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KR-102963216-B1 - Conductive film, connection structure, and method of manufacturing the same

KR102963216B1KR 102963216 B1KR102963216 B1KR 102963216B1KR-102963216-B1

Abstract

A conductive film (100) capable of suppressing the occurrence of a short circuit and increasing the connection reliability of a connection structure by suppressing the movement of conductive particles accompanying resin flow during conductive connection or anisotropic conductive connection has an insulating resin layer in which a first resin layer (10), a second resin layer (20), and a third resin layer (30) are laminated in this order. The lowest melt viscosity of each layer is higher in the order of the second resin layer (20), the first resin layer (10), and the third resin layer (30). A plurality of conductive particles (40) are dispersed in the insulating resin layer and are held and supported by at least the first resin layer (10) and the second resin layer (20). When the thickness of the first resin layer (10) is Tt, the thickness of the second resin layer (20) is Tc, and the average particle size of the conductive particles (40) is D, the conductive film (100) satisfies the relationship of Equation (1): Tt+Tc<D×(4/3) … (1).

Inventors

  • 가라키타, 미츠히로
  • 구도, 가츠야

Assignees

  • 데쿠세리아루즈 가부시키가이샤

Dates

Publication Date
20260512
Application Date
20220913
Priority Date
20210930

Claims (12)

  1. A conductive film having an insulating resin layer having a laminated structure in which a first resin layer, a second resin layer, and a third resin layer are laminated in this order, and conductive particles dispersed within the insulating resin layer, The minimum melt viscosity of each layer in the insulating resin layer is higher in the order of the second resin layer > first resin layer > third resin layer, and the minimum melt viscosity of the second resin layer is within the range of 1,500 Pa·s or more and 80,000 Pa·s or less, and The conductive particles are held and supported by at least the first resin layer and the second resin layer, and when the thickness of the first resin layer is Tt, the thickness of the second resin layer is Tc, and the average particle size of the conductive particles is D, the following formula (1): A challenge film that satisfies the relationship.
  2. In paragraph 1, the following formula (4): A challenge film that satisfies the relationship.
  3. A conductive film according to claim 1, wherein Vc is 1.5 times or more of Vt, where Vc is the lowest melt viscosity of the second resin layer and Vt is the lowest melt viscosity of the first resin layer.
  4. A conductive film according to claim 1, wherein Vc is 40 times or more of Vt, where Vc is the lowest melt viscosity of the second resin layer and Vt is the lowest melt viscosity of the first resin layer.
  5. A conductive film according to claim 1, wherein the relationship is Tn > Tc + Tt, where Tn is the thickness of the third resin layer.
  6. A conductive film according to claim 1, wherein the resin constituting the first resin layer and the second resin layer is a thermally polymerizable resin.
  7. A conductive film according to claim 1, wherein conductive particles are regularly arranged in a grid pattern.
  8. A conductive film used as an anisotropic conductive film in any one of claims 1 to 7.
  9. A method for manufacturing a connection structure in which a first electronic component and a second electronic component are conductively connected, A method for manufacturing a connection structure characterized by conductively connecting a first electronic component and a second electronic component by compressing them with a conductive film interposed therebetween any one of claims 1 to 7.
  10. In paragraph 9, the challenge connection is an anisotropic challenge connection, and A method for manufacturing a connection structure, wherein a first electronic component and a second electronic component are compressed with the conductive film interposed therebetween to form an anisotropic conductive connection.
  11. A connection structure in which a first electronic component and a second electronic component are conductively connected, A connection structure characterized by conductively connecting a first electronic component and a second electronic component by interposing a conductive film described in any one of claims 1 to 7.
  12. In paragraph 11, the challenge connection is an anisotropic challenge connection, and A connection structure in which a first electronic component and a second electronic component are anisotropically conductively connected via the conductive film.

Description

Conductive film, connection structure, and method of manufacturing the same The present invention relates to a conductive film, a connection structure using the same, and a method for manufacturing the same. Conductive films, in which numerous conductive particles are dispersed within an insulating resin layer, are widely used for mounting electronic components such as IC chips and micro LEDs. These conductive films include those in which the conductivity direction is not limited to a specific direction and those in which the conductivity direction is limited to a specific direction; the latter, in which the conductivity direction is limited to a specific direction, is known as anisotropic conductive film. In conductive films, conductive particles are dispersed at a high density within the insulating resin layer to accommodate high mounting densities. However, increasing the number density of conductive particles becomes a cause of short circuits, particularly in the case of anisotropic conductive films. In order to ensure connection reliability and suppress short circuits through anisotropic conductive connections, it has been proposed to support conductive particles within an insulating resin layer having a multilayer laminated structure. For example, an anisotropic conductive film has been proposed in which conductive particles are arranged in a single layer on one side of a photopolymerizable resin layer and immobilized in the photopolymerizable resin by irradiating with ultraviolet light, and an intermediate insulating resin layer is provided around the immobilized conductive particles as a stress relief layer applied to the conductive particles, and a polymerizable resin layer that polymerizes by heat or light is laminated thereon (Patent Document 1). In addition, an anisotropic conductive film is also proposed in which an insulating base layer, an intermediate layer, and an adhesive layer are laminated, and conductive particles are retained and supported in either the adhesive layer or the intermediate layer, so that the melt viscosity of the intermediate layer and the adhesive layer are each higher than the melt viscosity of the insulating base layer, and the elastic modulus of the entire anisotropic conductive film after thermal polymerization is higher than a predetermined value (Patent Document 2). FIG. 1 is a cross-sectional view of a conductive (anisotropic conductive) film according to one embodiment of the present invention. FIG. 2 is a cross-sectional view of a conductive (anisotropic conductive) film according to another embodiment of the present invention. FIG. 3 is a cross-sectional view of a conductive (anisotropic conductive) film according to another embodiment of the present invention. FIG. 4 is a cross-sectional view of a conductive (anisotropic conductive) film according to another embodiment of the present invention. FIG. 5 is a cross-sectional view illustrating the state immediately before anisotropic conductive connection using a conventional anisotropic conductive film. FIG. 6 is a cross-sectional view of a connection structure connected using a conventional anisotropic conductive film. FIG. 7 is a cross-sectional view illustrating the state immediately before anisotropic conductive connection using the anisotropic conductive film of the present invention. FIG. 8 is a cross-sectional view of a connection structure connected using an anisotropic conductive film of the present invention. Hereinafter, embodiments of the present invention will be described with appropriate reference to the drawings. Although described as an anisotropic conductive film, it is understood that the invention can be similarly applied to conductive films. [Anisotropic Challenge Film] FIG. 1 is a cross-sectional view of an anisotropic conductive film according to one embodiment of the conductive film of the present invention. FIG. 2 to 4 are cross-sectional views of an anisotropic conductive film according to another embodiment of the present invention. The anisotropic conductive film (100) illustrated in FIG. 1 to 4 has an insulating resin layer having a structure in which a first resin layer (10), a second resin layer (20), and a third resin layer (30) are laminated in that order. A plurality of conductive particles (40) are supported in a dispersed state within the insulating resin layer. Specifically, the conductive particles (40) are held and supported by at least the first resin layer (10) and the second resin layer (20). <Position of the challenge particle> In the thickness direction of the first resin layer (10), the position of the conductive particles (40) is not in a state where they are embedded in either the first resin layer (10) or the second resin layer (20), but is preferably supported on both sides of the first resin layer (10) and the second resin layer (20), as illustrated in FIGS. 1 to 4. That is, it is preferable that the conductive particles (40) are embedded in both sides of the fir