KR-102962657-B1 - APPARATUS FOR PROCESSING SUBSTRATE

Abstract

The substrate processing device of the present invention comprises a body member that rotates and is positioned adjacent to the side of a substrate, a rotating member coupled to the body member and transmitting rotational force to the body member, a plurality of first peripheral polishing members, a plurality of second peripheral polishing members having roughness different from that of the first peripheral polishing members, and a peripheral polishing member coupled to the body member. The first peripheral polishing members and the second peripheral polishing members are alternately arranged to be spaced apart from each other in the rotational direction of the body member. A first length in the direction from the center of the body member of each of the first peripheral polishing members toward the edge of the body member is different from a second length in the direction from the center of the body member of each of the second peripheral polishing members toward the edge of the body member.

Inventors

• 최세헌

Assignees

• 삼성디스플레이 주식회사

Dates

Publication Date

20260511

Application Date

20211101

Claims (20)

1. A rotating body member positioned adjacent to the side of the substrate; A rotating member coupled to the body member and transmitting rotational force to the body member; and A plurality of first peripheral polishing members and a plurality of second peripheral polishing members having a roughness different from the roughness of the first peripheral polishing members, and a peripheral polishing member coupled to the body member, The first peripheral polishing members and the second peripheral polishing members are alternately arranged to be spaced apart from each other in the rotational direction of the body member, A substrate processing apparatus characterized in that the first length in the direction from the center of the body member toward the edge of the body member of each of the first peripheral polishing members is different from the second length in the direction from the center of the body member toward the edge of the body member of each of the second peripheral polishing members.
2. A substrate processing apparatus according to claim 1, characterized in that the first peripheral polishing members face each other and the second peripheral polishing members face each other.
3. A substrate processing apparatus according to claim 1, wherein the first peripheral grinding member comprises a fine-grained finishing grinding stone and the second peripheral grinding member comprises a relatively coarse-grained roughing grinding stone.
4. A substrate processing device according to claim 3, characterized in that the first length is greater than the second length.
5. A substrate processing apparatus according to claim 4, characterized in that the second length is 50% to 90% of the first length.
6. A substrate processing apparatus according to claim 1, characterized in that the number of the first peripheral polishing members is the same as the number of the second peripheral polishing members.
7. A substrate processing apparatus according to claim 1, characterized in that, when viewed from the front, the shape of each of the first peripheral polishing members and the shape of each of the second peripheral polishing members are identical.
8. A substrate processing apparatus according to claim 7, characterized in that, when viewed from the front, each of the first peripheral polishing members has a part shape of a ring, and each of the second peripheral polishing members has a part shape of a ring.
9. A substrate processing apparatus according to claim 1, characterized in that a spaced-apart space through which abrasive water passes is formed between each of the first peripheral polishing members and each of the second peripheral polishing members.
10. In Article 1, A substrate processing device characterized by further including a central polishing member coupled to the center of the body member and having a shape protruding from the center of the rotating member toward the center of the body member.
11. A substrate processing device according to claim 10, wherein the central polishing member has a shape that protrudes more than the peripheral polishing member.
12. In claim 10, the central grinding member is, A first central polishing member coupled to the center of the body member; and A substrate processing device characterized by including a second central polishing member coupled to the first central polishing member.
13. A substrate processing device according to claim 12, characterized in that, when viewed from the side, the first central polishing member has a rectangular shape and the second central polishing member has a semicircular shape.
14. A rotating body member positioned adjacent to the side of the substrate; A rotating member coupled to the body member and transmitting rotational force to the body member; and A plurality of first peripheral polishing members and a plurality of second peripheral polishing members having a roughness different from the roughness of the first peripheral polishing members, and a peripheral polishing member coupled to the body member, The first peripheral polishing members and the second peripheral polishing members are alternately arranged to be spaced apart from each other in the rotational direction of the body member, A substrate processing device characterized in that, when viewed from the front, the outer surface of each of the first peripheral polishing members coincides with the edge of the body member, and the outer surface of each of the second peripheral polishing members is spaced apart from the edge of the body member.
15. A substrate processing apparatus according to claim 14, wherein the first peripheral polishing members face each other and the second peripheral polishing members face each other.
16. A substrate processing apparatus according to claim 14, wherein the first peripheral grinding member comprises a fine-grained finishing grinding stone and the second peripheral grinding member comprises a relatively coarse-grained roughing grinding stone.
17. A substrate processing apparatus according to claim 14, characterized in that the number of the first peripheral polishing members is the same as the number of the second peripheral polishing members.
18. A substrate processing apparatus according to claim 14, characterized in that, when viewed from the front, the shape of each of the first peripheral polishing members and the shape of each of the second peripheral polishing members are identical.
19. A substrate processing apparatus according to claim 18, characterized in that, when viewed from the front, each of the first peripheral polishing members has a part shape of a ring, and each of the second peripheral polishing members has a part shape of a ring.
20. A substrate processing apparatus according to claim 14, characterized in that a spaced-apart space through which abrasive water passes is formed between each of the first peripheral polishing members and each of the second peripheral polishing members.

Description

Apparatus for Processing Substrate The present invention relates to a substrate processing apparatus. More specifically, the present invention relates to a substrate processing apparatus for polishing a substrate. A flat panel display device is a thin, flat display device among display devices, and includes liquid crystal display devices, organic light-emitting display devices, inorganic light-emitting display devices, quantum dot display devices, etc. The flat panel display device may include a display panel that displays an image. Generally, the display panel may be formed by bonding a lower substrate and an upper substrate, on which elements necessary for image display are arranged, to form a mother panel, and then cutting it to the desired cell size. At this time, the cutting process of the mother panel may consist of a process of forming a cutting groove using a cutting wheel and a process of striking the cutting groove using a breaker, etc. Through this cutting process, the display panel may be separated into the desired size. When separating a display panel of a desired size through such a cutting process, horizontal or vertical cracks may occur on the cut surface, and defects such as plastic deformation may occur in the part where the cutting groove was formed. To eliminate these defects, a method of polishing the cut surface using an abrasive stone is used. Additionally, the abrasive stone may be used for a display device having curved edges. FIG. 1 is a perspective view showing a substrate processing apparatus according to one embodiment of the present invention. Figure 2 is a perspective view showing the substrate processing device of Figure 1. Figure 3 is a side view showing the substrate processing device of Figure 2. Figure 4 is a plan view of the substrate processing device of Figure 2 viewed from the front. FIG. 5 is a front view showing a substrate processing apparatus according to another embodiment of the present invention. FIG. 6 is a front view showing a substrate processing apparatus according to another embodiment of the present invention. FIGS. 7 and FIGS. 8 are perspective views showing the substrate of FIG. 1. FIG. 9 is a front view showing an example of processing a substrate using the substrate processing device of FIG. 2. FIG. 10 is a plan view showing an example of a substrate processed by the substrate processing device of FIG. 2. Hereinafter, a substrate processing apparatus according to embodiments of the present invention will be described in more detail with reference to the attached drawings. Identical components in the drawings will be referred to by the same reference numerals, and redundant descriptions of identical components will be omitted. FIG. 1 is a perspective view showing a substrate processing apparatus according to one embodiment of the present invention. Referring to FIG. 1, a substrate processing device (100) according to one embodiment of the present invention can polish an object by directly contacting the object to be polished. For example, the substrate processing device (100) may be provided as a grinder. In one embodiment, the substrate processing device (100) can polish the composition of a substrate (SUB) or a window member included in a display device that displays an image. Each of the substrate (SUB) and the window member may include glass, sapphire, plastic, etc. These may be used alone or in combination with each other. However, the present invention is not limited thereto, and each of the substrate (SUB) and the window member may include other materials. For example, if the substrate (SUB) includes an upper substrate and a lower substrate, a single panel may be provided as the mother panel, in which the upper substrate and the lower substrate are bonded, is cut into cell units. At this time, the substrate processing device (100) may polish the surface of the cut area. Additionally, the substrate processing device (100) may polish the edges of the substrate (SUB) so that they have a curved shape. The substrate (SUB) may be placed on the support table (10). For example, the support table (10) may include a pair of support members that support the substrate (SUB) and a variable means for adjusting the distance between the support members. The support members may have vacuum holes formed therein to adsorb the substrate (SUB). Additionally, the support table may further include a moving means for moving the substrate. The substrate (SUB) that is the target of the substrate processing device (100) according to one embodiment of the present invention may be a component included in the display device that displays an image. For example, the display device may include an organic light emitting display device (OLED), a liquid crystal display device (LCD), a field emission display device (FED), a plasma display device (PDP), an electrophoretic display device (EPD), a quantum dot display device, or an inorganic light emitting display device. FIG. 2 is a p