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KR-102962678-B1 - A PACKAGING BOX

KR102962678B1KR 102962678 B1KR102962678 B1KR 102962678B1KR-102962678-B1

Abstract

The packaging box of the present disclosure may include a zig-zag structured upper-left shock-prevention structure and an upper-right shock-prevention structure covering the upper part of a receiving space defined by a front wall, a back wall, a left wall, and a right wall, and may include a zig-zag structured lower-left shock-prevention structure and a lower-right shock-prevention structure covering the lower part of the receiving space.

Inventors

  • 이은혜
  • 박선홍
  • 양진규
  • 오현종
  • 이재찬
  • 천윤희

Assignees

  • 삼성전자주식회사

Dates

Publication Date
20260507
Application Date
20210517

Claims (10)

  1. A front wall, and a back wall opposite to the front wall; A left wall connecting the front wall and the back wall; and a right wall opposite to the left wall; A left-side impact-preventing structure extending from the upper part of the left wall, covering a portion of the upper part of the receiving space defined by the front wall, the rear wall, the left wall, and the right wall, and having a zig-zag structure; An upper right shock-prevention structure extending from the upper part of the right wall to face the upper left shock-prevention structure, covering another part of the upper part of the receiving space, and having a zig-zag structure; A lower left impact-preventing structure extending from the lower part of the above left wall, covering a portion of the lower part of the above receiving space, and having a zig-zag structure; A right-lower shock-prevention structure extending from the lower part of the right wall to face the above-mentioned lower-left shock-prevention structure, covering another part of the lower part of the receiving space, and having a zig-zag structure; A first upper cover extending from the upper part of the front wall and covering a part of the upper-left shock-prevention structure and a part of the upper-right shock-prevention structure; and a second upper cover extending from the upper part of the rear wall and covering another part of the upper-left shock-prevention structure and another part of the upper-right shock-prevention structure; and A first lower cover extending from the lower part of the front wall and covering a part of the lower-left shock-absorbing structure and a part of the lower-right shock-absorbing structure; and a second lower cover extending from the lower part of the rear wall and covering another part of the lower-left shock-absorbing structure and another part of the lower-right shock-absorbing structure; Includes, The above-described upper-left shock-prevention structure is, A first upper-left shock-prevention layer extending to be bent from the upper part of the above-mentioned left wall and covered by the first upper cover and the second upper cover; A second upper-left shock-prevention layer disposed below the first upper-left shock-prevention layer and extended to be bent from the first upper-left shock-prevention layer; and A third upper-left shock-prevention layer disposed below the second upper-left shock-prevention layer, covering a portion of the receiving space, and extended to be folded from the second upper-left shock-prevention layer; comprising A packaging box in which at least a portion of each of the first upper-left shock-prevention layer, the second upper-left shock-prevention layer, and the third upper-left shock-prevention layer overlap each other in a direction from the upper part of the left wall toward the lower part of the left wall.
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  3. In Article 1, The above-mentioned upper right shock-prevention structure is, A first upper right shock-prevention layer extending to be bent from the upper part of the above right wall and covered by the first upper cover and the second upper cover; A second upper right shock-prevention layer disposed below the first upper right shock-prevention layer and extended to be bent from the first upper right shock-prevention layer; and A third upper right shock-prevention layer disposed below the second upper right shock-prevention layer, covering a portion of the receiving space, and extended to be folded from the second upper right shock-prevention layer; A packaging box characterized by including
  4. In Paragraph 3, A packaging box characterized in that the thickness of the first to third upper-left shock-prevention layers and the first to third upper-right shock-prevention layers is each 3 millimeters to 10 millimeters.
  5. In Article 1, The above-mentioned lower-left shock-prevention structure is, A first lower left shock-prevention layer extending to be bent from the lower part of the above left wall and covered by the first lower cover and the second lower cover; A second lower-left shock-prevention layer disposed on top of the first lower-left shock-prevention layer and extended to be bent from the first lower-left shock-prevention layer; and A third lower-left shock-prevention layer disposed on top of the second lower-left shock-prevention layer, covering a portion of the receiving space, and extended to be folded from the second lower-left shock-prevention layer; A packaging box characterized by including
  6. In Article 5, The above-mentioned lower right shock-prevention structure is, A first right lower shock-prevention layer extending to be bent from the lower part of the above right wall and covered by the first lower cover and the second lower cover; A second lower right shock-prevention layer disposed on top of the first lower right shock-prevention layer and extended to be bent from the first lower right shock-prevention layer; and A third lower right shock-prevention layer disposed on top of the second lower right shock-prevention layer, covering a portion of the receiving space, and extended to be folded from the second lower right shock-prevention layer; A packaging box characterized by including
  7. In Article 1, A packaging box characterized in that the inner surface of the front wall facing the receiving space, the inner surface of the back wall, the inner surface of the left wall, and the inner surface of the right wall have an uneven structure in which concave and convex surfaces are repeated.
  8. In Article 1, The thickness of the upper-left shock-prevention structure and the thickness of the upper-right shock-prevention structure are different from the thickness of the lower-left shock-prevention structure and the thickness of the lower-right shock-prevention structure, and A packaging box characterized in that the number of zig-zag patterns formed by the upper-left shock-prevention structure and the upper-right shock-prevention structure is different from the number of zig-zag patterns formed by the lower-left shock-prevention structure and the lower-right shock-prevention structure.
  9. A front wall, and a back wall opposite to the front wall; A left wall connecting the front wall and the back wall; and a right wall opposite to the left wall; A left-side impact-preventing structure extending from the upper part of the left wall, covering a portion of the upper part of the receiving space defined by the front wall, the rear wall, the left wall, and the right wall, and having a zig-zag structure; An upper right shock-prevention structure extending from the upper part of the right wall to face the upper left shock-prevention structure, covering another part of the upper part of the receiving space, and having a zig-zag structure; A first upper cover extending from the upper part of the front wall and covering a part of the upper-left shock-prevention structure and a part of the upper-right shock-prevention structure; and a second upper cover extending from the upper part of the rear wall and covering another part of the upper-left shock-prevention structure and another part of the upper-right shock-prevention structure; and A first lower cover extending from the lower part of the front wall and covering a portion of the lower part of the receiving space; and a second lower cover extending from the lower part of the rear wall and covering another portion of the lower part of the receiving space; Includes, The above-described upper-left shock-prevention structure is, A first upper-left shock-prevention layer extending to be bent from the upper part of the above-mentioned left wall and covered by the first upper cover and the second upper cover; A second upper-left shock-prevention layer disposed below the first upper-left shock-prevention layer and extended to be bent from the first upper-left shock-prevention layer; and A third upper-left shock-prevention layer disposed below the second upper-left shock-prevention layer, covering a portion of the receiving space, and extended to be folded from the second upper-left shock-prevention layer; comprising A packaging box in which at least a portion of each of the first upper-left shock-prevention layer, the second upper-left shock-prevention layer, and the third upper-left shock-prevention layer overlap each other in a direction from the upper part of the left wall toward the lower part of the left wall.
  10. A front wall, and a back wall opposite to the front wall; A left wall connecting the front wall and the back wall; and a right wall opposite to the left wall; A lower left impact-preventing structure extending from the lower part of the left wall, covering a portion of the lower part of the receiving space defined by the front wall, the rear wall, the left wall, and the right wall, and having a zig-zag structure; A right-lower shock-prevention structure extending from the lower part of the right wall to face the above-mentioned lower-left shock-prevention structure, covering another part of the lower part of the receiving space, and having a zig-zag structure; A first upper cover extending from the upper part of the front wall and covering a portion of the upper part of the receiving space; and a second upper cover extending from the upper part of the rear wall and covering another portion of the receiving space; and A first lower cover extending from the lower part of the front wall and covering a part of the lower-left shock-absorbing structure and a part of the lower-right shock-absorbing structure; and a second lower cover extending from the lower part of the rear wall and covering another part of the lower-left shock-absorbing structure and another part of the lower-right shock-absorbing structure; Includes, The above-mentioned lower-left shock-prevention structure is, A first lower left shock-prevention layer extending to be bent from the lower part of the above left wall and covered by the first lower cover and the second lower cover; A second lower-left shock-prevention layer disposed on top of the first lower-left shock-prevention layer and extended to be bent from the first lower-left shock-prevention layer; and A third lower-left shock-prevention layer disposed on top of the second lower-left shock-prevention layer, covering a portion of the receiving space, and extended to be folded from the second lower-left shock-prevention layer; comprising A packaging box in which at least a portion of each of the first lower-left shock-prevention layer, the second lower-left shock-prevention layer, and the third lower-left shock-prevention layer overlap each other in a direction from the lower part of the left wall toward the upper part of the left wall.

Description

Packaging Box {A PACKAGING BOX} The technical concept of the present disclosure relates to a packaging box for semiconductor products. The packaging box may be a box that accommodates a semiconductor product and facilitates the transportation of said semiconductor product. Additionally, the packaging box may prevent the semiconductor product from being deformed by temperature and humidity, etc. The packaging box may be provided in a rectangular shape so as to accommodate the semiconductor product within its internal space. As circuits within semiconductor products become smaller and more complex, there is a risk that these circuits may be easily damaged by external impact. Recently, to prevent damage to the semiconductor product, a first packaging box for accommodating the semiconductor product and a second packaging box for accommodating the first packaging box are provided. When multiple packaging boxes are produced, the manufacturing cost of the packaging boxes may increase, and a significant amount of time may be consumed in packaging the semiconductor product. FIG. 1 is an unfolded view of a packaging box according to an exemplary embodiment of the present disclosure. FIG. 2 is an internal cross-sectional view of a packaging box according to an exemplary embodiment of the present disclosure. FIGS. 3 to 5 are drawings showing the flow of a method for manufacturing a packaging box according to an exemplary embodiment of the present disclosure. FIG. 6 is an unfolded view of a packaging box according to an exemplary embodiment of the present disclosure. FIG. 7 is an internal cross-sectional view of a packaging box according to an exemplary embodiment of the present disclosure. FIG. 8 is an unfolded view of a packaging box according to an exemplary embodiment of the present disclosure. FIG. 9 is an internal cross-sectional view of a packaging box according to an exemplary embodiment of the present disclosure. FIG. 10 is an unfolded view of a packaging box according to an exemplary embodiment of the present disclosure. FIG. 11 is an internal cross-sectional view of a packaging box according to an exemplary embodiment of the present disclosure. FIG. 12 is an unfolded view of a packaging box according to an exemplary embodiment of the present disclosure. FIG. 13 is an internal cross-sectional view of a packaging box according to an exemplary embodiment of the present disclosure. Hereinafter, embodiments of the technical concept of the present disclosure will be described in detail with reference to the attached drawings. Identical components in the drawings are denoted by the same reference numerals, and redundant descriptions thereof are omitted. FIG. 1 is an unfolded view of a packaging box (10) according to an exemplary embodiment of the present disclosure. FIG. 2 is an internal cross-sectional view of a packaging box (10) according to an exemplary embodiment of the present disclosure. A packaging box (10) according to an exemplary embodiment of the present disclosure may be a box for accommodating a semiconductor product (S). Additionally, the exterior of the assembled packaging box (10) may have a rectangular shape. Furthermore, the material of the packaging box (10) may include wooden board. In an exemplary embodiment, the packaging box (10) may include a front wall (110), a back wall (120), a left wall (210), a right wall (220), an upper-left shock-prevention structure (300), an upper-right shock-prevention structure (400), a lower-left shock-prevention structure (500), a lower-right shock-prevention structure (600), a first upper cover (710), a second upper cover (720), a first lower cover (810), a second lower cover (820), and a fixing member (910), etc. The front wall (110) of the packaging box (10) may have a rectangular shape. Specifically, the front wall (110) may have a rectangular shape defined by an upper surface (110S_U), a lower surface (110S_L), a first side surface (110S_S1), and a second side surface (110S_S2). The upper surface (110S_U) of the front wall (110) is connected to the first upper cover (710), the lower surface (110S_L) is connected to the first lower cover (810), the first side surface (110S_S1) is connected to the fixing member (910), and the second side surface (110S_S2) can be connected to the right wall (220). In an exemplary embodiment, the front wall (110) may be inscribed with information about the semiconductor product (S) inside the packaging box (10), details regarding the storage and transportation of the semiconductor product (S), etc. The back wall (120) of the packaging box (10) may be a wall opposite to the front wall (110) and may be rectangular in shape. Specifically, the back wall (120) may be rectangular in shape defined by an upper surface (120S_U), a lower surface (120S_L), a first side surface (120S_S1), and a second side surface (120S_S2). The upper surface (120S_U) of the back wall (120) is connected to the second upper cover (720), the lower surface (1