KR-102963333-B1 - ELECTROSTATIC CHUCK FILM

Abstract

The present invention relates to an electrostatic chuck film, and in particular, to an electrostatic chuck film comprising an adhesive layer formed on a conductive layer, having electrical properties within a defined range and thickness of each layer.

Inventors

• 이지문
• 이창우
• 도상길
• 이규완
• 장영훈
• 유경석
• 조한빈

Assignees

• 율촌화학 주식회사

Dates

Publication Date

20260511

Application Date

20240731

Priority Date

20231211

Claims (8)

1. As an electrostatic chuck film, base layer, A conductive layer formed on the above substrate layer, and Adhesive layer formed on the above conductive layer Includes, When a voltage of 1 kV is applied to the above electrostatic chuck film, the surface resistance is 1 × 10¹¹ to 1 × 10¹³ Ω/sq, and When a voltage of 1 kV is applied to the above electrostatic chuck film, the dielectric loss is 0.02 to 0.1, and When a voltage of 1 kV is applied to the above electrostatic chuck film, the dielectric constant is 2.8 to 3.3, and The thickness of the above substrate layer is 25 to 100 μm, and The thickness of the conductive layer is 0.03 to 3 μm, and The thickness of the adhesive layer is 15 to 50 μm, and The above conductive layer is formed by crosslinking a mixture of poly(3,4-ethylenedioxythiophene) polystyrene sulfonate and water-dispersible polyurethane with an aziridine compound, and The weight ratio of the mixture of poly(3,4-ethylenedioxythiophene) polystyrene sulfonate and water-dispersible polyurethane of the conductive layer to the aziridine compound is 100:8 to 63, Electrostatic chuck film.
2. In claim 1, Characterized by additionally including a release film formed on the adhesive layer above. Electrostatic chuck film.
3. In claim 1, The above adhesive layer is characterized by reacting a compound selected from the group consisting of organopolysiloxanes containing vinyl groups at both ends, chlorosilanes, alkylalkoxysilanes, sulfursilanes, aminosilanes, epoxysilanes, and mixtures thereof with a silane or a silane derivative. Electrostatic chuck film.
4. In claim 3, The above silane derivative is characterized in that 1 to 2 hydroxyl groups (-H) are substituted with alkyl groups having 1 to 2 carbon atoms. Electrostatic chuck film.
5. In claim 3, Characterized by the fact that the Si-H molar ratio (Si-H/vinyl) of the silane or silane derivative to the vinyl group contained at both ends of a compound selected from the group consisting of organopolysiloxane, chlorosilane, alkylalkoxysilane, sulfursilane, aminosilane, epoxysilane, and mixtures thereof is 1 to 3. Electrostatic chuck film.
6. In claim 1, The conductive layer is characterized by being selected from the group consisting of poly(3,4-ethylenedioxythiophene) (PEDOT), poly(3,4-ethylenedioxythiophene) polystyrenesulfonate (PEDOT-PSS), carbon nanotubes (CNT), graphene, indium tin oxide (ITO), silver nanowires, and combinations thereof. Electrostatic chuck film.
7. In claim 1, The above adhesive layer is characterized by being selected from the group consisting of silicone, acrylic resin, urethane resin, rubber, and combinations thereof. Electrostatic chuck film.
8. delete

Description

Electrostatic Chuck Film The present invention relates to an electrostatic chuck film, and in particular, to an electrostatic chuck film comprising an adhesive layer formed on a conductive layer, having electrical properties within a defined range and thickness of each layer, such that one side can be picked up by an electrostatic chuck and the opposite side can be adhered. Generally, adhesive protective films are attached to protect the surface of products during the manufacturing process. These adhesive protective films are particularly used in display panels, such as liquid crystal panels and plasma display panels (PDPs), which constitute display devices like mobile phones, computer monitors, TVs, and various advertising boards, as well as in semiconductor packaging processes. Conventionally, most processes involved picking up films or products using pressure; however, pressure cannot be utilized to pick up films or products in a vacuum. Specifically, the semiconductor packaging process operates in a vacuum. While conventional adhesive forces were used to pick up films or products in this state, they had the disadvantage of being difficult to attach or detach, thus requiring specialized structures and characteristics such as electrostatic chucks. Korean Registered Patent No. 2208071 discloses a multilayer structure for electrostatic coupling of a substrate, but it has the disadvantage of requiring an external power source and a contact part for charging a metal electrode. Furthermore, for a product to be capable of pickup by the aforementioned electrostatic chuck, it must be equipped with separate components; however, such components may be unnecessary for the product or degrade its functionality. Consequently, there is a significant industry demand for a pickup body with a new structure and characteristics that can resolve these issues. FIG. 1 is a cross-sectional view illustrating one embodiment of the present invention. FIG. 2 is a cross-sectional view illustrating another embodiment of the present invention. Hereinafter, preferred embodiments of the present invention will be described in detail. However, the following is merely a detailed description of specific embodiments by way of example, and since the present invention can be modified in various ways and can take various forms, the present invention is not limited to the specific embodiments illustrated. It should be understood that the present invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the present invention. In addition, many specific details, such as specific components, are described in the following description; however, these details are provided merely to aid in a more comprehensive understanding of the invention, and it will be obvious to those skilled in the art that the invention can be practiced without such details. Furthermore, in describing the invention, detailed descriptions of related known functions or configurations are omitted if it is determined that such detailed descriptions may unnecessarily obscure the essence of the invention. Furthermore, the terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application. In this application, singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, % unless otherwise specified refers to weight %, and molecular weight unless otherwise specified refers to weight-average molecular weight. In this application, terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. In this application, terms such as 'comprising,' 'containing,' or 'having' are intended to indicate the existence of features, components (or constituents), etc. described in the specification, and do not imply that one or more other features or components, etc., are not present or cannot be added. When an adhesive film that can be picked up by an electrostatic chuck is attached to a product such as a semiconductor wafer, it can be easily attached and detached even in a vacuum state, and the film can be remov