KR-102962443-B1 - SUBSTRATE CLEANING LINE AND SUBSTRATE CLEANING SYSTEM COMPRISING THE SAME

Abstract

A substrate cleaning line and a substrate cleaning system including the same are disclosed. A substrate cleaning line according to one embodiment includes a chamber section comprising a plurality of cleaning chambers for cleaning a substrate; and a first conveying robot for receiving, receiving, or transporting the substrate to the plurality of cleaning chambers, wherein the plurality of cleaning chambers may each be stacked in a vertical direction.

Inventors

• 채희성
• 이승은
• 윤근식

Assignees

• 주식회사 케이씨텍

Dates

Publication Date

20260511

Application Date

20210824

Claims (15)

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9. At least one substrate cleaning line; and It includes a second conveying robot that conveys the polished substrate to the substrate cleaning line, The above at least one substrate cleaning line is, A transfer stage for receiving a polished substrate from the second transfer robot; A chamber section comprising a plurality of cleaning chambers for cleaning the polished substrate; and It includes a first transport robot that brings in, takes out, or transports the substrate to the plurality of cleaning chambers, and The second conveying robot above conveys the polished substrate to the transfer stage, and The above plurality of cleaning chambers are each stacked in a vertical direction, and A substrate cleaning system in which the transfer stage is located between two adjacent cleaning chambers among the plurality of cleaning chambers stacked in a vertical direction.
10. In Paragraph 9, The above substrate cleaning line is a substrate cleaning system comprising a first substrate cleaning line and a second substrate cleaning line spaced apart in a horizontal direction.
11. In Paragraph 10, The above second return robot is a substrate cleaning system positioned between the first and second substrate cleaning lines.
12. In Paragraph 10, The above-mentioned second return robot is, A substrate cleaning system that transfers a polished substrate to the other if either of the first or second substrate cleaning lines fails.
13. In Paragraph 9, The above second transfer robot is a substrate cleaning system that transfers a polished substrate to one of a plurality of cleaning chambers of the substrate cleaning line.
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Description

Substrate cleaning line and substrate cleaning system comprising the same The following embodiments relate to a substrate cleaning line and a substrate cleaning system including the same. Generally, semiconductors are manufactured by repeatedly performing a series of processes such as lithography, deposition, and etching. Due to these repetitive processes, contaminants such as various particles, metal impurities, or organic materials remain on the surface of the substrate constituting the semiconductor. Since contaminants remaining on the substrate degrade the reliability of the manufactured semiconductor, a process for cleaning the substrate is required during the semiconductor manufacturing process to improve this. Meanwhile, the processing order of the cleaning solution may change depending on the process recipe. In this case, there is a problem that the nozzle may become contaminated if the solution supplied to the nozzle is changed. Therefore, there is a need for a substrate cleaning line having a structure that allows the movement order of the chamber to be flexibly changed without changing the supplied solution, and a substrate cleaning system including the same. The aforementioned background technology is one that the inventor possessed or acquired in the process of deriving the contents of the disclosure of the present application, and it cannot be considered as prior art disclosed to the general public prior to the filing of this application. FIG. 1 is a schematic perspective view of a substrate cleaning line according to one embodiment. FIG. 2 is a schematic side view of a substrate cleaning line to show a cleaning process of a substrate according to one embodiment. FIG. 3 is a schematic plan view of a substrate cleaning system according to one embodiment. FIG. 4 is a schematic diagram of a first chamber section and a second transport robot according to one embodiment. Hereinafter, embodiments are described in detail with reference to the attached drawings. However, various modifications may be made to the embodiments, and thus the scope of the patent application is not limited or restricted by these embodiments. It should be understood that all modifications, equivalents, and substitutions to the embodiments are included within the scope of the rights. The terms used in the embodiments are for illustrative purposes only and should not be interpreted as intended to be limiting. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the embodiments pertain. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application. In addition, when describing with reference to the attached drawings, identical components are assigned the same reference numeral regardless of drawing symbols, and redundant descriptions thereof are omitted. In describing the embodiments, if it is determined that a detailed description of related prior art could unnecessarily obscure the essence of the embodiments, such detailed description is omitted. In addition, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments. These terms are intended only to distinguish the components from other components, and the nature, order, or sequence of the components is not limited by the terms. Where it is stated that a component is "connected," "combined," or "connected" to another component, it should be understood that the component may be directly connected or connected to the other component, but that another component may also be "connected," "combined," or "connected" between each component. Components included in any one embodiment and components having common functions shall be described using the same names in other embodiments. Unless otherwise stated, the description in any one embodiment may also apply to other embodiments, and specific descriptions shall be omitted to the extent of overlap. FIG. 1 is a schematic perspective view of a substrate cleaning line (1) according to one embodiment. Referring to FIG. 1, a substrate cleaning line (1) according to one embodiment can be used in a substrate cleaning process for cleaning a polished substrate. According to one embo