KR-102962694-B1 - LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF
Abstract
A light-emitting device according to one embodiment of the present invention comprises: a substrate; a unit light-emitting region provided on the substrate; first and second electrodes provided spaced apart from each other in the unit light-emitting region; a plurality of rod-shaped LEDs provided between the first and second electrodes; reflective contact electrodes provided on both ends of the rod-shaped LEDs to electrically connect the rod-shaped LEDs between the first and second electrodes; and a light-emitting structure provided between the first and second electrodes and extended to intersect the rod-shaped LEDs.
Inventors
- 강종혁
- 조현민
- 김대현
- 이주열
- 임현덕
Assignees
- 삼성디스플레이 주식회사
Dates
- Publication Date
- 20260512
- Application Date
- 20240911
Claims (20)
- Substrate; Rod-shaped LEDs disposed on the above substrate, arranged along a first direction, and each having a first end and a second end; A transparent light-emitting structure that extends in the first direction, overlaps with the bar-shaped LEDs, exposes the first end and the second end of each of the bar-shaped LEDs, and includes an insulating material; A first electrode overlapping with the first end of each of the above rod-shaped LEDs; and It includes a second electrode that overlaps with the second end of each of the above rod-shaped LEDs, Each of the above rod-shaped LEDs comprises: a laminate including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer arranged sequentially along a longitudinal direction from the first end to the second end; and an insulating film covering the sides of the laminate to expose the first end and the second end; a light-emitting device.
- A light-emitting device according to claim 1, wherein the first electrode is connected to the first end of each of the rod-shaped LEDs, and the second electrode is connected to the second end of each of the rod-shaped LEDs.
- In claim 2, a light-emitting device in which light is emitted from the rod-shaped LEDs through the transparent light-emitting structure.
- In Article 1, A third electrode disposed between the substrate and the first electrode and connected to the first electrode; and A light-emitting device further comprising a fourth electrode disposed between the substrate and the second electrode and connected to the second electrode.
- In claim 4, the first electrode and the second electrode are disposed on the same layer, and A light-emitting device in which the third electrode and the fourth electrode are disposed on the same layer.
- In claim 4, the first end of each of the rod-shaped LEDs is disposed between the first electrode and the third electrode, and A light-emitting device in which the second end of each of the above rod-shaped LEDs is disposed between the second electrode and the fourth electrode.
- A light-emitting device according to claim 4, wherein the transparent light-emitting structure is disposed in the same layer as at least some of the third electrode and the fourth electrode.
- A light-emitting device according to claim 4, wherein a portion of the transparent light-emitting structure is disposed between the substrate and the rod-shaped LEDs, and another portion of the transparent light-emitting structure is disposed on the rod-shaped LEDs.
- A light-emitting device according to claim 1, wherein the transparent light-emitting structure has an upper surface protruding above the rod-shaped LEDs, and the upper surface has an uneven surface.
- A light-emitting device according to claim 1, wherein each of the first electrode and the second electrode comprises a metal film comprising at least one of Ag and Cu, or a multilayer film comprising at least one of Ti/Al/Ti, ITO/Ag/ITO, and Mo/Al/Mo.
- A light-emitting device according to claim 1, wherein the transparent light-emitting structure comprises at least one of a silicon resin including SiO x , SiN x , or a scatterer.
- A light-emitting device according to claim 1, wherein the laminate further comprises an electrode layer disposed at least one of the first end and the second end.
- A light-emitting device according to claim 12, wherein the electrode layer is disposed at the second end, the first conductive semiconductor layer is in contact with the first electrode, and the electrode layer is in contact with the second electrode.
- A light-emitting device according to claim 1, wherein each of the rod-shaped LEDs is arranged parallel to the substrate.
- A light-emitting device according to claim 1, wherein the transparent light-emitting structure has a slanted side such that its width gradually decreases as it approaches the substrate.
- In claim 1, the light-emitting structure is disposed on the insulating film, the light-emitting device.
- A light-emitting device according to claim 1, wherein the light-emitting structure is disposed between the first electrode and the second electrode and is spaced apart from each of the first electrode and the second electrode.
- A light-emitting device according to claim 1, wherein the first direction is a direction intersecting the longitudinal direction.
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Description
Light Emitting Device and Fabricating Method Thereof An embodiment of the present invention relates to a light-emitting device and a method for manufacturing the same. Light-emitting diodes (hereinafter abbreviated as "LEDs") exhibit relatively good durability even under harsh environmental conditions and possess excellent performance in terms of lifespan and brightness. Recently, research to apply these LEDs to various light-emitting devices is actively underway. As part of this research, technology is being developed to fabricate ultra-small rod-shaped LEDs as small as the micro or nano scale by utilizing inorganic crystal structures, such as structures grown from nitride-based semiconductors. For instance, rod-shaped LEDs can be manufactured in a size small enough to constitute pixels of self-emissive display panels. FIG. 1 shows a rod-shaped LED according to one embodiment of the present invention. FIG. 2 is a structural diagram showing a light-emitting device according to one embodiment of the present invention. FIGS. 3a to 3e are circuit diagrams showing a unit area of a light-emitting device according to an embodiment of the present invention, and in particular, circuit diagrams showing an example of a pixel constituting a passive light-emitting display panel. FIGS. 4a to 4c are circuit diagrams showing a unit area of a light-emitting device according to an embodiment of the present invention, and in particular, circuit diagrams showing an example of a pixel constituting an active light-emitting display panel. FIG. 5 is a plan view showing a unit light-emitting area of a light-emitting device according to one embodiment of the present invention, and in particular, a plan view showing a light-emitting area of each pixel. FIG. 6 is a cross-sectional view showing an example of a cross-section along the line I-I' of FIG. 5. FIG. 7 is a plan view for explaining the luminance uniformization effect according to the embodiment shown in FIG. 5 and FIG. 6. FIGS. 8a to 8e are cross-sectional views sequentially illustrating a method for manufacturing a light-emitting device according to an embodiment of the present invention. FIG. 9 is a cross-sectional view showing a unit light-emitting area of a light-emitting device according to one embodiment of the present invention. FIG. 10 is a cross-sectional view showing a unit light-emitting region of a light-emitting device according to one embodiment of the present invention. FIG. 11 is a cross-sectional view showing a unit light-emitting region of a light-emitting device according to one embodiment of the present invention. FIGS. 12a to 12d are cross-sectional views sequentially illustrating a method for manufacturing a light-emitting device according to an embodiment of the present invention. Hereinafter, embodiments of the present invention and other matters necessary for those skilled in the art to easily understand the content of the present invention will be described in detail with reference to the attached drawings. However, the embodiments described below are merely illustrative, regardless of their expression. That is, the present invention is not limited to the embodiments disclosed below but may be implemented in various modified forms. Furthermore, when a part is described as being connected to another part in the following description, this includes not only cases where they are directly connected but also cases where they are connected with other elements in between. Meanwhile, some components in the drawings that are not directly related to the features of the present invention may be omitted to clearly illustrate the invention. Additionally, some components in the drawings may be depicted with their size or proportions somewhat exaggerated. Throughout the drawings, identical or similar components have been assigned the same reference numbers and symbols whenever possible, even if they are shown in different drawings. According to one embodiment of the present invention, a light-emitting device including a rod-shaped LED (LD) is provided. First, a rod-shaped LED (LD) is described, and then a light-emitting device to which the rod-shaped LED (LD) is applied is described. FIG. 1 is a perspective view showing a rod-shaped LED (LD) according to one embodiment of the present invention. According to the embodiment, FIG. 1 shows a cylindrical rod-shaped LED (LD), but the shape of the rod-shaped LED (LD) according to the present invention is not limited thereto. Referring to FIG. 1, a rod-shaped LED (LD) according to one embodiment of the present invention comprises first and second conductive semiconductor layers (110, 130) and an active layer (120) interposed between the first and second conductive semiconductor layers (110, 130). For example, the rod-shaped LED (LD) may be implemented as a laminate in which the first conductive semiconductor layer (110), the active layer (120), and the second conductive semiconductor layer (130) are sequentially stacked. A