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KR-102962391-B1 - TEMPERATURE CONTROL APPARATUS, TEMPERATURE CONTROL METHOD, DEVICE MANUFACTURING APPARATUS, AND ARTICLE MANUFACTURING METHOD

KR102962391B1KR 102962391 B1KR102962391 B1KR 102962391B1KR-102962391-B1

Abstract

A technology is provided that is advantageous for reducing peak current generated in multiple heaters for secondary temperature control while maintaining the control precision of secondary temperature control. The temperature control device comprises a first control unit that controls a cooler performing primary temperature control of a temperature control medium, and a second control unit that controls the power supply to each of a plurality of heaters performing secondary temperature control of the temperature control medium by PWM control. The second control unit determines the timing of the period during which a pulse is ON in the PWM control of each of the plurality of heaters so that the total current value of the plurality of heaters does not exceed a predetermined limit value, and the first control unit determines a correction value for the target temperature based on the amount of operation for each of the plurality of heaters output from the second control unit, and corrects the target temperature using the determined correction value.

Inventors

  • 오타 타카후미

Assignees

  • 캐논 가부시끼가이샤

Dates

Publication Date
20260511
Application Date
20230217
Priority Date
20220329

Claims (11)

  1. A cooler that performs primary temperature control by cooling a temperature control medium, and A first control unit that controls the cooler based on the deviation between the target temperature and the current temperature, and A plurality of heaters that perform secondary temperature control by giving heat generated according to the supplied power to the temperature control medium cooled by the cooler, and A second control unit is provided to control the power supply to each of the plurality of heaters above by PWM control, and The second control unit determines the timing of the period during which the pulse is ON in the PWM control of each of the plurality of heaters so that the total current value of the plurality of heaters does not exceed a predetermined limit value, and A temperature control device characterized by the first control unit adjusting the target temperature using a correction value obtained by multiplying a constant by a value representing the excess amount for the PWM control cycle of the sum of the periods of each of the plurality of heaters.
  2. In Article 1, A temperature control device characterized in that the above-mentioned predetermined limit value is the maximum value among the rated currents of each of the plurality of heaters.
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  5. In Article 1, A temperature control device characterized in that the above constant is a value based on at least one of the rated output value of each of the plurality of heaters and the flow rate of the temperature control medium flowing through the cooling target.
  6. In Article 1, Further comprising a first temperature sensor for measuring the temperature of a temperature control medium that has passed through the above cooler, A temperature control device characterized by including a PID compensator that outputs an operation amount for controlling cooling by the cooler according to the deviation of the target temperature adjusted using a correction value to adjust the temperature measured by the first temperature sensor and the target temperature.
  7. In Article 1, Further equipped with a plurality of second temperature sensors for measuring the temperature of a temperature control medium that has passed through different objects, The second control unit includes a plurality of control systems that perform secondary temperature control for each of the plurality of heaters assigned to the different targets, and each of the plurality of control systems is A PID compensator that outputs a control variable for controlling heating by a heater according to the deviation between the temperature measured by the second temperature sensor and the target temperature, and A temperature control device characterized by including a timing control unit that converts an operation amount output from the above PID compensator into a PWM control signal and simultaneously controls the timing.
  8. A first process for performing primary temperature control to cool a temperature control medium based on the difference between the target temperature and the current temperature, and A second process for performing a second temperature control that heats the temperature control medium cooled by the first temperature control by PWM controlling the power supply to each of the plurality of heaters, and The second process above includes a process for determining the timing of the period during which the pulse is ON in the PWM control of each of the plurality of heaters so that the total current value of the plurality of heaters does not exceed a predetermined limit value. A temperature control method characterized by including a process of adjusting the target temperature using a correction value obtained by multiplying a constant by a value representing the excess amount for the PWM control cycle of the sum of the periods of each of the plurality of heaters in the first process.
  9. As a device manufacturing apparatus having a plurality of heating elements, A temperature control device comprising the device described in any one of claims 1, 2 and 5 to 7, and A device manufacturing apparatus characterized by having a plurality of heaters disposed between the cooler and the plurality of heating elements.
  10. In Article 9, A device manufacturing apparatus characterized by being configured as a lithography device for forming a pattern on a substrate.
  11. A process of forming a pattern on a substrate using a lithography apparatus described in claim 10, and A process for processing a substrate having the above pattern formed thereon, A method for manufacturing an article characterized by manufacturing an article from the processed substrate.

Description

Temperature control apparatus, temperature control method, device manufacturing apparatus, and article manufacturing method The present invention relates to a temperature control device, a temperature control method, a device manufacturing device, and a method for manufacturing an article. High throughput is required for device manufacturing equipment, such as photolithography equipment, used in manufacturing processes for semiconductor devices or display devices. Due to the recent increase in throughput, the amount of heat generated from drive parts (heat-generating parts), such as linear motors, is increasing. Temperature control media, such as water, antifreeze, and inert liquid, are used for cooling the heat-generating parts. The temperature control media, which has risen in temperature by absorbing heat generated from the heat-generating parts, undergoes primary temperature control through heat exchange with a chiller controlled by inverter control or hot bypass gas control, or with cold water supplied from the equipment. High-precision temperature control required for device manufacturing equipment is difficult to achieve solely through primary temperature control using refrigerators or heat exchangers as described above. Therefore, secondary temperature control is performed near the heat generation area using precision heaters with high responsiveness and precision. As a method for adjusting the output of precision heaters, there is the Pulse Width Modulation (PWM) method, which changes the ratio of the energization time to the precision heater from the power supply per unit time. The PWM method is widely used as a heater control method because it allows for relatively inexpensive device configuration and is easy to control. The power supply for the precision heaters utilizes the equipment power supply of the semiconductor factory where the device manufacturing equipment is installed. Here, in order to suppress the current flowing through the precision heater used for secondary temperature control, it is necessary to reduce the rated output value of the precision heater. To achieve this, it is important to suppress the control temperature difference ΔT between the primary temperature control and the secondary temperature control. As an example of solving this problem, Patent Document 1 discloses a technique for changing the target temperature of the primary temperature control according to a driving command to a driving unit that serves as a heat source for the device. FIG. 1 is a drawing showing an example of the configuration of a device manufacturing apparatus. FIG. 2 is a drawing illustrating an example of the configuration of a temperature control device. Fig. 3 is a block diagram of a secondary temperature control system. FIG. 4 is a flowchart showing the control processing of the timing at which a pulse turns ON in PWM control. FIGS. 5a to 5f are diagrams illustrating the generation of peak current due to the overlap of the pulse ON period in PWM control. Fig. 6 is a block diagram of a primary temperature control system. FIGS. 7a to 7f are drawings illustrating the effects of the first embodiment. Fig. 8 is a block diagram of a primary temperature control system. FIG. 9 is a flowchart showing the control processing of the timing at which a pulse turns ON in PWM control of the second embodiment. FIGS. 10a to 10f are drawings illustrating the effects of the second embodiment. Fig. 11 is a flowchart of a temperature control method. Hereinafter, embodiments are described in detail with reference to the attached drawings. At this time, the following embodiments do not limit the invention with respect to the claims. Although multiple features are described in the embodiments, not all of these multiple features are essential to the invention, and multiple features may be combined arbitrarily. Also, in the attached drawings, the same reference number is assigned to identical or similar components, and redundant descriptions are omitted. <First Embodiment> FIG. 1 is a schematic diagram illustrating the configuration of a device manufacturing apparatus according to a first embodiment to which the temperature control device of the present invention is applied. Here, an example is described in which the device manufacturing apparatus is configured as a lithography apparatus for forming a pattern on a substrate. Lithography apparatuses include an imprint apparatus and an exposure apparatus. An imprint apparatus is a device that forms a pattern on a substrate by curing an imprint material while in contact with an imprint material supplied on the substrate. An exposure apparatus is a device that forms a latent image corresponding to the pattern of the original plate on the photoresist by exposing the photoresist supplied on the substrate through an original plate (reticle) which is an exposure mask. Below, to provide a specific example, an example is described in which the lithography apparatus is configured