KR-102962758-B1 - Multi-light source therapy device
Abstract
The present application provides a multi-light source therapy device comprising a housing, a main control panel mounted within the housing, a light source electrically connected to the main control panel, a power assembly, a fan, and a semiconductor cooling member; the semiconductor cooling member comprises an intermediate semiconductor particle layer and hot and cold surfaces at both ends; a light emission port is formed on the front surface of the therapy device; the light source comprises an IPL light source and further comprises a tungsten filament light source and/or a carbon filament light source; the light emission port is formed by a transparent substrate mounted on the front surface of the housing; the cold surface of the semiconductor cooling member and the transparent substrate are heat-transferably connected to cool the transparent substrate, or the transparent substrate is directly used as the cold surface of the semiconductor cooling member; and light generated by the light source passes through the light emission port and acts on the skin to perform cosmetic or therapeutic treatment.
Inventors
- 저우잉
- 리빙
Assignees
- 핀산 일렉트로닉 테크 (둥관) 컴퍼니 리미티드
Dates
- Publication Date
- 20260508
- Application Date
- 20230906
- Priority Date
- 20230417
Claims (12)
- A multi-light source therapy device comprising: a housing; a main control panel mounted within the housing; two light sources electrically connected to the main control panel and arranged with an upper and lower spacing, wherein the two light sources comprise an IPL light source and a tungsten filament light source or a carbon filament light source; a light reflector comprising a first arc-shaped surface arranged to surround the upper light source among the two light sources and a second arc-shaped surface arranged to surround the lower light source; a power assembly; a fan mounted on the rear side of the light reflector within the housing; and a semiconductor cooling member, wherein the semiconductor cooling member comprises an intermediate semiconductor particle layer and hot and cold surfaces at both ends; and a light emission port formed on the front surface. The light emission port is formed of a transparent substrate mounted within the front end of the housing; and the cold surface of the semiconductor cooling member is connected to the transparent substrate in a way that allows heat transfer to cool the transparent substrate, or the transparent substrate is directly used as the cold surface of the semiconductor cooling member; The light generated by the above light source passes through the light emission port and then acts on the skin to perform cosmetic or therapeutic treatment, and A first ventilation opening is formed near the light source on the lower surface of the housing, and the fan includes a housing and a rotating blade, and a second ventilation opening and a third ventilation opening are formed on the upper and rear sides of the housing of the fan, and A multi-light source therapy device characterized by the formation of a heat dissipation passage in which air enters the housing of the multi-light source therapy device from the first vent and absorbs heat from the light reflector to be converted into hot air, and this hot air enters the space within the housing of the fan from the second vent and is discharged from the third vent.
- In paragraph 1, The semiconductor cooling member is annular and attached to the back surface of the transparent substrate to perform cooling around the light emission hole, the annular middle region of the semiconductor cooling member is a through hole through which light generated by a light source passes, and the front surface of the transparent substrate is in contact with the skin; or, one or more semiconductor cooling members are attached to one or more sides around the transparent substrate to cool the sides of the light emission hole; A multi-light source therapy device characterized in that, when the transparent substrate is the cold surface of the semiconductor cooling member, one or more groups of low-temperature end circuits are formed in the transparent substrate, and the one or more groups of low-temperature end circuits are welded to correspond to the low-temperature end of one or more groups of semiconductor particle layers and electrically connected, and the high-temperature end of each group of semiconductor particle layers is the hot surface, and a high-temperature end circuit is formed on the hot surface and welded to the high-temperature end of the semiconductor particle layer and electrically connected; after the low-temperature end circuit is electrically connected to the low-temperature end of the semiconductor particle layer and the high-temperature end circuit is electrically connected to the high-temperature end of the semiconductor particle layer, an internal circuit of the semiconductor cooling member is formed, and the internal circuit is electrically connected to a control unit through a positive and a negative electrode, and after the circuit conducts, a temperature difference is formed between the cold surface and the hot surface of the transparent substrate.
- In paragraph 2, A multi-light source therapy device characterized by the above-mentioned semiconductor cooling member having a temperature sensor embedded therein; the temperature sensor being located in an intermediate semiconductor particle layer to come into contact with the hot or cold surface and directly detect the temperature of the cold or hot surface; the positive and negative electrodes of the temperature sensor and the positive and negative electrodes of the semiconductor particle layer being drawn out of the semiconductor cooling member and electrically connected to a control unit, and the control unit being placed on the main control panel or an independent control board to control the temperature of the cold or hot surface so that it is maintained constant within a preset temperature range.
- In claim 1, The hot surface of the semiconductor cooling member is one or a combination of a heat pipe, a vapor chamber, or a thermal conductive substrate made of a single thermally conductive material, and The hot surface of the above semiconductor cooling member is connected to a heat dissipation assembly, and The above-described heat dissipation assembly comprises one or a combination of a heat pipe, a vapor chamber, a heat conduction structure of a single thermally conductive material, or a heat dissipation piece. A multi-light source therapy device characterized in that a heat dissipation member is disposed in the light reflector; and the heat dissipation member is selected from one or a combination of a heat dissipation piece, a heat pipe, a vapor chamber, or a heat-conducting element made of a single thermally conductive material.
- In claim 1, A filter is installed between the light source and the light emission port, and light generated by the light source is filtered by the filter and then projected onto the light emission port. A multi-light source therapy device characterized by the above filter comprising a transparent substrate and a coating layer on the transparent substrate.
- In claim 5, The multi-light source therapy device described above is equipped with a plurality of filters or a filter having a plurality of divided regions, and the plurality of filters or the plurality of divided regions are characterized by passing light of different wavelength bands.
- In claim 6, A multi-light source therapy device characterized in that an insertion/separation port is formed in the housing of the multi-light source therapy device, the insertion/separation port is located between a light source and a light emission port, and switching between multiple filters is achieved by inserting or removing a filter through the insertion/separation port.
- In claim 6, A multi-light source therapy device characterized in that a motor, a screw, and a nut connector are mounted within the housing of the multi-light source therapy device; the output shaft of the motor is connected to the screw as an axis to rotate synchronously, the screw and the nut connector are connected to each other by threads, and the nut connector is connected to a filter.
- In any one of claims 1 to 8, The multi-light source therapy device comprises a radio frequency (RF) assembly or an EMS assembly, wherein the radio frequency (RF) assembly or the EMS assembly comprises one or more pairs of radio frequency (RF) electrodes or EMS electrodes; wherein the one or more pairs of radio frequency (RF) electrodes or EMS electrodes are mounted on the front surface of the transparent substrate or the housing of the multi-light source therapy device, or are connected to the front end of the multi-light source therapy device through a radio frequency (RF) attachment head or an EMS attachment head; wherein the radio frequency (RF) electrodes or EMS electrodes are electrically connected to a main control panel or an independent control board; and wherein the main control panel or the independent control board controls the radio frequency (RF) electrodes or EMS electrodes to generate a radio frequency (RF) current or EMS current acting on the skin.
- In any one of claims 1 to 8, The above power assembly includes a battery and/or power interface; A multi-light source therapy device characterized in that the above-mentioned power interface is electrically connected to a main control panel, and a through hole is formed in the housing.
- In any one of claims 1 to 8, The above tungsten filament light source or carbon filament light source comprises a transparent lampshade and a light-emitting material mounted within the transparent lampshade, and the transparent lampshade is in a vacuum state or filled with an inert gas or a halogen gas; The light-emitting material of the above tungsten filament light source is a tungsten filament; and the light-emitting material of the above carbon filament light source is a carbon filament, A multi-light source therapy device characterized by the tungsten filament light source or carbon filament light source generating full-spectrum light.
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Description
Multi-light source therapy device This application relates to the field of beauty and skin care equipment technology, and in particular to a multi-light source therapy device. Most beauty devices on the market utilize a single IPL light source for skin care procedures such as hair removal, whitening, and skin regeneration. While higher energy levels in IPL sources lead to greater therapeutic effects, they are also accompanied by varying degrees of burns and pain. Furthermore, higher energy levels result in slower flash speeds and shorter lamp lifespans. Because IPL sources are strong pulsed light with short emission times and high peak energy, they lack spectral continuity. The utility of lamp light sources is significantly reduced when precise wavelength bands are required for treatments (e.g., DPL) based on various skin tones and specific requirements (e.g., melasma removal, whitening, skin regeneration, wrinkle improvement). Additionally, the light generated by IPL sources has a limited near-infrared spectrum above 1200nm, making it impossible to select the near-infrared band for beauty procedures. Due to the limited wavelength range and low output of light generated by IPL sources, they cannot efficiently and rapidly resolve various skin issues. Conventional beauty devices also use a single LED light source for skin regeneration. However, the light output of LED sources is relatively low, making it difficult to efficiently and rapidly resolve various skin problems. FIGS. 1 and FIGS. 2 are perspective views of a multi-light source therapy device at various angles according to a first embodiment of the present application. FIG. 3 is an exploded view of a multi-light source therapy device according to the first embodiment of the present application. FIG. 4 is a cross-sectional view of a multi-light source therapy device according to the first embodiment of the present application. FIG. 5 is a perspective view of a transparent substrate cooling member according to an embodiment of the present application. FIG. 6 is a cross-sectional view of a multi-light source therapy device according to a second embodiment of the present application. FIG. 7 is an exploded view of a multi-light source therapy device according to the third embodiment of the present application. FIG. 8 is a cross-sectional view of a multi-light source therapy device according to the third embodiment of the present application. FIG. 9 is a perspective view of a transparent substrate cooling member in which a transparent substrate and a semiconductor cooling member are integrally formed. FIG. 10 is a cross-sectional view of a multi-light source therapy device according to the fourth embodiment of the present application. FIG. 11 is an exploded view of a multi-light source therapy device according to the fifth embodiment of the present application. FIG. 12 is a schematic cross-sectional view of a multi-light source therapy device according to the fifth embodiment of the present application. FIG. 13 is a schematic cross-sectional view of the conversion embodiment of FIG. 12. Figure 14 is a structural diagram of an RF/EMS accessory head. FIG. 15 is a schematic diagram of a heat dissipation system according to an embodiment of the present application. FIGS. 16 to 18 are schematic diagrams of various embodiments of the semiconductor cooling member, heat sink, and fan combined according to the present application. FIG. 19 is a schematic diagram of a semiconductor cooling member according to an embodiment of the present application. FIG. 20 is a schematic diagram of a cross-sectional semiconductor cooling member combined with a transparent substrate according to an embodiment of the present application. FIG. 21 is a schematic diagram of a double-sided semiconductor cooling member combined with a transparent substrate according to an embodiment of the present application. FIG. 22 is a schematic diagram of a transparent substrate semiconductor cooling member according to an embodiment of the present application. FIG. 23 is a schematic diagram of a transparent substrate semiconductor cooling member according to another embodiment of the present application. FIG. 24 is a schematic diagram of a semiconductor cooling member according to another embodiment of the present application. FIG. 25 is a schematic diagram of a semiconductor cooling member of FIG. 23 combined with a transparent substrate according to an embodiment of the present application. FIGS. 26 and 27 are schematic diagrams of a transparent substrate semiconductor cooling member according to some embodiments of the present application. Exemplary embodiments of the present application are described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present application are illustrated in the drawings, it should be understood that the present application may be embodied in various forms and is not limited to the embodiments presented herein. Conversely,