KR-102963410-B1 - Auxiliary heat exchanging apparatus and method

Abstract

The present invention relates to an auxiliary heat exchanger and method that can forcibly and rapidly rapidly cool or rapidly heat a heat treatment plate, such as a heater plate, which heats or cools a substrate, thereby reducing wafer waiting time and shortening equipment operation time. The device may include: an auxiliary heat exchanger plate installed to be able to move relatively forward toward the direction of the heat treatment plate that heats or cools the substrate, or to move backward in a direction relatively away from the heat treatment plate, and formed to be able to exchange heat with the heat treatment plate so as to improve the rapid cooling performance or rapid heating performance of the heat treatment plate by utilizing heat conduction; and a plate forward/backward movement device for moving the auxiliary heat exchanger plate forward and backward.

Inventors

• 전재식

Assignees

• 세메스 주식회사

Dates

Publication Date

20260512

Application Date

20220720

Claims (20)

1. An auxiliary heat exchange plate installed to be able to move relatively forward toward a heat treatment plate that heats or cools a substrate, or to move relatively backward toward said heat treatment plate, and formed to be able to exchange heat with said heat treatment plate so as to improve the rapid cooling performance or rapid heating performance of said heat treatment plate by utilizing heat conduction; and A plate forward/backward movement device for moving the auxiliary heat exchange plate described above back and forth; is included, The above substrate is a wafer, and The above heat treatment plate is a heater plate that heats the mounted wafer using a heating wire, and The above auxiliary heat exchange plate is a cooling plate that is in thermal contact with the heater plate and rapidly cools the heater plate, and The above auxiliary heat exchange plate is, An auxiliary plate body having a heat exchange contact surface formed thereon so as to contact the heater plate in a direction corresponding to the heater plate and allow heat exchange to occur by heat conduction; A refrigerant flow path installed in the auxiliary plate body to allow refrigerant to flow; and A refrigerant supply line that supplies the refrigerant to the refrigerant flow path; Includes, The above auxiliary plate body is a plurality of concentric ring-shaped separate bodies that individually contact a selected portion of the rear surface of the heater plate, and The above refrigerant flow path is formed in a swirling or ring shape in each of the plurality of concentric ring-shaped separation bodies, and A vortex-type refrigerant flow path or a ring-type refrigerant flow path in which a refrigerant inlet is formed on one side and a refrigerant outlet is formed at a position parallel to the refrigerant inlet, and In order for heat exchange to occur differentially by section, the first part is formed with a first gap or a first flow path width, and the second part is formed with a second gap or a second flow path width. The above refrigerant supply line is, An auxiliary heat exchanger having a soft tube or flexible tube formed in at least a portion so that the refrigerant can be supplied to the auxiliary plate body whose position is changed.
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6. In Article 1, The auxiliary heat exchanger, wherein the auxiliary plate body is formed by penetrating the heater plate and contacts at least one of a lift pin that lifts the edge portion, middle portion, and center portion of the wafer, or a combination thereof.
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10. In Article 1, The above auxiliary heat exchange plate is, A heat exchange elastic layer formed on the heat exchange contact surface to mitigate impact upon contact with the auxiliary plate body and to improve thermal adhesion; An auxiliary heat exchanger further comprising
11. In Article 1, The above plate forward and backward movement device is, A forward/backward actuator that moves the above auxiliary heat exchange plate forward and backward relative to the direction of the heat treatment plate; An auxiliary heat exchanger comprising
12. In Article 11, The above forward/backward actuator is an auxiliary heat exchanger comprising at least one of a hydraulic cylinder, a pneumatic cylinder, an electric actuator, a linear motor, a lifting/lowering drive motor, a solenoid forward/backward device, an articulated device, a power transmission device, or a combination thereof.
13. In Article 11, The above forward/backward actuator comprises at least one of a central actuator installed on the line of the lifting/lowering axis, left and right actuators installed on the left and right sides respectively with respect to the lifting/lowering axis, triangular actuators arranged in a triangular configuration around the lifting/lowering axis, square actuators arranged in a quadrilateral configuration in the front, back, left, and right directions around the lifting/lowering axis, and polygonal actuators arranged in a polygonal configuration around the lifting/lowering axis.
14. In Article 11, The above plate forward and backward movement device is, A guide member that guides the auxiliary heat exchange plate toward the heat treatment plate; An auxiliary heat exchanger further comprising
15. In Article 14, The above guide member comprises at least one of the following: a guide ring installed on the edge of the heat treatment plate; a guide rod formed on one side or the center of the heat treatment plate and formed to penetrate the auxiliary heat exchange plate; a hollow guide rod having a heater wire formed inside; an LM guide guiding the auxiliary heat exchange plate; a chamber-type guide formed in a chamber; and a transfer robot, or any one or more of these, in an auxiliary heat exchange device.
16. In Article 1, The above substrate is a wafer, and The above heat treatment plate is a cooling plate that cools the mounted wafer, and The auxiliary heat exchanger is an auxiliary heat exchanger, wherein the auxiliary heat exchange plate is a heater plate that contacts the cooling plate and rapidly heats the cooling plate.
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20. An auxiliary heat exchange plate installed to be able to move relatively forward toward a heat treatment plate that heats or cools a substrate, or to move relatively backward toward said heat treatment plate, and formed to be able to exchange heat with said heat treatment plate so as to improve the rapid cooling performance or rapid heating performance of said heat treatment plate by utilizing heat conduction; and A plate forward/backward movement device for moving the auxiliary heat exchange plate described above back and forth; is included, The above substrate is a wafer, and The above heat treatment plate is a heater plate that heats the mounted wafer using a heating wire, and The above auxiliary heat exchange plate is a cooling plate that comes into contact with the heater plate and rapidly cools the heater plate, and The above auxiliary heat exchange plate is, An auxiliary plate body having a heat exchange contact surface formed so as to contact the heater plate in a direction corresponding to the heater plate and to perform heat exchange by conduction; A refrigerant flow path installed in the auxiliary plate body to allow refrigerant to flow; and A refrigerant supply line that supplies the refrigerant to the refrigerant flow path; including The above refrigerant flow path is, A vortex-type refrigerant flow path or a ring-type refrigerant flow path in which a refrigerant inlet is formed on one side and a refrigerant outlet is formed in a position parallel to the refrigerant inlet. In order for heat exchange to occur differentially by section, the first part is formed with a first gap or a first flow path width, and the second part is formed with a second gap or a second flow path width. The above refrigerant supply line is, A soft tube or flexible tube is formed in at least a portion so that the refrigerant can be supplied to the auxiliary plate body whose position is changed, and The above plate forward and backward movement device is, A forward/backward actuator that moves the auxiliary heat exchange plate relative to the direction of the heat treatment plate; and A guide member that guides the auxiliary heat exchange plate toward the heat treatment plate; An auxiliary heat exchanger comprising

Description

Auxiliary heat exchanging apparatus and method The present invention relates to an auxiliary heat exchange device and method, and more specifically, to an auxiliary heat exchange device and method that can forcibly and rapidly rapidly cool or rapidly heat a heat treatment plate, such as a heater plate, which heats or cools a substrate, thereby reducing wafer waiting time and shortening equipment operation time. In general, various types of heat treatment plates have been widely developed and are used in semiconductor process equipment to heat or cool wafers to temperatures suitable for the process. These heat treatment plates utilize a wide variety of types and forms, such as heater plates equipped with heaters to heat the wafer or cooling plates with refrigerant channels formed to cool the wafer. Conventional heat treatment plates, such as heater plates or cooling plates, can maintain an appropriate standby temperature to prevent overheating or overcooling of the wafer and prevent unnecessary energy consumption after the process chamber is sealed and the wafer is heated or cooled to a temperature suitable for the process, or after the process is finished or moved to the next process according to a recipe, etc. For example, in the case of a heater plate with a built-in heater, various cooling methods can be applied to lower the temperature of the heater plate to ambient temperature while preparing for the next process after the process is completed, such as opening the process chamber to naturally cool the heater plate or injecting air onto the underside of the heater plate. FIG. 1 is a cross-sectional view conceptually illustrating an auxiliary heat exchanger according to some embodiments of the present invention. FIG. 2 is a perspective view showing the auxiliary heat exchanger of FIG. 1. FIGS. 3 to 6 are cross-sectional views showing the operation process of the auxiliary heat exchanger of FIG. 1 in stages. FIG. 7 is a plan view showing the refrigerant flow path of an auxiliary heat exchanger according to some other embodiments of the present invention. FIG. 8 is a plan view showing a refrigerant flow path of an auxiliary heat exchanger according to some other embodiments of the present invention. FIG. 9 is a cross-sectional view showing an auxiliary heat exchanger according to some other embodiments of the present invention. FIG. 10 is a plan view showing an auxiliary heat exchanger according to some other embodiments of the present invention. FIG. 11 is a cross-sectional view showing an auxiliary heat exchanger according to some other embodiments of the present invention. FIG. 12 is a cross-sectional view showing an auxiliary heat exchanger according to some other embodiments of the present invention. FIG. 13 is a cross-sectional view showing an auxiliary heat exchanger according to some other embodiments of the present invention. FIG. 14 is a cross-sectional view showing a forward/backward actuator of an auxiliary heat exchanger according to some other embodiments of the present invention. FIG. 15 is a cross-sectional view showing a forward/backward actuator of an auxiliary heat exchanger according to some other embodiments of the present invention. FIG. 16 is a perspective view showing an auxiliary heat exchanger according to some other embodiments of the present invention. FIG. 17 is a cross-sectional view showing the auxiliary heat exchanger of FIG. 16. FIG. 18 is a cross-sectional view showing an auxiliary heat exchanger according to some other embodiments of the present invention. FIG. 19 is a flowchart illustrating an auxiliary heat exchange method according to some embodiments of the present invention. Hereinafter, several preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The embodiments of the present invention are provided to more fully explain the invention to those skilled in the art, and the following embodiments may be modified in various different forms, and the scope of the invention is not limited to the following embodiments. Rather, these embodiments are provided to make the disclosure more faithful and complete and to fully convey the spirit of the invention to those skilled in the art. In addition, the thickness or size of each layer in the drawings is exaggerated for convenience and clarity of explanation. The terms used herein are for describing specific embodiments and are not intended to limit the invention. As used herein, the singular form may include the plural form unless the context clearly indicates otherwise. Additionally, as used herein, "comprise" and/or "comprising" specify the presence of the mentioned features, numbers, steps, actions, parts, elements, and/or groups thereof, and do not exclude the presence or addition of one or more other features, numbers, actions, parts, elements, and/or groups. Hereinafter, embodiments of the present invention are described with reference to drawings that schematic