KR-102962439-B1 - thermal interface material for mobile application processor chip and thermal interface seat containing the same

Abstract

The present invention relates to a thermal interface material for a mobile application processor chip and a thermal interface sheet comprising the same, and more specifically, to a thermal interface material for a mobile application processor chip that not only has excellent reworkability but also has excellent thermal resistance and compressibility, and also has excellent tackiness, and a thermal interface sheet comprising the same.

Inventors

• 이진형
• 우봉식
• 정혜린
• 김소현
• 주지은

Assignees

• 주식회사 테크온

Dates

Publication Date

20260508

Application Date

20250619

Claims (12)

1. A thermal interface sheet for a mobile application processor chip comprising a thermal interface material for a mobile application processor chip, The thermal interface material for the mobile application processor chip described above comprises a base material, and The above base material includes a filler and a binder resin, and The above binder resin comprises, based on the total weight%, 50 to 60 weight% of a styrene-based thermoplastic elastomer, 30 to 40 weight% of a fluidizing agent, and 5 to 15 weight% of styrene-butadiene rubber, and The above styrene-butadiene rubber has a styrene content of 23.5 to 24.5 weight%, a melting point of 230 to 280°C, and a Shore A hardness of 50 to 70, and The thermal interface sheet for a mobile application processor chip described above has a thickness of 50 to 150 μm.
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5. In paragraph 1, A thermal interface sheet for a mobile application processor chip, wherein the above-mentioned styrene-based thermoplastic elastomer comprises one or more selected from styrene-ethylene/butylene-styrene block copolymer, styrene-butadiene-styrene block copolymer (SBS), styrene-isobutylene-styrene block copolymer (SIBS), and styrene-isoprene-styrene block copolymer (SIS).
6. In paragraph 5, A thermal interface sheet for a mobile application processor chip, wherein the above-mentioned styrene-based thermoplastic elastomer is a styrene-ethylene/butylene-styrene block copolymer having a weight-average molecular weight of 80,000 to 200,000, a styrene content of 8 to 16 wt%, and a Shore A hardness of 42 to 52.
7. In paragraph 1, A thermal interface sheet for a mobile application processor chip, comprising one or more fluidizing agents selected from paraffin oil, naphthalene-based oil, isoparaffin oil, and aromatic-based oil.
8. In paragraph 1, A thermal interface sheet for a mobile application processor chip, wherein the base material comprises 86.16 to 96.16 weight% of a filler and 3.84 to 13.84 weight% of a binder resin based on the total weight%.
9. In paragraph 1, The above thermal interface material is a thermal interface sheet for a mobile application processor chip, further comprising a functional additive.
10. In Paragraph 9, The above thermal interface material comprises 0.01 to 5 parts by weight of an additive per 100 parts by weight of a base material, a thermal interface sheet for a mobile application processor chip.
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Description

Thermal interface material for mobile application processor chip and thermal interface seat containing the same The present invention relates to a thermal interface material for a mobile application processor chip and a thermal interface sheet including the same. More specifically, the invention relates to a thermal interface material for a mobile application processor chip and a thermal interface sheet including the same, which has a thin thickness and excellent thermal resistance so as to be able to rapidly dissipate heat generated from the mobile application processor chip to the outside, as well as having excellent reworkability, compressibility, and tackiness. Recently, due to the miniaturization and high integration of electronic devices, thermal density has increased rapidly, significantly impacting the lifespan and reliability of electronic components. Conventional thermal interface materials (TIMs) enhance heat transfer efficiency by bonding two surfaces of a substrate or filling minute surface defects. However, existing thermally conductive materials have low thermal conductivity, which hinders heat transfer and causes product deformation, making them difficult to use in electronic products. In particular, as printed circuit boards (PCBs) included in electronic devices become smaller, more complex, and more integrated, the heat dissipation performance of PCBs is becoming increasingly important. Since reducing the amount of heat generated by PCBs requires rapidly releasing the heat to the outside, thermal interface materials (TIMs) are essential components of PCBs. Meanwhile, an application processor (AP) chip, which is a type of printed circuit board, is an integrated circuit in which multiple components of an electronic system or multiple IPs (intellectual properties) are integrated. In particular, mobile application processor chips possess the functions of a computer's CPU, memory, and GPU all at once. Consequently, mobile application processor chips not only generate more heat than general printed circuit boards but also exhibit various step heights due to the numerous auxiliary materials formed on the base board. Therefore, there is a need to develop thermal interface materials optimized for such application processor chips. Hereinafter, embodiments of the present invention are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. In the drawings, parts unrelated to the explanation have been omitted to clearly explain the present invention, and the same reference numerals are assigned to identical or similar components throughout the specification. The thermal interface material for a mobile application processor chip of the present invention comprises a base material. The base material of the present invention may include a filler and a binder resin. Specifically, the base material of the present invention may comprise, based on the total weight%, 86.16 to 96.16 weight% of a filler, preferably 88.16 to 94.16 weight%, more preferably 90.16 to 92.16 weight%, and 3.84 to 13.84 weight% of a binder resin, preferably 5.84 to 11.84 weight%, more preferably 7.84 to 9.84 weight%. If the filler is included in an amount less than 86.16 weight%, there may be a problem with heat dissipation characteristics, and if it is included in an amount exceeding 96.16 weight%, there may be a problem in forming the thermal interface material for the mobile application processor chip of the present invention. Meanwhile, the filler of the present invention may include a filler surface-treated with silane. Specifically, the silane-surfaced filler may be prepared by adding the filler to a silane composition for surface treatment containing a silane precursor and then reacting the mixture to produce the silane-surfaced filler. At this time, the silane-surfaced filler may be prepared such that the filler and silane have a weight ratio of 1:0.2 to 0.6, preferably 1:0.3 to 0.5, and more preferably 1:0.35 to 0.45. If the weight ratio is less than 1:0.2, there may be a problem with reduced bonding strength with the binder resin, and if it exceeds 1:0.6, there may be a problem with reduced heat dissipation characteristics. In addition, the silane precursor may include one or more selected from GPTMS ((3-Glycidyloxypropyl)trimethoxysilane), GPMS (Diethoxy(3-glycidyloxypropyl)methylsilane), trimethoxy[2-(7-oxabicyclo[4.1.0]hept-3-yl)ethyl]silane (Trimethoxy[2-(7-oxabicyclo[4.1.0]hept-3-yl)ethyl]silane) and GPTES ((3-Glycidyloxypropyl)triethoxysilane), and preferably may include GPTMS. In addition, the silane composition for surface treatment may include distilled water and acetic acid in addition to the silane precursor, and the silane precursor included in the silane composition for surface treatment may be included as hydrolyze