KR-102963077-B1 - Apparatus and Method for treating substrate

KR102963077B1KR 102963077 B1KR102963077 B1KR 102963077B1KR-102963077-B1

Abstract

The present invention provides a substrate processing apparatus and method for cooling a heating unit. According to the present invention as described above, by reusing the cooling gas used in the cooling unit in the heating unit, the cooling gas can be recycled.

Inventors

손영준
엄기상
이태훈

Assignees

세메스 주식회사

Dates

Publication Date: 20260512
Application Date: 20211103

Claims (15)

In a device for processing substrates, A heating unit for heating and treating a substrate; and A cooling unit having a cooling gas channel formed therein for cooling the substrate; provided, The above heating unit is, A heating plate that supports a substrate and is provided with a heater; and A gas supply member for supplying cooling gas to the bottom surface of the heating plate to cool the heating plate; and The above cooling gas flow path and the above gas supply member are connected to each other by a connecting line, The above connection line is, A substrate processing device provided to allow cooling gas to flow from the above cooling gas path to the above gas supply member.
In Article 1, The above cooling unit is, A return plate for removing the above substrate from the heating unit is provided, and The above cooling gas flow path is a substrate processing device formed on the above return plate.
In Paragraph 2, On the above return plate, A substrate processing device having a cooling water channel further formed for supplying cooling water.
In Paragraph 3, The above coolant passage is, A substrate processing device formed at a position higher than the above cooling gas path.
In Paragraph 3 or 4, A substrate processing device in which the cooling gas channel and the cooling water channel are provided in a non-aligned state when viewed from above.
In any one of paragraphs 1 to 4, The above connection line is, A substrate processing device provided as an insulating member.
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In any one of paragraphs 1 to 4, The above gas supply member is, It includes a body disposed on the bottom surface of the heating plate, and The above body has a space into which the cooling gas is introduced and a hole for discharging the cooling gas within the space to the heating plate, and The above connection line is a substrate processing device coupled to the body.
In Article 1, The above cooling unit is, A cooling plate having the above-mentioned cooling gas passage formed therein, The above substrate processing device is, A substrate processing apparatus further comprising a conveying plate for conveying the substrate between the heating unit and the cooling plate.
In Article 9, The above cooling plate is, A substrate processing device having a cooling water channel further formed for supplying cooling water.
In Article 10, The above coolant passage is, A substrate processing device formed at a position higher than the above cooling gas path.
In Article 10 or 11, A substrate processing device in which the cooling gas channel and the cooling water channel are provided in a non-aligned state when viewed from above.
In a method for processing a substrate, A substrate on which a heating plate is placed is heated by a heater provided on the heating plate to heat the substrate, and The substrate is cooled by a cooling unit in which a cooling gas channel is formed through which cooling gas flows, and Cool the heating plate using a gas supply member that supplies cooling gas toward the bottom surface of the heating plate, A substrate processing method for cooling the heating plate using a cooling gas flowing from the above cooling gas flow path to the above gas supply member.
In Paragraph 13, A method for processing a substrate in which a cooling water channel is formed in the above cooling unit through which cooling water flows, and the substrate is cooled by the cooling gas and the cooling water.
In Paragraph 13, A substrate processing method in which the above cooling unit is provided as a return plate for removing the substrate from the heating plate.

Description

Apparatus and Method for treating substrate The present invention relates to a substrate processing apparatus and a method, and more specifically, to a substrate processing apparatus that cools a heating plate using a cooling unit and a method for cooling the heating plate. Generally, various processes such as cleaning, deposition, photolithography, etching, and ion implantation are performed to manufacture semiconductor devices. The photolithography process performed to form patterns plays an important role in achieving high integration of semiconductor devices. A photolithography process is performed to form a photoresist pattern on a semiconductor substrate. The photolithography process includes a coating process for forming a photoresist film on the substrate, an exposure process for forming a photoresist pattern from the photoresist film, and a development process for removing the areas irradiated with light during the exposure process or the opposite areas, and a baking process for heating and cooling the substrate is performed before and after each process. The device performing the baking process has a heating unit and a cooling unit, and the substrate is heated to a set temperature in the heating unit and then cooled to room temperature or a set temperature in the cooling unit. When the process is completed for substrates belonging to one group in the heating unit and before proceeding with the process for substrates belonging to the next group, the temperature of the heating plate must be adjusted to be suitable for the process conditions (e.g., heating temperature) of the substrates belonging to the next group described above. The temperature of the heating plate can be rapidly increased by increasing the thermal energy supplied to the plate. However, the temperature of the heating plate decreases by natural cooling, so it takes a long time. The time required for the natural cooling method corresponds to standby time, which significantly reduces the equipment's operating rate. Recently, to lower the temperature of the heating plate, a method of cooling by discharging cooling gas onto the heating plate using a forced cooling method, rather than a natural cooling method, is being used. However, the forced cooling method has the problem of consuming a large amount of cooling gas and being unable to recycle the cooling gas. FIG. 1 is a perspective view schematically showing a substrate processing apparatus according to one embodiment of the present invention. FIG. 2 is a cross-sectional view of a substrate processing apparatus showing the coating block or development block of FIG. 1. Figure 3 is a plan view of the substrate processing apparatus of Figure 1. Figure 4 is a drawing showing an example of the hand of the return robot of Figure 3. Figure 5 is a plan view schematically showing an example of the heat treatment chamber of Figure 3. Fig. 6 is a front view of the heat treatment chamber of Fig. 5. Figure 7 is a plan view showing an example of a cooling unit. Figure 8 is a plan view schematically showing another example of the heat treatment chamber of Figure 3. Fig. 9 is a front view of the heat treatment chamber of Fig. 8. Figure 10 is a plan view showing an example of a cooling plate. Embodiments of the present invention are described below with reference to the attached drawings so that those skilled in the art can easily implement them. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in describing preferred embodiments of the present invention in detail, specific descriptions of related known functions or configurations are omitted if it is determined that such detailed descriptions would unnecessarily obscure the essence of the present invention. Additionally, the same reference numerals are used throughout the drawings for parts having similar functions and operations. The term 'comprising' a component means that, unless specifically stated otherwise, it does not exclude other components but rather allows for the inclusion of additional components. Specifically, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Singular expressions include plural expressions unless the context clearly indicates otherwise. Additionally, the shapes and sizes of elements in drawings may be exaggerated for clearer explanation. Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms may be used for the purpose of distinguishing one component from another. For example, without departing from the scope of the present