KR-102962440-B1 - SUBSTRATE PROCESSING SYSTEM

Abstract

A substrate process system according to one embodiment may include: a front end module; a first process line including a first polishing line and a first cleaning line; a second process line including a second polishing line and a second cleaning line and arranged in parallel with the first process line; a first stage located between the first cleaning line and the second cleaning line; a first transport robot for transporting a substrate from the front end module to the first stage; a second stage located between the first polishing line and the second polishing line; and a second transport robot for transporting a substrate between at least two locations among the first cleaning line, the second cleaning line, the first stage, and the second stage.

Inventors

• 채희성
• 이승은
• 윤근식

Assignees

• 주식회사 케이씨텍

Dates

Publication Date

20260511

Application Date

20210830

Priority Date

20201008

Claims (20)

1. Front-end module; A first process line including a first polishing line and a first cleaning line; A second process line including a second polishing line and a second cleaning line, and arranged in parallel with the first process line; At least one stage located between the first process line and the second process line; and It includes at least one transport robot that transports a substrate between at least two locations among the front-end module, the first process line, the second process line, and at least one stage, and The above stage includes a first stage located between the first cleaning line and the second cleaning line, and The above-mentioned transfer robot includes a first transfer robot that transfers a substrate from the front-end module to the first stage, and The above stage further includes a second stage located between the first polishing line and the second polishing line, and The above-mentioned transfer robot further includes a second transfer robot that transfers a substrate between at least two locations among the first cleaning line, the second cleaning line, the first stage, and the second stage. It further includes a third transport robot that transports a substrate between at least two locations among the second stage, the first polishing line, and the second polishing line. Each of the above first polishing line and second polishing line is, A first rotating part that forms a first transfer track in a circular shape according to rotation and transfers a substrate between a first transfer position, a second transfer position, and a third transfer position; A second rotating part that forms a second transfer track in a circular shape according to rotation and transfers a substrate between the second transfer position and the first polishing position; A third rotating part that forms a third transfer track in a circular shape according to rotation and transfers a substrate between the third transfer position and the second polishing position; A first polishing pad that rotates at a position where at least a portion overlaps with the first polishing position; and A substrate process system comprising a second polishing pad that rotates at a position where at least a portion overlaps with the second polishing position.
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6. In paragraph 1, The above second transfer robot is a substrate process system that transfers a substrate before polishing from the above first stage to the above second stage.
7. In paragraph 6, A substrate process system in which the third conveying robot conveys a substrate before polishing from the second stage to the first conveying position of either the first polishing line or the second polishing line.
8. In Paragraph 7, A substrate process system comprising at least one third stage sequentially positioned at the first transfer position, the second transfer position, and the third transfer position, wherein the first rotating part comprises at least one third stage.
9. In paragraph 8, The second rotating part includes at least one first carrier head alternately positioned at the second transfer position and the first grinding position, and A substrate process system comprising at least one second carrier head alternately positioned at the third transfer position and the second polishing position, wherein the third rotating part comprises
10. In Paragraph 9, Each of the above first polishing line and second polishing line is, A first loading unit for loading or unloading a substrate to the first carrier head at the second transfer position; and A substrate process system further comprising a second loading unit for loading or unloading a substrate to the second carrier head at the third transfer position.
11. In Paragraph 10, A substrate process system wherein each of the first loading unit and the second loading unit includes a cleaning nozzle for cleaning the first carrier head or the second carrier head located at the second transfer position or the third transfer position.
12. In paragraph 1, A substrate process system in which the second conveying robot transfers a substrate that has been polished from either the first polishing line or the second polishing line to either the first cleaning line or the second cleaning line.
13. In Paragraph 12, A substrate process system in which the first transfer robot transfers a substrate that has been cleaned from either the first cleaning line or the second cleaning line to the front end module.
14. In paragraph 1, Each of the above first cleaning line and second cleaning line is, A chamber section comprising a plurality of cleaning chambers, at least some of which are stacked in a vertical direction; and A substrate process system comprising a fourth transfer robot that transfers a substrate from at least one of the plurality of cleaning chambers to another.
15. In Paragraph 14, The above chamber part is, A first chamber section comprising at least one cleaning chamber; It includes at least one cleaning chamber, and a second chamber portion spaced apart horizontally from the first chamber portion. The above-mentioned fourth transfer robot is a substrate process system located between the above-mentioned first chamber section and the second chamber section.
16. In paragraph 15, A substrate process system in which the second conveying robot conveys a polished substrate from either of the first polishing lines or the second polishing lines to the first chamber section of either the first cleaning line or the second cleaning line.
17. In Paragraph 16, A substrate process system in which the first conveying robot conveys a substrate that has been cleaned from the second chamber of either the first cleaning line or the second cleaning line to the front end module.
18. Front-end module positioned in the first direction; A first process line comprising a first polishing line and a first cleaning line, and arranged in a second direction perpendicular to the first direction; A second process line comprising a second polishing line and a second cleaning line, arranged in a third direction perpendicular to the first direction and parallel to the second direction; and It includes a second stage positioned between the first process line and the second process line, and The substrate is transferred from the first polishing line or the second polishing line to the first cleaning line or the second cleaning line via the second stage, or transferred from the first cleaning line or the second cleaning line to the first polishing line or the second polishing line. Each of the above first polishing line and second polishing line is, A first rotating part that forms a first transfer track in a circular shape according to rotation and transfers a substrate between a first transfer position, a second transfer position, and a third transfer position; A second rotating part that forms a second transfer track in a circular shape according to rotation and transfers a substrate between the second transfer position and the first polishing position; A third rotating part that forms a third transfer track in a circular shape according to rotation and transfers a substrate between the third transfer position and the second polishing position; A first polishing pad that rotates at a position where at least a portion overlaps with the first polishing position; and A substrate process system comprising a second polishing pad that rotates at a position where at least a portion overlaps with the second polishing position.
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20. In Paragraph 18, A substrate process system comprising at least one third stage sequentially positioned at the first transfer position, the second transfer position, and the third transfer position, wherein the first rotating part comprises at least one third stage.

Description

Substrate Processing System The following example relates to a substrate process system. The manufacturing of semiconductor devices requires chemical mechanical polishing (CMP) operations, including polishing, buffing, and cleaning. Semiconductor devices are in the form of a multilayer structure, and transistor elements with diffusion regions are formed on the substrate layer. On the substrate layer, connecting metal lines are patterned and electrically connected to the transistor elements forming the functional device. As is known, the patterned conductive layer is insulated from other conductive layers by an insulating material such as silicon dioxide. As more metal layers and associated insulating layers are formed, the need to flatten the insulating material increases. If flattening is not performed, the fabrication of additional metal layers becomes substantially more difficult due to significant variations in surface morphology. Furthermore, since the metal line pattern is formed with an insulating material, metal CMP operations are performed to remove excess metal. To increase the production efficiency of the CMP process, waiting times between processes or transfers can be reduced, and each process or transfer can be performed in parallel. For example, if the transfer path of the substrate is shortened and transfer and polishing can be performed simultaneously on multiple substrates, the production efficiency of the CMP process can be increased. The aforementioned background technology is one that the inventor possessed or acquired in the process of deriving the contents of the disclosure of the present application, and it cannot be considered as prior art disclosed to the general public prior to the filing of this application. FIG. 1 is a schematic plan view of a substrate process system according to one embodiment. FIG. 2 is a schematic plan view of a first grinding line according to one embodiment. FIG. 3 is a schematic side view of the first rotating part and the first loading part in the first grinding line according to one embodiment. FIG. 4 is a schematic perspective view of a first cleaning line according to one embodiment. FIG. 5 is a schematic side view of a first cleaning line to show a cleaning process of a substrate according to one embodiment. FIG. 6 is a schematic perspective view of a first chamber portion according to one embodiment. Hereinafter, embodiments are described in detail with reference to the attached drawings. However, since various modifications may be made to the embodiments, the scope of the patent application is not limited or restricted by these embodiments. It should be understood that all modifications, equivalents, and substitutions to the embodiments are included within the scope of the rights. The terms used in the embodiments are for illustrative purposes only and should not be interpreted as intended to be limiting. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the embodiments pertain. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application. In addition, when describing with reference to the attached drawings, identical components are assigned the same reference numeral regardless of drawing symbols, and redundant descriptions thereof are omitted. In describing the embodiments, if it is determined that a detailed description of related prior art could unnecessarily obscure the essence of the embodiments, such detailed description is omitted. In addition, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments. These terms are intended only to distinguish the components from other components, and the nature, order, or sequence of the components is not limited by the terms. Where it is stated that a component is "connected," "combined," or "connected" to another component, it should be understood that the component may be directly connected or connected to the other component, but that another component may also be "connected," "combined," or "connected" between each component. Components included in any one embodiment and components having common functions shall be described using th