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KR-102963417-B1 - Chemical collection member and substrate processing apparatus including same

KR102963417B1KR 102963417 B1KR102963417 B1KR 102963417B1KR-102963417-B1

Abstract

The substrate processing device of the present invention includes a body member for recovering a chemical liquid scattered from a rotating substrate, and a hydrophilic pattern film formed on the surface of the body member where the chemical liquid comes into contact, and comprising unit lines formed in a line shape, spaced apart from each other, and formed at an angle.

Inventors

  • 강원영
  • 김태근
  • 조민희
  • 김강설
  • 이경민

Assignees

  • 세메스 주식회사

Dates

Publication Date
20260508
Application Date
20211229

Claims (7)

  1. A body member for recovering a chemical liquid scattered from a rotating substrate; and A drug recovery member comprising: a hydrophilic pattern film formed on the surface of the body member where the drug is in contact, formed in a line shape and positioned spaced apart from each other, and formed to be inclined downward along the rotation direction of the substrate with respect to a virtual vertical reference line.
  2. In paragraph 1, A liquid recovery member in which the inclination angle of the above unit line is 30 to 60 degrees with respect to a virtual vertical reference line.
  3. In paragraph 2, A chemical recovery member having an inclination angle of 45 degrees of the above unit line.
  4. In paragraph 1, A liquid recovery member in which the spacing between two adjacent unit lines is included in the range of 1 to 3 times the width of the unit lines.
  5. In paragraph 4, A liquid recovery member in which the gap between two adjacent unit lines is equal to the width of the unit lines.
  6. A rotating unit that supports a substrate and rotates the substrate; A liquid dispensing unit for dispensing a liquid medicine using the above-mentioned rotating unit; and A liquid recovery member installed to surround the rotating unit and recovering the liquid sprayed from the rotating unit; comprising The above-mentioned liquid recovery member is a substrate processing device that is a liquid recovery member according to any one of claims 1 to 4.
  7. delete

Description

Chemical collection member and substrate processing apparatus including same The present invention relates to a chemical solution recovery member and a substrate processing apparatus including the same, and more specifically, to a chemical solution recovery member that can be used to manufacture semiconductors and a substrate processing apparatus including the same. Conventionally, cleaning methods for semiconductor wafer cleaning processes can be broadly classified into dry cleaning methods and wet cleaning methods. Among these, wet cleaning methods are cleaning methods using various chemicals, and are classified into batch type cleaning devices that clean multiple substrates simultaneously and single wafer type cleaning devices that clean substrates individually. In relation to batch cleaning devices, the conventional method for liquid cleaning semiconductor wafers, etc., has been the so-called batch liquid cleaning, in which multiple wafers stored in a carrier cassette are immersed in a liquid bench-type cleaning tank formed by arranging multiple cleaning tanks in a continuous sequence, or multiple wafers are immersed in sequence by a conveying device without the carrier cassette. As described above, the batch cleaning device removes contaminants by immersing multiple substrates at once in a cleaning tank containing a cleaning solution. However, existing batch cleaning devices have the disadvantage of not being able to easily respond to the trend of increasing substrate size and using a large amount of cleaning solution. In addition, if a substrate is damaged during the cleaning process in the batch cleaning device, it affects all the substrates in the cleaning tank, so there is a risk that a large number of substrate defects may occur. Meanwhile, as semiconductor devices enter the submicron era, extremely high cleanliness is required on the surface of wafers along with the miniaturization and high integration of devices. As a liquid cleaning technology that satisfies the requirement for higher cleanliness, unlike the batch liquid cleaning mentioned above, single-wafer liquid cleaning is proposed, which liquid cleans wafers one by one that are not contained in a cassette within a sealed cleaning housing. The single-wafer cleaning device is a method of processing individual substrates, and cleaning is performed in a spin manner by spraying a cleaning solution onto the surface of a substrate rotated at high speed, thereby removing contaminants using the centrifugal force caused by the rotation of the substrate and the pressure caused by the spraying of the cleaning solution. Typically, a single-wafer cleaning device includes a chamber in which a substrate is received and a cleaning process is performed, a spin chuck that rotates while fixing the substrate, and a nozzle assembly for supplying a cleaning solution containing a chemical solution, a rinse solution, a drying gas, etc. to the substrate. During the cleaning process, the cleaning solution that is sprayed from the nozzle assembly onto the substrate and then scattered from the surface of the substrate can be recovered in a bowl. Meanwhile, the chemical solution flowing down the bowl dries over time; as the solvent vaporizes, the polymeric materials within the solution polymerize to form a solid. Unlike the liquid state, this solid becomes hydrophobic, resulting in strong adhesion to hydrophobic parts. Since the substrate can be contaminated by the dried polymeric materials, cleaning of the contaminated parts is required at regular intervals. However, if the chamber is shut down for a certain period due to the cleaning process, productivity decreases, and equipment maintenance costs may increase due to the use of additional cleaning solution. FIG. 1 is a drawing illustrating a substrate processing apparatus in which a liquid recovery member according to one embodiment of the present invention may be installed. Figure 2 is a drawing showing a portion in which a hydrophilic pattern film is formed in a liquid recovery member. FIG. 3 is a cross-sectional view taken along line II-II of the substrate processing apparatus of FIG. 1. Figure 4 is a diagram illustrating the liquid flowing down through a hydrophilic pattern film. Figure 5 is an enlarged view of adjacent unit lines in the liquid recovery member. Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts unrelated to the explanation have been omitted, and the same reference numerals are used for identical or similar components throughout the specification. In addition, in various embodiments, components having the same configuration are described using the same reference numerals only in the repres