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KR-102962803-B1 - Apparatus for processing substrate

KR102962803B1KR 102962803 B1KR102962803 B1KR 102962803B1KR-102962803-B1

Abstract

The present invention relates to a substrate processing device that prevents contamination of the inside and outside of a substrate or gas supply pipe caused by foreign substances by forming a bidirectional filter in a gas adapter that serves as an intermediate for gas supply. The device comprises: a process chamber having a processing space formed inside to process a substrate; and a gas supply device located in the processing space and supplying gas to a plurality of substrates stacked in a boat. The gas supply device may include: a gas injection nozzle pipe having a gas injection hole formed to inject the gas into the processing space; and a gas adapter installed in the process chamber, which receives the gas from the outside, transmits it to the gas injection nozzle pipe, and includes a filter unit capable of removing foreign substances contained in the gas.

Inventors

  • 김기준

Assignees

  • 주식회사 원익아이피에스

Dates

Publication Date
20260512
Application Date
20211122

Claims (15)

  1. A process chamber having a processing space formed inside to process a substrate; and A gas supply device that supplies gas to a plurality of substrates stacked on a boat and located in the processing space; The above gas supply device is, A gas injection nozzle tube having a gas injection hole formed therein to inject the gas into the processing space; and A gas adapter installed in the process chamber, receiving the gas from the outside and delivering it to the gas injection nozzle tube, and including a filter section capable of removing foreign substances contained in the gas; Includes, The above filter portion is a porous metal material having open microcomplex channels formed by the sintering of metal powder on the sides and front ends to capture foreign substances, and The above gas adapter is, A horizontal extension installed by penetrating a through hole formed in the side wall of the process chamber, with a first flow path formed inside; A vertical extension formed to extend in the direction of the gas injection nozzle tube from the horizontal extension, having a second flow path formed inside that communicates with the first flow path, and having the filter part formed in at least a part of the second flow path; and A fastening outer casing formed in a shape that surrounds the vertical extension so as to form a spaced-apart space by a distance from at least a portion of the vertical extension; A substrate processing device including
  2. In Article 1, The above filter unit is, A substrate processing device, comprising a bidirectional filter installed between the gas injection nozzle tube and the gas adapter to filter the gas supplied in the forward direction from the gas adapter to the gas injection nozzle tube, or to filter the gas flowing in the reverse direction from the gas injection nozzle tube to the gas adapter.
  3. In Article 1, A substrate processing device in which the filter unit is integrally formed with the gas adapter and welded or bonded to the gas adapter so as to deliver gas to the gas injection nozzle tube.
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  6. In Article 1, A substrate processing device in which the filter portion is integrally formed on the side and top surface of the vertical extension portion.
  7. In Article 1, A substrate processing device in which the filter portion is integrally formed on the uppermost surface of the vertical extension portion.
  8. In Article 1, A substrate processing device in which the filter portion is integrally formed on the side of the vertical extension portion.
  9. In Article 8, A substrate processing device in which the lowest part of the above filter section is formed higher than the lowest part of the above fastening outer casing.
  10. In Article 1, The above gas supply device is, A key device installed on the gas adapter to prevent the gas injection nozzle tube from rotating freely by being constrained to the gas adapter, thereby preventing rotation of the gas injection nozzle tube; A substrate processing device further comprising
  11. In Article 10, The above-mentioned connecting outer casing is formed to be in close contact with the outer diameter surface of the lower portion of the gas injection nozzle tube so as to be detachably assembled with the gas injection nozzle tube, and The above key device is, A key member having a key projection formed on its inner surface that is inserted into a through-hole formed on the outer diameter surface of the fastening outer casing and inserted into a key groove formed at the lower end of the gas injection nozzle tube; and A key holder formed in the shape of a half pipe overall, inserted into the through window and coupled with the key groove portion, covering the outer diameter surface of the key member to secure the key member to the coupling outer tube portion, and having a step formed at the entrance portion so as to be coupled with the coupling portion formed on the upper surface of the coupling outer tube portion; A substrate processing device including
  12. In Article 11, A substrate processing device in which the above key holder is made of an elastic metal material having elastic restoring force so that the above inlet portion can be elastically opened and forcibly fitted onto the outer diameter surface of the above gas injection nozzle tube.
  13. In Article 11, A substrate processing device in which the above key projection is formed to protrude vertically in the inner diameter surface of the key member so as to be inserted into the key groove formed vertically in the outer diameter surface of the gas injection nozzle tube.
  14. In Article 11, The above key holder is a substrate processing device having a verification window formed in a portion corresponding to the key member so as to check the assembly state of the key member.
  15. In Article 1, The above process chamber is a substrate processing device comprising a vertical reactor or a vertical diffusion furnace.

Description

Apparatus for processing substrate The present invention relates to a substrate processing device, and more specifically, to a substrate processing device that prevents contamination of the inside and outside of the substrate and gas supply pipe caused by foreign substances by forming a bidirectional filter in a gas adapter that serves as an intermediate for gas supply. A substrate processing device is a device for depositing insulating films, protective films, oxide films, metal films, etc., on a substrate such as a wafer, and a reactor can be exemplified as such. A reactor is a device that deposits a thin film on a wafer through high-temperature heat treatment, and a boat, which is a type of wafer holder, can be used to process a large number of wafers at once. Here, the boat is configured to charge wafers in multiple layers in fixed units (e.g., 180 wafers) and can be loaded into or unloaded into the reactor. In addition, the reactor may be equipped with a gas supply device comprising a gas injection nozzle tube made of quartz material having a plurality of gas injection holes formed to supply gas to each wafer, a gas adapter made of metal material supporting the gas injection nozzle tube, and a gas supply tube supplying gas to the gas adapter. However, the gas supply device of such conventional substrate processing apparatus had many problems, such as foreign substances being mixed into the gas supplied in the forward direction from the gas adapter toward the gas injection nozzle tube, thereby adversely affecting the substrate, or foreign substances in the gas flowing in the reverse direction from the gas injection nozzle tube toward the gas adapter contaminating not only the gas adapter but also the gas supply tube, thereby adversely affecting subsequent processes. FIG. 1 is a cross-sectional view schematically showing a substrate processing apparatus according to some embodiments of the present invention. Figure 2 is an enlarged cross-sectional view showing the gas supply device of the substrate processing device of Figure 1 in enlarged form. FIG. 3 is a perspective view of the usage state showing the gas supply device of the substrate processing device of FIG. 2 installed. FIG. 4 is a perspective view showing the gas supply device of the substrate processing device of FIG. 2. Figure 5 is an exploded perspective view showing the gas supply device of the substrate processing device of Figure 4. FIG. 6 is an enlarged perspective view showing the key device of the gas supply device of the substrate processing device of FIG. 5. FIG. 7 is a partially cutaway perspective view showing the gas adapter of the gas supply device of the substrate processing device of FIG. 6. Figure 8 is a cross-sectional view showing the gas supply device of the substrate processing device of Figure 6. Hereinafter, several preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The embodiments of the present invention are provided to more fully explain the invention to those skilled in the art, and the following embodiments may be modified in various different forms, and the scope of the invention is not limited to the following embodiments. Rather, these embodiments are provided to make the disclosure more faithful and complete and to fully convey the spirit of the invention to those skilled in the art. In addition, the thickness or size of each layer in the drawings is exaggerated for convenience and clarity of explanation. Hereinafter, embodiments of the present invention are described with reference to drawings that schematically illustrate ideal embodiments of the present invention. In the drawings, variations of the illustrated shapes may be expected, for example, depending on manufacturing techniques and/or tolerances. Accordingly, embodiments of the inventive concept should not be interpreted as being limited to specific shapes of the areas illustrated herein, but should include, for example, variations in shape resulting from manufacturing. FIG. 1 is a cross-sectional view schematically showing a substrate processing device (100) according to some embodiments of the present invention, FIG. 2 is an enlarged cross-sectional view showing a gas supply device (20) of the substrate processing device (100) of FIG. 1 in enlarged view, and FIG. 3 is a perspective view showing the state in which the gas supply device (20) of the substrate processing device (100) of FIG. 2 is installed. First, as illustrated in FIGS. 1 to 3, a substrate processing apparatus (100) according to some embodiments of the present invention may include a process chamber (10) in which a processing space (A) is formed inside to process a substrate (1), such as a wafer, and a gas supply device (20) that supplies gas (G) to a plurality of substrates (1) stacked in a vertical boat (2) located in the processing space (A). For example, as illustrated in FIGS. 1 to 3, the process chamber (10) may include