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KR-102963247-B1 - Thermally conductive silicone gel composition

KR102963247B1KR 102963247 B1KR102963247 B1KR 102963247B1KR-102963247-B1

Abstract

The thermally conductive silicone gel composition of the present invention is a cured composition comprising the following A to F: (A) an organopolysiloxane having two alkenyl groups in one molecule, (B) an organohydrogenpolysiloxane having two Si-H groups in one molecule, (C) an organohydrogenpolysiloxane having three or more Si-H groups in one molecule, (D) at least one compound selected from D1 and D2 below, (D1) an organopolysiloxane having one alkenyl group in one molecule, (D2) an organohydrogenpolysiloxane having one Si-H group in one molecule, (E) a platinum catalyst, and (F) a thermally conductive filler in an amount of 100 to 600 vol% when the total amount of A to E is 100 vol%. Accordingly, a thermally conductive silicone gel composition that is a gel-like cured product and has low oil bleeding is provided.

Inventors

  • 가타이시 다쿠미
  • 기무라 유코
  • 스기에 마이
  • 이와이 마코토
  • 기쿠치 세쓰오

Assignees

  • 후지고분시고오교오가부시끼가이샤

Dates

Publication Date
20260508
Application Date
20200806
Priority Date
20200106

Claims (15)

  1. It comprises components including the following A to F, and when component A is 100 parts by weight, An organopolysiloxane having two alkenyl groups in one molecule (provided that the molecular structure of component A is linear) B Organohydrogenpolysiloxane having two Si-H groups in one molecule (provided that the molecular structure of component B is linear and Si-H groups are present at both ends of the molecular chain): 1 to 300 parts by weight Organohydrogenpolysiloxane having three or more Si-H groups in one C molecule: 0.1 to 20 parts by weight D At least one compound selected from D1 and D2 below: 0.1 to 50 parts by weight D1 Organopolysiloxane having one alkenyl group per molecule D2 Organohydrogenpolysiloxane having one Si-H group per molecule E Platinum Catalyst: Amount required for curing When the total amount of F thermally conductive filler A to E above is 100 vol%, 100 to 600 vol% (However, the ratio of Si-H groups to alkenyl groups in all components A to D is Si-H groups/alkenyl groups = 0.5 to 2.0) It is a thermally conductive silicone gel composition that has been cured, and The above thermally conductive silicone gel composition is a thermally conductive silicone gel composition having an oil bleeding rate of 0.5 wt% or less when a molded article with a width of 25 mm, a length of 25 mm, and a thickness of 3.0 mm is placed on a polytetrafluoroethylene (PTFE) filter paper, compressed to a thickness of 1.8 mm, and left for 24 hours under an 80°C atmosphere.
  2. In paragraph 1, The above thermally conductive silicone gel composition is a thermally conductive silicone gel composition having a hardness of 60 or less on the Aska rubber hardness tester type C compliant with JIS K 7312.
  3. In paragraph 1 or 2, A thermally conductive silicone gel composition in which the alkenyl groups of component A are present at both ends of the organopolysiloxane molecular chain.
  4. In paragraph 1 or 2, A thermally conductive silicone gel composition in which the viscosity of the organopolysiloxane of component A is 10 to 100,000 mm²/s kinematic viscosity at 25°C.
  5. In paragraph 1 or 2, A thermally conductive silicone gel composition having a number average degree of polymerization of component B of the above-mentioned B of 2 to 1,000.
  6. In paragraph 1 or 2, The organohydrogenpolysiloxane of component C above is a thermally conductive silicone gel composition having the following [Chemical Formula 1]: [Chemical Formula 1] However, R6 are identical or different hydrogen, alkyl, phenyl, epoxy, acryloyl, methacryloyl, or alkoxy groups, at least three of which are hydrogen, L is an integer from 0 to 1,000, and M is an integer from 1 to 200.
  7. In paragraph 1 or 2, A thermally conductive silicone gel composition having a kinematic viscosity of 10 to 100,000 mm²/s at 25°C for the above D1 and D2 components.
  8. In paragraph 1 or 2, A thermally conductive silicone gel composition in which the thermally conductive particles of the above F component are at least one inorganic particle selected from silica other than alumina, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, aluminum hydroxide, and hydrophilic fumed silica.
  9. In paragraph 1 or 2, The thermally conductive particles of the above F component are a combination of inorganic particles having an average particle diameter of 10 μm or less and inorganic particles having an average particle diameter exceeding 10 μm, in a thermally conductive silicone gel composition.
  10. In paragraph 1 or 2, The thermally conductive particles of the above F component are a thermally conductive silicone gel composition in which at least one silane coupling agent selected from an alkoxysilane compound represented by R a Si(OR') 4-a (where R is an unsubstituted or substituted organic group having 1 to 20 carbon atoms, R' is an alkyl group having 1 to 4 carbon atoms, and a is 0 or 1), a partial hydrolyzate thereof, and an alkoxy group-containing silicone is surface-treated.
  11. In Paragraph 10, A thermally conductive silicone gel composition in which 0.01 to 10 parts by weight of the silane coupling agent is added and surface-treated with respect to 100 parts by weight of the thermally conductive particles of the above F component.
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Description

Thermally conductive silicone gel composition The present invention relates to a thermally conductive silicone gel composition preferred for interposing between a heat-generating part and a heat-dissipating body, such as in electrical or electronic components. Recent performance improvements in semiconductors such as CPUs have been remarkable, and consequently, the amount of heat generated has also increased significantly. Consequently, heat sinks are installed in electronic components that generate heat, and thermally conductive silicone gels are used to improve the adhesion between the semiconductor and the heat sink. Conventional gel-type cured products of thermally conductive silicone have achieved a gel-type cured product by leaving unreacted portions by skewing the ratio of alkenyl groups and Si-H groups in the composition. However, when a gel-type cured product is formed by skewing the ratio of alkenyl groups and Si-H groups, unreacted oil from the raw material remains in the cured product, causing oil bleeding. Patent Document 1 proposes a heat dissipation material containing an organopolysiloxane having one or more alkenyl groups bonded to silicon atoms in one molecule, an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule, a platinum-based catalyst, and a thermally conductive filler. Patent document 2 proposes a thermally conductive silicone rubber molded article formed by curing and molding a composition comprising an organopolysiloxane having an alkenyl group in one molecule, a thermally conductive filler, an organohydrogenpolysiloxane having an average of one or more and fewer than three hydrogen atoms directly bonded to silicon atoms in one molecule, and a platinum group-based curing catalyst. Patent document 3 proposes a heat dissipation material formed by curing an addition reaction-curing silicone gel composition comprising an organopolysiloxane having an average of 0.1 to 2 alkenyl groups bonded to silicon atoms in one molecule, an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule, a platinum-based catalyst, and a thermally conductive filler. [Fig. 1] A-B of Fig. 1 is an explanatory diagram showing a method for measuring the thermal conductivity of a sample in one embodiment of the present invention. The present invention enables the realization of a low-oil-bleeding, heat-dissipating silicone gel by using at least one compound selected from an organopolysiloxane having one alkenyl group in one molecule and an organohydrogenpolysiloxane having one Si-H group in one molecule as a molecular weight adjusting agent, thereby providing a silicone gel cured product that becomes a gel even when cured to minimize unreacted alkenyl groups and Si-H groups, and also has low oil bleeding. If oil bleeding occurs from the cured product, it can cause contamination of surrounding components. Consequently, there is a possibility that problems may occur in the components. Therefore, by using a low-oil-bleeding, heat-dissipating silicone gel, such problems are resolved. More specifically, it is a thermally conductive silicone gel composition in which the components comprising the following A to F are cured. A organopolysiloxane having two alkenyl groups in one molecule B Organohydrogenpolysiloxane having two Si-H groups in one molecule Organohydrogenpolysiloxane having three or more Si-H groups in one C molecule D at least one compound selected from D1 and D2 below D1 Organopolysiloxane having one alkenyl group per molecule D2 Organohydrogenpolysiloxane having one Si-H group per molecule E platinum catalyst When the total amount of F thermally conductive filler A to E above is 100 vol%, 100 to 600 vol% By adding component D, the molecular weight of the silicone gel after the curing reaction can be reduced. Since component D has only one reaction site, for example, if two of component D react with a polymer having two reactive groups, the molecule cannot increase its molecular weight further. In addition, if the molecular weight becomes excessively large, the cured product becomes hard, so component D is added to reduce the hardness of the cured product. In the prior art, the molecular weight was controlled to prevent it from increasing by leaving unreacted parts of the raw material, but the present invention controls it using component D. The composition for the thermally conductive silicone gel of the present invention preferably has an Asker C hardness of 60 or less, more preferably 40 or less, and even more preferably 10 to 25. If the hardness is excessively low, the strength of the heat dissipation material is reduced and handling properties deteriorate. If the hardness is too high, the adhesion of the sheet deteriorates and heat dissipation performance is reduced. Additionally, if the hardness is too high, excessive stress is applied to surrounding members when the heat dissipation material is compressed,