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KR-102962676-B1 - Optical inspection device and inspection method using same

KR102962676B1KR 102962676 B1KR102962676 B1KR 102962676B1KR-102962676-B1

Abstract

According to exemplary embodiments for achieving the above technical problem, an optical inspection device is provided. The device comprises: a first illumination configured to emit a first light; a second illumination configured to emit a second light; a beam splitter configured to reflect either the first or the second light to an element under test; and a camera configured to generate a first image of the element under test based on the first light reflected by the element under test, or to generate a second image of the element under test based on the second light reflected by the element under test, wherein the beam splitter may be configured to rotate about the optical axis of the camera.

Inventors

  • 박대서

Assignees

  • 삼성전자주식회사

Dates

Publication Date
20260507
Application Date
20201109

Claims (10)

  1. A first light configured to emit a first light; A second light configured to emit a second light; A beam splitter configured to reflect either of the first and second lights to the element under test; and A camera configured to generate a first image of the element under test based on the first light reflected by the element under test, or to generate a second image of the element under test based on the second light reflected by the element under test, An optical inspection device characterized in that the beam splitter is configured to rotate around the optical axis of the camera.
  2. In paragraph 1, An optical inspection device characterized in that the beam splitter rotates around the optical axis of the camera and is aligned toward either the first illumination or the second illumination.
  3. In paragraph 1, An optical inspection device characterized in that the first light has a wavelength different from the second light.
  4. In paragraph 1, An optical inspection device characterized by further including a processor configured to generate a difference image of the first and second images.
  5. In paragraph 4, An optical inspection device characterized by the above processor being configured to determine defects in the above-mentioned test element.
  6. A step of rotating and aligning the beam splitter toward the first light source; A step of generating a first image of a test element based on the first light generated by the first illumination above; The step of rotating and aligning the beam splitter toward the second light; and An inspection method comprising the step of generating a second image of a test element based on a second light generated by the second illumination.
  7. In paragraph 6, An inspection method characterized in that the first and second lights have different wavelengths.
  8. In paragraph 6, An inspection method characterized by further including the step of generating a difference image of the first and second images.
  9. In paragraph 8, An inspection method characterized by further including a step of determining whether the test element is defective based on the above difference image.
  10. In Paragraph 9, An inspection method characterized by further including a step of processing the test element based on whether the test element is defective.

Description

Optical inspection device and inspection method using same The technical concept of the present disclosure is to an optical inspection device and an inspection method using the same. Conventionally, substrates, semiconductor devices, components, and packages were inspected using the naked eye of operators to test semiconductor devices. Consequently, there were problems with reduced inspection reliability and speed. Recently, as part of the Fourth Industrial Revolution, various studies for factory automation are continuing. Among them, research on vision automatic inspection devices that identify product defects based on images in the visible light band is gaining attention. FIGS. 1 to 3 are drawings for illustrating an optical inspection device according to exemplary embodiments. FIG. 4 is a flowchart illustrating an inspection method according to exemplary embodiments. FIG. 5 is a graph illustrating an inspection method according to exemplary embodiments. FIG. 6 is an image illustrating an inspection method according to exemplary embodiments. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Identical components in the drawings are denoted by the same reference numerals, and redundant descriptions thereof are omitted. FIGS. 1 and FIGS. 2 are drawings illustrating an optical inspection device (100) according to exemplary embodiments. FIG. 3 is a top view illustrating first to third lights (111, 113, 115) and a beam splitter (120) included in an optical inspection device (100) according to exemplary embodiments. Referring to FIGS. 1 to 3, the optical inspection device (100) may include first to third lights (111, 113, 115), a beam splitter (120), a camera (130), a processor (140), and a controller (150). The optical inspection device (100) can non-destructively inspect a device under test (DUT). The optical inspection device (100) may be a vision automatic inspection device that generates an image regarding the appearance and shape of the device under test (DUT) and processes the image to determine whether the device under test (DUT) is defective. According to exemplary embodiments, the optical inspection device (100) can inspect the device under test (DUT) at high speed, thereby improving the productivity of the device under test (DUT) and the reliability of the inspection. The device under test (DUT) may be a semiconductor chip that has undergone a packaging process. Here, the packaging process may include a wire bonding process, a molding process, a marking process, a solder ball mounting process, etc. The device under test (DUT) may be an individualized package or a wafer-level package. The device under test (DUT) may include, for example, either a memory device chip or a non-memory device chip. According to some embodiments, the memory device may include a non-volatile NAND-type Flash memory. According to some embodiments, the memory device may include PRAM, MRAM, ReRAM, FRAM, and NOR Flash memory, etc. The memory device may be a volatile memory device in which data is lost when the power is cut off, such as DRAM and SRAM. According to some embodiments, the device under test (DUT) may include a logic chip, a measurement device, a communication device, a Light Emitting Diode (LED), a Digital Signal Processor (DSP), or a System-On-Chip (SOC), etc. Each of the first to third illuminations (111, 113, 115) may generate light having a wavelength in the visible light band, for example, in the range of about 350 nm to about 700 nm. Each of the first to third illuminations (111, 113, 115) may also generate light having a wavelength in the infrared band and the ultraviolet band. The first to third illuminations (111, 113, 115) may be different illuminations. For example, each of the first to third illuminations (111, 113, 115) may emit light of a different wavelength. Although the optical inspection device in FIG. 3 is illustrated as including three illuminations, this is for illustrative purposes only and does not limit the technical scope of the invention in any sense. For example, the optical inspection device may include two illuminations or four or more illuminations. Multiple lights included in the optical inspection device may be arranged at equal angles around the beam splitter (120), but are not limited thereto. According to other exemplary embodiments, the first to third lights (111, 113, 115) may include different types of lights. The first to third lights (111, 113, 115) may be any one of back lighting, axial diffuse lighting, structured lighting, directional lighting such as dark-field and bright-field lighting, strobe lighting, and diffused dome lighting. Here, backlighting can be used to measure the profile and edges of the device under test (DUT). Using backlighting can improve the precision of shape and dimension measurements of the device under test (DUT). Axial diffuse illumination provides light from the lateral direction