Search

KR-102962444-B1 - putty type thermal interface composite seat and manufacturing method thereof

KR102962444B1KR 102962444 B1KR102962444 B1KR 102962444B1KR-102962444-B1

Abstract

The present invention relates to a putty-type thermal interface composite sheet and a method for manufacturing the same, and more specifically, to a putty-type thermal interface composite sheet that not only has excellent processability but also excellent heat dissipation characteristics, has a compression ratio higher than a certain level, and has a significantly excellent elongation ratio, and a method for manufacturing the same.

Inventors

  • 정혜린
  • 우봉식
  • 이진형
  • 양혜윤
  • 주지은
  • 김소현
  • 김보현

Assignees

  • 주식회사 테크온

Dates

Publication Date
20260508
Application Date
20250528

Claims (15)

  1. A putty-type thermal interface composite sheet having a three-layer structure in which a first thermal interface sheet, a second thermal interface sheet, and a third thermal interface sheet are sequentially laminated, The first thermal interface sheet, the second thermal interface sheet, and the third thermal interface sheet each comprise a base material, and The base material included in each of the first thermal interface sheet, the second thermal interface sheet, and the third thermal interface sheet comprises, based on the total weight%, 82 to 98 weight% of a filler and 2 to 18 weight% of a binder resin, and The binder resin included in each of the first thermal interface sheet and the third thermal interface sheet comprises, based on the total weight%, 65 to 75 weight% of a styrene-based thermoplastic elastomer, 15 to 25 weight% of a fluidizing agent, and 5 to 15 weight% of styrene-butadiene rubber. The binder resin included in the second thermal interface sheet comprises, based on the total weight%, 5 to 25 weight% of a styrene-based thermoplastic elastomer and 75 to 95 weight% of a fluidizing agent, and The putty-type thermal interface composite sheet described above has a compressibility of 35 to 60% when a pressure of 1 kgf/ cm² is applied as measured by ASTM D3574 test conditions, an elongation of 400 to 900% as measured by JIS K 7113-2 test conditions, a thermal conductivity of 3.5 to 4.5 W/mk as measured by ASTM D5470 test conditions, and a thermal resistivity of 0.9 K· cm² /W or less as measured by ASTM D5470 test conditions.
  2. delete
  3. In paragraph 1, The fillers included in the first thermal interface sheet and the third thermal interface sheet, respectively, include the first filler and the second filler, and A putty-type thermal interface composite sheet satisfying the following condition (1). (1) A > B In the above condition (1), A represents the average particle size of the first filler and B represents the average particle size of the second filler.
  4. In paragraph 3, The first filler has an average particle size of 8 to 18 μm, and The above second filler is a putty-type thermal interface composite sheet having an average particle size of 1.5 to 3 μm.
  5. In paragraph 3, A putty-type thermal interface composite sheet, wherein the fillers included in the first thermal interface sheet and the third thermal interface sheet, respectively, comprise 53 to 73 weight% of the first filler and 27 to 47 weight% of the second filler based on the total weight%.
  6. delete
  7. delete
  8. In paragraph 1, A putty-type thermal interface composite sheet in which the filler included in the second thermal interface sheet above comprises a filler surface-treated with silane.
  9. In paragraph 8, The filler included in the second thermal interface sheet above includes a third filler, a fourth filler, and a fifth filler, and A putty-type thermal interface composite sheet satisfying the following condition (2). (2) C > D > E In the above condition (2), C represents the average particle size of the third pillar, D represents the average particle size of the fourth pillar, and E represents the average particle size of the fifth pillar.
  10. In Paragraph 9, The above third filler has an average particle size of 20 to 60 μm, and The above-mentioned fourth filler has an average particle size of 4 to 7 μm, and The above-mentioned fifth filler is a putty-type thermal interface composite sheet having an average particle size of 0.1 to 1.3 μm.
  11. In Paragraph 9, A putty-type thermal interface composite sheet comprising, based on the total weight%, a filler included in the second thermal interface sheet comprising 50 to 60 weight% of a third filler, 30 to 40 weight% of a fourth filler, and 5 to 15 weight% of a fifth filler.
  12. delete
  13. delete
  14. A first step of preparing a first thermal interface sheet, a second thermal interface sheet, and a third thermal interface sheet, respectively; and A second step of sequentially laminating the first thermal interface sheet, the second thermal interface sheet, and the third thermal interface sheet, and performing cold lamination to manufacture a putty-type thermal interface composite sheet with a three-layer structure; comprising The first thermal interface sheet, the second thermal interface sheet, and the third thermal interface sheet each comprise a base material, and The base material included in each of the first thermal interface sheet, the second thermal interface sheet, and the third thermal interface sheet comprises, based on the total weight%, 82 to 98 weight% of a filler and 2 to 18 weight% of a binder resin, and The binder resin included in each of the first thermal interface sheet and the third thermal interface sheet comprises, based on the total weight%, 65 to 75 weight% of a styrene-based thermoplastic elastomer, 15 to 25 weight% of a fluidizing agent, and 5 to 15 weight% of styrene-butadiene rubber. The binder resin included in the second thermal interface sheet comprises, based on the total weight%, 5 to 25 weight% of a styrene-based thermoplastic elastomer and 75 to 95 weight% of a fluidizing agent, and A method for manufacturing a putty-type thermal interface composite sheet, wherein the putty-type thermal interface composite sheet has a compression ratio of 35 to 60% when a pressure of 1 kgf/ cm² is applied as measured by ASTM D3574 test conditions, an elongation ratio of 400 to 900% as measured by JIS K 7113-2 test conditions, a thermal conductivity of 3.5 to 4.5 W/mk as measured by ASTM D5470 test conditions, and a thermal resistivity of 0.9 K· cm² /W or less as measured by ASTM D5470 test conditions.
  15. delete

Description

Putty-type thermal interface composite seat and manufacturing method thereof The present invention relates to a putty-type thermal interface composite sheet and a method for manufacturing the same, and more specifically, to a putty-type thermal interface composite sheet that not only has excellent processability but also excellent heat dissipation characteristics, has a compression ratio higher than a certain level, and has a significantly excellent elongation ratio, and a method for manufacturing the same. Recently, due to the miniaturization and high integration of electronic devices, thermal density has increased rapidly, significantly impacting the lifespan and reliability of electronic components. Conventional thermal interface materials (TIMs) enhance heat transfer efficiency by bonding two surfaces of a substrate or filling minute surface defects. However, existing thermally conductive materials have low thermal conductivity, which hinders heat transfer and causes product deformation, making them difficult to use in electronic products. Thermal interface materials (TIMs) are classified into grease type, pad type, and putty type depending on their application. Generally, grease type materials are manufactured in liquid form, pad type materials are manufactured in sheet form, and putty type materials are manufactured in a clay-like form with non-restoring properties. Therefore, since putty-type thermal interface materials possess softness, they can be described as thermal interface materials that not only have high compressibility but can also fill fine gaps. On the other hand, putty-type thermal interface materials had a problem of significantly reduced reworkability and/or processability due to their high softness. Therefore, to solve these problems, the present invention was completed by researching a putty-type thermal interface material that not only maintains the properties of the putty-type thermal interface material but also ensures reworkability and/or processability. Hereinafter, embodiments of the present invention are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. In the drawings, parts unrelated to the explanation have been omitted to clearly explain the present invention, and the same reference numerals are assigned to identical or similar components throughout the specification. The putty-type thermal interface composite sheet of the present invention may be a putty-type thermal interface composite sheet having a three-layer structure in which a first thermal interface sheet, a second thermal interface sheet, and a third thermal interface sheet are sequentially laminated. The first thermal interface sheet may include a base material. Specifically, the base material of the first thermal interface sheet may comprise 82 to 98 weight% of a filler, preferably 85 to 95 weight%, more preferably 88 to 92 weight%, and 2 to 18 weight% of a binder resin, preferably 5 to 15 weight%, more preferably 8 to 12 weight%. If the filler is included in an amount less than 82 weight%, there may be a problem with reduced heat dissipation characteristics, and if it is included in an amount exceeding 98 weight%, there may be a problem with reduced compression and/or elongation. The filler of the first thermal interface sheet may include one or more selected from aluminum oxide ( Al₂O₃ ), zinc oxide (ZnO), boron nitride (BN ) , aluminum nitride (AlN), and magnesium oxide ( MgO ), and preferably may include aluminum oxide ( Al₂O₃ ). Specifically, the filler of the first thermal interface sheet may include a first filler and a second filler, and may satisfy the following condition (1). (1) A > B In the above condition (1), A represents the average particle size of the first filler and B represents the average particle size of the second filler. If condition (1) is not satisfied, there may be a problem of irregularities occurring on the surface of the first thermal interface sheet, as well as a problem of lines or wrinkles forming on the surface of the first thermal interface sheet. In addition, the first filler may have an average particle size of 8 to 18 μm, preferably 8.5 to 14 μm, more preferably 9 to 12 μm, and the second filler may have an average particle size of 1.5 to 3 μm, preferably 1.5 to 2.5 μm. Additionally, the filler of the first thermal interface sheet may comprise, based on the total weight percentage, 53 to 73 weight% of the first filler, preferably 58 to 68 weight%, more preferably 61 to 65 weight%, and 27 to 47 weight% of the second filler, preferably 32 to 42 weight%, more preferably 35 to 39 weight%. If the first filler is included in an amount less than 53 weight%, there may be a problem with reduced heat dissipation properties, and if it is included in an amount exceeding 73 weight%,