KR-102963340-B1 - Micro light emitting element array and method of manufacturing the same

KR102963340B1KR 102963340 B1KR102963340 B1KR 102963340B1KR-102963340-B1

Abstract

One embodiment provides a method for manufacturing a micro light-emitting element array, comprising the steps of: preparing a first substrate having a plurality of circular grooves formed on a first surface; supplying a plurality of micro light-emitting elements on the first surface of the first substrate; and aligning the plurality of micro light-emitting elements in the plurality of circular grooves. At least two electrodes are spaced apart from each other on the second surface of each of the plurality of micro light-emitting elements, and the at least two electrodes may include a first electrode provided relatively close to the center of the second surface and at least one second electrode provided at the edge of the second surface.

Inventors

김현준
황경욱
박준용
홍석우
황준식

Assignees

삼성전자주식회사

Dates

Publication Date: 20260511
Application Date: 20210421
Priority Date: 20201105

Claims (20)

A step of preparing a first substrate including a plurality of circular grooves formed on a first surface; A step of supplying a plurality of micro light-emitting elements on the first surface of the first substrate; A step of aligning the plurality of micro light-emitting elements in the plurality of circular grooves by positioning at least two electrodes, spaced apart from each other on the second surface of each of the plurality of micro light-emitting elements, so as to face the upper opening of the plurality of circular grooves; A step of providing a second substrate including a third surface having a plurality of electrode structures formed to correspond to the plurality of circular grooves of the first substrate; and The method includes the step of arranging the first substrate and the second substrate so that a plurality of circular grooves of the first substrate and a plurality of electrode structures of the second substrate face each other; A method for manufacturing a micro light-emitting device array, wherein the at least two electrodes include a first electrode provided relatively close to the center of the second surface and at least one second electrode provided at the edge of the second surface.
In Article 1, A method for manufacturing a micro light-emitting element array, wherein the size of each of the plurality of micro light-emitting elements is smaller than the size of the plurality of circular grooves included in the first substrate.
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In Article 1, A method for manufacturing a micro light-emitting diode array, wherein the second surface is a polygon.
In Article 1, A method for manufacturing a micro light-emitting element array, further comprising the step of bonding the plurality of micro light-emitting elements aligned in the plurality of circular grooves and the plurality of electrode structures.
In Article 5, A method for manufacturing a micro light-emitting device array, wherein each of the plurality of electrode structures of the second substrate comprises a first driving electrode and a second driving electrode that is spaced apart from the first driving electrode and surrounds the first driving electrode.
In Article 6, A method for manufacturing a micro light-emitting diode array, wherein the second driving electrode is ring-shaped.
In Article 6, A method for manufacturing a micro light-emitting device array, wherein the second driving electrode comprises at least two sub-driving electrodes spaced apart from each other.
In Article 6, In the step of bonding the plurality of micro light-emitting elements and the plurality of electrode structures, A method for manufacturing a micro light-emitting device array, wherein the first electrode and the first driving electrode are electrically connected to each other, and the at least one second electrode and the second driving electrode are electrically connected to each other.
In Article 1, A method for manufacturing a micro light-emitting device array, wherein the first substrate comprises a plurality of electrode structures provided in each of the plurality of circular grooves.
In Article 10, In the step of aligning the plurality of micro light-emitting elements into the plurality of circular grooves, A method for manufacturing a micro light-emitting element array, wherein at least two electrodes formed in each of the plurality of micro light-emitting elements are positioned to face each of the plurality of electrode structures provided in each of the plurality of circular grooves.
In Article 11, A method for manufacturing a micro light-emitting device array, wherein each of the plurality of electrode structures of the first substrate comprises a first driving electrode and a second driving electrode that is spaced apart from the first driving electrode and surrounds the first driving electrode.
In Article 12, A method for manufacturing a micro light-emitting device array, wherein the first electrode is positioned to face the first driving electrode, and the at least one second electrode is positioned to face the second driving electrode.
In Article 12, A method for manufacturing a micro light-emitting diode array, wherein the second driving electrode is ring-shaped.
In Article 12, A method for manufacturing a micro light-emitting device array, wherein the second driving electrode comprises at least two sub-driving electrodes spaced apart from each other.
In Article 1, The method further comprises the step of supplying liquid to a plurality of circular grooves of the first substrate, and A method for manufacturing a micro light-emitting element array, wherein in the step of aligning the plurality of micro light-emitting elements into the plurality of circular grooves, the first substrate is scanned with an absorbent material capable of absorbing the liquid to align the plurality of micro light-emitting elements into the plurality of circular grooves.
A driving circuit board having a plurality of electrode structures, each comprising a first driving electrode formed on a first surface and a second driving electrode spaced apart from the first driving electrode and surrounding the first driving electrode; and A plurality of micro light-emitting elements comprising at least two electrodes formed spaced apart from each other and bonded to each of the plurality of electrode structures, provided on a second surface facing the plurality of electrode structures; A micro light-emitting device array comprising at least two electrodes, wherein the at least two electrodes include a first electrode provided relatively close to the center of the second surface and at least one second electrode provided at the edge of the second surface.
In Article 17, A micro light-emitting element array, wherein the first electrode is provided at the center of the second surface.
In Article 17, A micro light-emitting diode array in which the second surface is a polygon.
In Article 19, A micro light-emitting element array in which the region where the vertex of the second surface is formed is rounded.

Description

Micro light emitting element array and method of manufacturing the same An exemplary embodiment of the present disclosure relates to a micro light-emitting device array and a method for manufacturing the same, and more specifically, to the structure of an electrode formed in a micro light-emitting device and an electrode formed in a driving circuit board. Light-emitting diodes (LEDs) have the advantages of low power consumption and eco-friendliness. Due to these advantages, industrial demand is increasing. LEDs are being applied not only to lighting devices and LCD backlights but also to LED display devices. In other words, display devices utilizing micro-scale LEDs are being developed. In manufacturing micro-LED display devices, it is necessary to transfer the LEDs onto a substrate. The pick-and-place method is widely used for transferring LEDs. However, productivity with this method decreases as the size of the LEDs decreases and the size of the display increases. Furthermore, transferring LEDs that emit multiple colors of light requires a significant amount of time because additional transfer processes are needed for each color. Furthermore, as the surface area of the light-emitting diode (LED) display device increases, the surface area of the driving circuit board on which the micro-LEDs must be transferred also increases. If the transfer process for micro-LEDs is increased to form large-area display devices, it can result in greater time and cost in manufacturing the display devices. Accordingly, there is a need for a method to efficiently transfer micro-LEDs to the driving circuit board. Various wet and dry transfer techniques are known as methods for transferring micro-light-emitting devices onto a driving circuit board. For example, wet transfer techniques are known for transferring micro-light-emitting devices to a desired location on a driving circuit board using the surface tension of a liquid, wet transfer techniques are known for transferring laminar flow generated by perturbation through solution pumping (US10418527), and dry transfer techniques are known for transferring micro-light-emitting devices to a desired location on a driving circuit board using an ultrasonic transducer, vibration of a diaphragm, or an electric or magnetic field. When using these various wet and dry transfer techniques, multiple micro-light-emitting devices can be aligned into multiple grooves formed on a mold substrate. In addition, micro-light-emitting devices can be aligned directly onto a driving circuit board containing multiple grooves instead of a mold substrate. When aligning micro-light-emitting diodes with respect to a substrate, the shape of the micro-light-emitting diodes and the shape of the grooves formed in the substrate can be made identical. Alternatively, circular micro-light-emitting diodes can be aligned so that they can fit well into the square grooves formed in the substrate from any direction. FIG. 1 is a flowchart illustrating a method for manufacturing a micro light-emitting device array according to one embodiment. FIG. 2 briefly illustrates an exemplary configuration of a first substrate and a micro light-emitting device used in manufacturing a micro light-emitting device array. FIG. 3 briefly illustrates the configuration of one of a plurality of micro light-emitting elements according to one embodiment. FIG. 4 briefly illustrates the configuration of a wafer used to produce a plurality of micro light-emitting elements according to one embodiment. Figure 5 briefly illustrates the configuration of a wafer used to produce a plurality of micro light-emitting devices according to a comparative example. FIG. 6 briefly illustrates the configuration of one of a plurality of micro light-emitting elements according to another embodiment. FIG. 7 briefly illustrates the configuration of one of a plurality of micro light-emitting elements according to another embodiment. FIG. 8 briefly illustrates the configuration of one of a plurality of micro light-emitting elements according to another embodiment. FIG. 9 is a flowchart illustrating a method for manufacturing a micro light-emitting device array according to another embodiment. FIG. 10 briefly illustrates the configuration of a micro light-emitting element array manufacturing apparatus according to one embodiment. FIG. 11 illustrates the scanning process of a method for manufacturing a micro light-emitting device array according to one embodiment. FIG. 12 illustrates the process of aligning micro light-emitting elements according to a method for manufacturing a micro light-emitting element array according to one embodiment. FIG. 13 illustrates the bonding process of a plurality of micro light-emitting elements to a second substrate included in the method for manufacturing a micro light-emitting element array according to one embodiment of FIG. 1. FIG. 14 illustrates the bonding process of a plurality of micro light-emitting elements to a second subst