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KR-102962854-B1 - PCB FOR THERMOELECTRIC ELEMENT PCB AND METHOD FOR MANUFACTURING THE SAME

KR102962854B1KR 102962854 B1KR102962854 B1KR 102962854B1KR-102962854-B1

Abstract

The present disclosure relates to the technical field of semiconductors and thermoelectric devices, and specifically relates to a method for manufacturing a printed circuit board for a thermoelectric device. More specifically, the method for manufacturing the printed circuit board comprises the steps of: providing a substrate; forming an insulating layer on the upper surface of the substrate by 3D printing; patterning on the insulating layer with a dry film or a photosensitive material; forming an electrode layer with a first material on the insulating layer; forming a second material layer with a second material on the electrode layer; and a lift-off step of forming a patterned electrode including the first material and the second material by removing the dry film or the photosensitive material to remove the first material and the second material formed on the dry film or the photosensitive material.

Inventors

  • 이태경

Assignees

  • 알에프에이치아이씨 주식회사

Dates

Publication Date
20260511
Application Date
20240425

Claims (20)

  1. Step of providing a substrate (S100); Step of forming an insulating layer on the upper surface of the above substrate by 3D printing (S200); A step (S300) of patterning on the insulating layer using a dry film or a photosensitive material; Step (S400) of forming an electrode layer with a first electrically conductive material on the insulating layer; A step (S500) of forming a second material layer as a second material having solderability on the electrode layer to form a multilayer composed of the electrode layer and the second material layer; and A lift-off step (S600) for forming a pattern electrode including the first material and the second material by removing the dry film or the photosensitive material to remove the first material and the second material formed on the dry film or the photosensitive material. Includes, After the above lift-off step (S600), The method further includes the step (S700) of forming a third material layer to improve electrical characteristics as a third material on the lower surface of the substrate, and A method for manufacturing a printed circuit board, wherein the above 3D printing is performed using an ink comprising alumina powder and a resin, and the droplets of the ink are sintered at a temperature equal to or lower than 250 degrees Celsius.
  2. delete
  3. In paragraph 1, A method for manufacturing a printed circuit board, wherein the above 3D printing is performed in parallel on a plurality of dies included in the substrate using a plurality of inkjet nozzles.
  4. In paragraph 1, A method for manufacturing a printed circuit board in which the insulating layer is composed of alumina.
  5. In paragraph 1, A method for manufacturing a printed circuit board, wherein the insulating layer has a thickness of 50 μm to 100 μm.
  6. In paragraph 1, A method for manufacturing a printed circuit board, wherein the first material is silver (Ag), and the electrode layer is formed by 3D printing.
  7. In paragraph 6, A method for manufacturing a printed circuit board, wherein the electrode layer has a thickness of 20 μm to 30 μm.
  8. In paragraph 1, A method for manufacturing a printed circuit board, wherein the first material is copper (Cu), and the electrode layer is formed by deposition.
  9. In paragraph 8, A method for manufacturing a printed circuit board, wherein the electrode layer has a thickness of 10 μm to 20 μm.
  10. In paragraph 1, A method for manufacturing a printed circuit board, wherein the substrate is a diamond substrate, a copper-diamond (Cu-diamond; copper-diamond) substrate, or a silver-diamond (Ag-diamond; silver-diamond) substrate.
  11. In paragraph 1, A method for manufacturing a printed circuit board, wherein the second material is tin (Sn), and the second material layer is formed by plating.
  12. In paragraph 1, A method for manufacturing a printed circuit board, wherein the second material layer has a thickness of 0.2 μm to 10 μm.
  13. delete
  14. In paragraph 1, A method for manufacturing a printed circuit board, wherein the third material is nickel-tin (Ni-Sn) and the third material layer is formed by plating.
  15. In paragraph 1, A method for manufacturing a printed circuit board, wherein the third material layer has a thickness of 0.2 μm to 10 μm.
  16. Substrate; An insulating layer formed on the upper surface of the above substrate by 3D printing; A pattern electrode formed on the insulating layer, comprising a multilayer of an electrode layer formed of a first electrically conductive material on the insulating layer and a second material layer formed of a second solderable material on the electrode layer; and It includes a third material layer formed as a third material on the lower surface of the above substrate to improve electrical characteristics, and A printed circuit board, wherein the above 3D printing is performed using an ink comprising alumina powder and a resin, and the droplets of the ink are sintered at a temperature equal to or lower than 250 degrees Celsius.
  17. In claim 16, A printed circuit board in which the insulating layer is composed of alumina, and the thickness of the insulating layer is 50 μm to 100 μm.
  18. In claim 16, A printed circuit board in which the first material is silver (Ag), and the thickness of the electrode layer is 20 μm to 30 μm.
  19. In claim 16, A printed circuit board in which the first material is copper (Cu), and the thickness of the electrode layer is 10 μm to 20 μm.
  20. In claim 16, A printed circuit board, wherein the substrate is a diamond substrate, a copper-diamond (Cu-diamond; copper-diamond) substrate, or a silver-diamond (Ag-diamond; silver-diamond) substrate.

Description

Printed circuit board for thermoelectric elements and method for manufacturing the same The present disclosure relates to the technical field of semiconductors and thermoelectric devices, specifically to the manufacture of a PCB (printed circuit board) for a thermoelectric device, and more specifically to a method for manufacturing said PCB using 3D printing, such as inkjet printing, in order to improve the performance of the thermoelectric device. Conventional thermoelectric devices have been manufactured using ceramic boards. While ceramics possess excellent insulation properties, their low heat dissipation efficiency limits thermoelectric conversion efficiency. Consequently, this could lead to a degradation in the overall performance of conventional thermoelectric devices. Therefore, the inventors intend to propose a PCB manufacturing method that can overcome the heat dissipation limitations of conventional ceramic materials and improve the efficiency of thermoelectric elements. For the purpose of understanding the present invention, embodiments will be described with reference to the accompanying drawings to illustrate the structure of a printed circuit board (PCB) for a thermoelectric element as shown in this disclosure. These are merely non-limiting examples, and it is obvious that a person skilled in the art to which this disclosure pertains (hereinafter referred to as "person skilled in the art") can obtain other drawings based on these drawings without further effort to arrive at another invention. FIG. 1 is a flowchart showing the main steps of a method for manufacturing a printed circuit board according to the present disclosure. FIG. 2a is an exemplary side cross-sectional view of a printed circuit board according to the present disclosure, and FIG. 2b is an exemplary side cross-sectional view of the printed circuit board shown in FIG. 2a before lift-off. FIG. 3 is a conceptual diagram illustrating a method in which 3D printing is performed in parallel on a plurality of dies included in a substrate using a plurality of inkjet nozzles according to one embodiment of the printed circuit board manufacturing method of the present disclosure. FIG. 4 is a plan view of said substrate conceptually illustrating some processes of a method for manufacturing a printed circuit board according to the present disclosure. FIGS. 5 and 6 are drawings showing exemplary structures of pattern electrodes formed on a substrate, including an electrode layer and a second material layer, in a printed circuit board according to the present disclosure. All prior art cited in this disclosure is incorporated by reference in its entirety as if presented herein. Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this specification. The following detailed description regarding the processes and the principles of the construction of semiconductor packages according to the present disclosure refers to the accompanying drawings, which illustrate specific embodiments in which the present invention may be implemented in order to clarify the objects, technical solutions, and advantages of the invention as set forth in the present disclosure. In the description with reference to the accompanying drawings, identical components are given the same reference numerals regardless of the drawing symbols, and redundant descriptions thereof are omitted. It will be understood that the structure of the substrate and semiconductor package according to the present disclosure does not have the length ratios as shown in the drawings, and that the dimensions of each part of the drawings are shown merely for illustrative purposes and do not limit the scope of the invention. For example, the dimensions of some elements shown in the drawings are intended to aid in understanding various embodiments. Furthermore, the description and drawings are not meant to be in the order described. A person skilled in the art will understand that operations and/or steps described or illustrated in a particular order may not require any special limitation regarding such order. Accordingly, specific structural or functional descriptions of the embodiments are disclosed merely for illustrative purposes and may be modified and implemented in various forms. And while terms such as "first" or "second" may be used to describe various components, these terms should be interpreted solely for the purpose of distinguishing one component from another. For example, the first component may be named the second component, and similarly, the second component may be named the first component. When it is stated that