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KR-102962987-B1 - CONTROL METHOD, MOLDING APPARATUS, AND ARTICLE MANUFACTURING METHOD

KR102962987B1KR 102962987 B1KR102962987 B1KR 102962987B1KR-102962987-B1

Abstract

The present invention provides a method for performing a molding process to mold a composition on a substrate using a member, the method comprising: an acquisition step of acquiring an index representing the intensity of reflected light from a substrate by irradiating light onto the substrate; a determination step of determining whether a predetermined pretreatment required to perform the molding process has been performed on the substrate based on the index acquired in the acquisition step; and a molding step of performing the molding process on the substrate when it is determined that the pretreatment has been performed on the substrate.

Inventors

  • 아사다 구니히코

Assignees

  • 캐논 가부시끼가이샤

Dates

Publication Date
20260511
Application Date
20230710
Priority Date
20220719

Claims (20)

  1. A method for performing a molding process to form a composition on a substrate using a component, and A acquisition step of acquiring an index representing the intensity of reflected light from the substrate by irradiating light onto the substrate, and If the acquired indicator satisfies a predetermined condition, the molding step of performing the molding process on the substrate is included, and A method in which the above indicator is obtained as a unique value corresponding to the type of pretreatment required for the substrate to perform the above molding process.
  2. In paragraph 1, Based on the above-mentioned indicators obtained, the method further includes a determination step for determining whether the pretreatment required to perform the molding process has been performed on the substrate, and A method in which, if the acquired indicator satisfies the predetermined condition, it is determined that the necessary pretreatment has been performed on the substrate, and the molding treatment is performed on the substrate.
  3. In paragraph 1, A method comprising at least one of the types of pretreatment to be performed on the substrate, the method of forming an adhesive layer for bonding the substrate and the composition to each other, forming a flattened film, and liquefying the surface of the substrate with respect to the composition.
  4. In paragraph 1, A method comprising at least one of the types of pretreatment to be performed on the substrate, wherein the pretreatment to be performed on the substrate comprises applying a treatment agent to promote the filling of the composition between the member and the substrate, and applying a treatment agent to leave the composition on the substrate side when separating the member from the cured composition.
  5. In paragraph 2, In the above acquisition step, the indicator is acquired for each of the plurality of parts on the substrate, and A method in which, in the above judgment step, it is determined whether the necessary preprocessing has been performed on the substrate based on the representative value of the indicator acquired for the plurality of parts in the above acquisition step.
  6. In paragraph 1, A method in which, in the above acquisition step, at least one of the brightness and contrast of an image acquired by capturing the substrate is acquired as the indicator.
  7. In paragraph 1, A method in which, in the above acquisition step, at least one of the brightness and contrast of an image acquired by capturing a mark provided on the substrate is acquired as the indicator.
  8. In paragraph 1, A method in which, in the above acquisition step, the rate of change in the intensity of the reflected light acquired by changing the irradiation conditions for irradiating light onto the substrate is acquired as the indicator.
  9. In paragraph 8, A method in which the above-mentioned investigation conditions include at least one of the intensity and wavelength of light irradiated onto the substrate.
  10. In paragraph 2, A method in which, in the above judgment step, it is determined whether the necessary preprocessing has been performed on the substrate based on whether the indicator obtained in the above acquisition step is within an acceptable range.
  11. In Paragraph 10, A method in which the above-mentioned necessary pretreatment is performed and the above-mentioned molding treatment is not performed, using a reference substrate to set the above-mentioned acceptable range.
  12. In paragraph 1, The above acquisition step further includes a calibration step for calibrating measurement conditions for measuring the indicator, and A method in which, in the above calibration step, the measurement conditions are calibrated such that an indicator measured under the above measurement conditions for an object different from the substrate is within a target range.
  13. In Paragraph 12, The above object is a stage configured to hold the above substrate, and A method in which, in the above calibration step, the measurement condition is calibrated such that the indicator measured under the above measurement condition for a reference mark provided on the stage is within the above target range.
  14. In paragraph 2, A method further comprising a notification step of notifying that the necessary pretreatment has not been performed on the substrate without performing the molding process on the substrate when it is determined that the necessary pretreatment has not been performed on the substrate.
  15. In paragraph 2, When it is determined that the above-mentioned necessary pretreatment has been performed on the substrate, the method further includes a determination step for determining a processing unit to be used to perform the molding treatment among a plurality of processing units each configured to perform the molding treatment. The step of executing the above molding process is executed in the processing unit determined in the above determination step, a method.
  16. In paragraph 15, A method in which the time required from the above acquisition step to the judgment in the above judgment step is shorter than the time required to execute the above molding process.
  17. A method for performing a molding process to form a composition on a substrate using a component, and A acquisition step of acquiring an index representing the intensity of reflected light from the substrate by irradiating light onto the substrate, and If the acquired indicator satisfies a predetermined condition, the molding step of performing the molding process on the substrate is included, and In the above acquisition step, the rate of change in the intensity of reflected light acquired by changing the irradiation conditions for irradiating light onto the substrate is acquired as the above indicator, and A method in which the above indicator is obtained as a unique value corresponding to the type of pretreatment required for the substrate to perform the above molding process.
  18. It is a molding device that forms a composition on a substrate using a component, and An acquisition unit configured to acquire an index indicating the intensity of reflected light from the substrate by irradiating light onto the substrate, and It includes a control unit configured to control a molding process for molding the composition on the substrate using the above member, and The above control unit is, If the above-mentioned acquired indicator satisfies a predetermined condition, the molding process is performed on the substrate, and A molding device in which the above indicator is acquired as a unique value corresponding to the type of pretreatment required for the substrate to perform the above molding process.
  19. In Paragraph 18, The above member includes a pattern to be transferred to the composition on the substrate, and The molding device is configured to form the pattern on the composition on the substrate by bringing the member into contact with the composition on the substrate.
  20. In Paragraph 18, The above member includes a flat surface, and The above-described molding device is configured to flatten the composition on the substrate by bringing the above-described member into contact with the composition on the substrate.

Description

Control method, molding apparatus, and article manufacturing method The present invention relates to a control method, a molding device, and a method for manufacturing an article. In response to the demand for miniaturization of semiconductor devices, MEMS (Micro Electro Mechanical Systems), and similar devices, a molding technique is known for forming a composition on a substrate by bringing the composition into contact with a mold. This molding technique is applicable to imprint techniques, planarization techniques, and similar applications. Imprint technique is a technique for transferring a pattern of a mold onto a composition on a substrate by curing the composition while the composition is in contact with a mold containing a pattern having concave and convex portions. Planarization technique is a technique for forming a film of a composition on a substrate that includes a flat upper surface by curing the composition on a substrate while the composition is in contact with a mold containing a flat surface. This molding technology is attracting attention as a technology for finely and complexly molding a composition on a substrate because it can accurately transfer the shape of the mold to the composition on the substrate. On the other hand, since the molding technology involves direct contact between the mold and the composition on the substrate, it becomes difficult to accurately mold the composition on the substrate if an abnormality occurs in the mold and/or the substrate. In addition, there is a risk of damaging the mold and/or the substrate. Japanese Patent Publication No. 2016-207816 describes a method for preventing multiple imprints by capturing an image of the shot area where the next imprint processing is to be performed among a plurality of shot areas on a substrate, and checking the condition of the shot area based on the obtained image. In molding technology, various pretreatments may be performed on the substrate before the mold and the composition on the substrate come into contact with each other in order to accurately mold a composition on the substrate using a mold. Examples of pretreatments include the application of a treatment agent to promote the filling of the composition between the mold and the substrate, the application of a treatment agent to leave the composition on the substrate side when separating the mold from the cured composition, and similar methods. However, there may be cases where pretreatment is not performed on the substrate, or where the pretreatment to be performed on the substrate is incorrect. In these cases, it may be difficult to accurately mold the composition on the substrate using a mold. FIG. 1 is a schematic diagram illustrating an example of the configuration of an imprint device of a first embodiment. FIG. 2 is a flowchart illustrating a conventional control method of an imprint device. Figure 3 is a flowchart illustrating a conventional substrate conveyance process. FIG. 4 is a flowchart illustrating a control method for an imprint device of the first embodiment (Example 1). Figure 5 is a diagram illustrating the acceptable range of the reflection intensity indicator. Figures 6a and 6b are graphs illustrating the rate of change of the intensity of reflected light. FIG. 7 is a flowchart illustrating the substrate transport process of the first embodiment (Example 3). FIG. 8 is a schematic diagram illustrating an example of the configuration of an imprint device of the third embodiment. FIG. 9 is a diagram illustrating an example of substrate processing that can effectively improve throughput. Figure 10 is a flowchart illustrating an example of control of a measurement area (measurement mechanism). Figure 11 is a flowchart illustrating an example of control for each processing area (processing mechanism). FIGS. 12a to 12f are drawings for explaining a method of manufacturing an article. FIGS. 13a to 13d are drawings for explaining flattening treatment. Hereinafter, embodiments will be described in detail with reference to the attached drawings. It should be noted that the following embodiments are not intended to limit the scope of the claimed invention. Although a number of features are described in the embodiments, the invention is not limited to requiring all of these features, and a number of such features may be appropriately combined. Furthermore, in the attached drawings, identical or similar components are given the same reference numerals, and their redundant description is omitted. In the specification and the attached drawings, directions will be indicated in an XYZ coordinate system in which a direction parallel to the surface of the substrate is defined as the X-Y plane. The directions parallel to the X-axis, Y-axis, and Z-axis of the XYZ coordinate system are the X direction, Y direction, and Z direction, respectively. Rotation about the X-axis, rotation about the Y-axis, and rotation about the Z-axis are θX, θY, and θZ, respectively. Con