KR-102963327-B1 - FINGERPRINT SENSING SUBSTRATE, FINGERPRINT SENSING MODULE AND DISPLAY DEVICE COMPRISING THE SAME

Abstract

A fingerprint recognition substrate according to an embodiment comprises: a substrate including a chip mounting area; a wiring pattern and a dummy pattern disposed on the substrate; and a protective layer disposed on the wiring pattern, wherein the chip mounting area includes a first area where the wiring pattern is disposed and a second area where the dummy pattern is disposed. A fingerprint recognition module according to an embodiment includes a substrate including a first chip mounting area; a wiring pattern and a dummy pattern disposed on the substrate; a protective layer disposed on the wiring pattern; a first chip disposed on the first chip mounting area; and an adhesive layer disposed between the first chip and the wiring pattern, wherein a spacing area is disposed between the first chip and the substrate.

Inventors

• 이병률
• 최소희
• 한재흥

Assignees

• 엘지이노텍 주식회사

Dates

Publication Date

20260511

Application Date

20201007

Claims (19)

1. A substrate including a chip mounting area; A wiring pattern and a dummy pattern disposed on the above substrate; and It includes a protective layer disposed on the above wiring pattern, and The above chip mounting area includes a first area where the wiring pattern is placed and a second area where the dummy pattern is placed, and The above dummy pattern is, A plurality of guide patterns spaced apart from each other and arranged on the above substrate and It includes a guide groove formed by extending in one direction between the plurality of guide patterns above, and The second region is respectively positioned in the corner region of the chip mounting region, and A fingerprint recognition substrate wherein the plurality of guide patterns and the guide grooves disposed in each corner area of the chip mounting area each extend from the center of the chip mounting area toward each corner of the chip mounting area.
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4. In Article 1, A fingerprint recognition substrate in which the width of the guide groove is larger than the width of the guide pattern.
5. In Article 1, A fingerprint recognition substrate further comprising a connecting portion that is disposed at one end of the above guide pattern and connects the above guide pattern.
6. In Paragraph 5, A fingerprint recognition substrate in which the width of the above connection portion is greater than the width of the guide pattern and the width of the guide groove.
7. A substrate including a first chip mounting area; A wiring pattern and a dummy pattern disposed on the above substrate; A protective layer disposed on the above wiring pattern; A first chip disposed on the first chip mounting area; It includes an adhesive layer disposed between the first chip and the wiring pattern, A spacing region is disposed between the first chip and the substrate, and The first chip mounting area includes a first area where the wiring pattern is placed and a second area where the dummy pattern is placed, and The second region is positioned in the corner region of the first chip mounting region, and The above dummy pattern includes a plurality of guide patterns and guide grooves between the guide patterns, and The above guide groove is, non-placement area where the above adhesive layer is not placed and It includes a placement area where the above adhesive layer is placed, and Some of the above placement areas do not overlap with the chip in the vertical direction. Fingerprint recognition module.
8. In Article 7, A fingerprint recognition module in which the above-mentioned separation area is 3㎛ or larger.
9. In Article 7, The above separation area is a fingerprint recognition module containing air.
10. In Article 7, The guide pattern is disposed at one end, and the guide pattern further includes a connecting portion. A fingerprint recognition module in which the width of the above connection part is greater than the width of the guide pattern and the width of the guide groove.
11. In Article 7, The above non-placement area is placed closer to the above-detached area than to the above-detached area, and A fingerprint recognition module in which the thickness of the adhesive layer placed in the above-mentioned placement area is greater than the thickness of the adhesive layer placed in the above-mentioned non-placement area.
12. In Paragraph 11, The guide pattern between the above non-placement area and the above placement area is a fingerprint recognition module exposed outside the adhesive layer.
13. In Paragraph 11, The above-mentioned placement area includes a 2-1 area and a 2-2 area, and The adhesive layer disposed in the above 2-1 region contacts the first chip, and The above 2-2 region is positioned outside the 1st chip compared to the 2-1 region, and A fingerprint recognition module in which the thickness of the adhesive layer disposed in the 2-1 region is greater than the thickness of the adhesive layer disposed in the 2-2 region.
14. In Paragraph 11, It further includes a third region outside the above-mentioned placement area, and The above placement area is a fingerprint recognition module in which the substrate is exposed.
15. In Article 7, The above substrate includes a first surface and a second surface opposite to the first surface, and The first chip is disposed on the first surface, and It further includes a second chip and a third chip respectively disposed in a second chip mounting area and a third chip mounting area disposed on the first surface, and The above substrate is a fingerprint recognition module that bends between the first chip mounting area and the second chip mounting area.
16. In Article 7, The above substrate includes a first surface and a second surface opposite to the first surface, and The first chip is disposed on the first surface, and A fingerprint recognition module further comprising a second chip and a third chip, respectively disposed in a second chip mounting area and a third chip mounting area disposed on the second surface.
17. A fingerprint recognition module according to any one of claims 7 to 16; A display panel and a cover substrate disposed on top of the fingerprint recognition module; A display device including a main board positioned below the fingerprint recognition module.
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Description

Fingerprint Sensing Substrate, Fingerprint Sensing Module and Display Device Comprising the Same The embodiment relates to a fingerprint recognition substrate, a fingerprint recognition module, and a display device including the same. Fingerprint recognition modules containing fingerprint sensors detect human fingerprints and are recently being widely used as a means to enhance security in portable electronic devices such as smartphones and tablet computers. In other words, by requiring user registration or security authentication procedures through a fingerprint recognition module, data stored on portable electronic devices can be protected and security incidents can be prevented in advance. Generally, a home key, implemented as a button or touch area, may be positioned at the bottom front of a smartphone. This home key can improve user convenience by enabling various functions of the smartphone with a single touch. Meanwhile, tablet computers are also equipped with a home key at the bottom front of the main body, similar to the aforementioned smartphone. As such, the home key on smartphones and tablet computers enables the implementation of actions configured through the portable electronic device; for example, pressing or touching the home key while using the device provides convenient features such as returning to the initial screen. Meanwhile, the fingerprint recognition module has a structure in which a fingerprint sensor and an ASIC (Application Specific Integrated Circuit) are mounted on a substrate. However, such a fingerprint recognition module cannot be directly connected to the main board. In other words, a printed circuit board is required between the fingerprint recognition module and the main board. Electronic devices having a display section face the problem of increased thickness due to the requirement of multiple printed circuit boards. Furthermore, the size of multiple printed circuit boards can constrain the miniaturization of the display device. Additionally, bonding defects among multiple printed circuit boards can reduce the reliability of the display device. Meanwhile, the fingerprint recognition module can be formed by mounting a chip for fingerprint sensing on the chip mounting area of the fingerprint recognition substrate. At this time, the above chip requires a certain space between the chip and the fingerprint recognition substrate to generate vibrations for fingerprint sensing. In addition, when bonding the chip and the fingerprint recognition substrate, if the adhesive material flows into the chip mounting area, there is a problem of appearance defects and sensing failures. Therefore, a fingerprint recognition substrate, a fingerprint recognition module, and a display device including the same with a new structure capable of resolving the above-mentioned problem are required. FIG. 1 is a drawing for explaining an example of a display device to which a fingerprint recognition substrate according to an embodiment is applied. FIG. 2 is a top view of a fingerprint recognition substrate according to an embodiment. FIG. 3 is a drawing showing a lower view of a fingerprint recognition substrate according to an embodiment. Figure 4 is a drawing showing an enlarged view of area A of Figure 2. Figure 5 is a schematic cross-sectional view of the BB' region of Figure 4. Figures 6 and 7 are enlarged views of the second area of Figure 4. FIG. 8 is a drawing showing an enlarged view of a fingerprint recognition module with a chip mounted on a fingerprint recognition substrate according to an embodiment. FIGS. 9 to 11 are schematic cross-sectional views of the CC' region of FIG. 8. FIG. 12 is a diagram showing the state of the adhesive layer placed in the first chip mounting area before heat treatment. FIG. 13 is a diagram showing the state of the adhesive layer placed in the first chip mounting area after heat treatment. Figure 14 is a drawing showing an enlarged view of area D of Figure 13. FIG. 15 is a cross-sectional view of the EE' region of FIG. 14. FIG. 16 is a cross-sectional view of the FF' region of FIG. 14. FIG. 17 is a cross-sectional view showing a chip mounted in the GG' region of FIG. 2. FIG. 18 is a diagram illustrating the contact relationship between a fingerprint recognition module, a display panel, and a main board according to an embodiment. FIG. 19 is a cross-sectional view showing a chip mounted in the GG' region of FIG. 2. FIGS. 20 to 25 are drawings of various display devices including a fingerprint recognition module. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted. I