable for 5G. Recently, new attempts have been made to resolve the aforementioned problems. This involves forming a metal particle layer by coating copper particles onto a substrate. Since the size of the copper particles corresponds to the sub-micron scale, the surface roughness of the copper particle layer can be significantly reduced, and the adhesion between the copper particle layer and the substrate can be improved through techniques such as substrate surface engineering or copper particle solution engineering. Technology for exhibiting sufficient adhesion between a metal particle layer and a substrate is continuously under development, and there is a need for research on materials and processes capable of further enhancing the adhesion between a polymer substrate and a metal particle layer. FIG. 1 is a schematic diagram showing the manufacturing process of a metal laminate according to one embodiment. Figure 2 is a figure showing the XPS analysis results in step 2 of Example 1. Figure 3 is a photograph showing the SEM analysis results of copper particles used in the examples and comparative examples. Figure 4 is a graph showing the particle size analysis results of copper particles used in the examples and comparative examples. Figure 5 is a photograph showing the results of SEM analysis of a cross-section of the metal laminate of Example 1. Figure 6 is a figure showing the results of the adhesion test (Experimental Example 1) of Example 1 and Comparative Example 1. Figure 7 is a figure showing the results of the adhesion test (Experimental Example 1) of Example 2 and Comparative Example 2. Figure 8 is a figure showing the results of the adhesion test (Experimental Example 1) of Example 3 and Comparative Example 3. Figure 9 is a figure showing the results of the adhesion test (Experimental Example 2) of Example 4 and Comparative Example 4. Figure 10 is a figure showing the results of the adhesion test (Experimental Example 2) of Example 5 and Comparative Example 5. Hereinafter, the composition for improving metal-polymer substrate adhesion of the present invention and the method for manufacturing a metal-polymer substrate using the same will be described in detail. The singular form used in the present invention may be intended to include the plural form unless specifically indicated in the context. Furthermore, the numerical range used in the present invention includes lower and upper limits and all values within the range, increments logically derived from the form and width of the defined range, all of the specified values, and all possible combinations of upper and lower limits of the numerical range defined in different forms. Unless otherwise specifically defined in the specification of the present invention, values outside the numerical range that may occur due to experimental error or rounding are also included in the defined numerical range. In the description of the present invention, "comprising" is an open description having an equivalent meaning to expressions such as "comprising," "containing," "having," or "characterizing," and does not exclude elements, materials, or processes not additionally listed. The present invention will be described in detail below. Unless otherwise defined, technical and scientific terms used herein have the meanings commonly understood by those skilled in the art to which this invention pertains, and descr