KR-102963426-B1 - Substrate processing apparatus

Abstract

The technical concept of the present invention provides a substrate processing device capable of preventing mist from splashing onto the upper surface of a substrate and contaminating the substrate during a cleaning process. The substrate processing device comprises: a processing vessel having a cylindrical shape with an open top and having a processing space inside; a substrate support member located inside the processing vessel and supporting a substrate; and a spraying member for spraying a processing liquid onto the substrate. The processing vessel includes a side wall surrounding the substrate support member and a cover extending inward from the upper end of the side wall portion, and a louver pattern is formed on the side wall of the processing vessel.

Inventors

• 손영준
• 이우람
• 백혜빈
• 박은우
• 김대성
• 최진호
• 임재현

Assignees

• 세메스 주식회사

Dates

Publication Date

20260508

Application Date

20220401

Claims (6)

1. A processing container having a cylindrical shape with an open top and an internal processing space; A substrate support member located inside the processing container and supporting a substrate; and A spraying unit that sprays a processing liquid onto the above substrate; comprising The processing container comprises a side wall surrounding the substrate support and a cover extending inward from the upper end of the side wall portion, A louver pattern is formed on the side wall of the above-mentioned processing container, and The above louver pattern has a structure that penetrates the side wall, and A substrate processing device characterized in that the above-mentioned louver pattern has a structure in which a material incident on the above-mentioned louver pattern is emitted to the outside of the processing vessel.
2. In Article 1, A substrate processing device characterized in that the above-described louver pattern is arranged in a two-dimensional array structure on the side wall.
3. delete
4. In Article 1, The above louver pattern includes a protruding cover that moves further away from the side wall as it goes downward, and protruding sides connected to the side wall on both sides of the protruding cover. A substrate processing apparatus characterized in that the above-described louver pattern includes an inlet portion defined by the upper line of the protruding cover and the vertical lines of two protruding sides, and an outlet portion defined by the lower line of the protruding cover and the lower lines of two protruding sides.
5. In Paragraph 4, A substrate processing device characterized by the above-mentioned protruding cover having a flat shape or a curved shape bent downward.
6. In Paragraph 4, The mist directed toward the inlet part strikes the protruding cover and bends downward to be discharged through the outlet part, or A substrate processing device characterized by forming a vortex inside the above-mentioned louver pattern to reduce the flow velocity, and then discharging it through the above-mentioned outlet.

Description

Substrate processing apparatus The technical concept of the present invention relates to a substrate processing apparatus, and in particular to a substrate processing apparatus for cleaning a substrate. Contaminants such as particles, organic contaminants, and metal contaminants remaining on the surface of a substrate have a significant impact on the characteristics and production yield of semiconductor devices. For this reason, a cleaning process to remove various contaminants attached to the surface of the substrate is important in the semiconductor manufacturing process, and a process of cleaning the substrate is performed before and after each unit process of semiconductor manufacturing. Generally, substrate cleaning may include a chemical treatment process that uses chemicals to remove metal foreign substances, organic materials, or particles remaining on the substrate, a rinsing process that uses pure water to remove chemicals remaining on the substrate, and a drying process that uses organic solvents or nitrogen gas to dry the substrate. Meanwhile, a substrate processing device may include a substrate support member that supports the substrate, and a processing container that surrounds the side and a portion of the top of the substrate support member. The inner side of the processing container is provided as a smooth surface, and the mist used for cleaning during the cleaning process may strike the inner side of the processing container due to centrifugal force and then bounce back onto the substrate, thereby re-contaminating the substrate. FIG. 1 is a plan view showing the main parts of a substrate processing apparatus according to one embodiment of the present invention. Figure 2 is a cross-sectional view showing the II' portion of the substrate processing device of Figure 1 cut away. FIGS. 3a to 4 are perspective views showing the upper portion of the processing vessel in the substrate processing apparatus of FIG. 1. FIGS. 5A and FIGS. 5B are conceptual diagrams illustrating the principle of mist discharge through louvers placed on the side wall of the treatment vessel of FIG. 3A. Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings. The embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified in various different forms, and the scope of the present invention is not limited to the following embodiments. Rather, these embodiments are provided to make the present disclosure more faithful and complete and to fully convey the spirit of the present invention to those skilled in the art. In the following description, when it is stated that a component is connected to another component, it may be directly connected to the other component, or a third component may be interposed therebetween. Similarly, when it is stated that a component exists above another component, it may exist directly above the other component, or a third component may be interposed therebetween. Furthermore, the structure or size of each component in the drawings has been exaggerated for convenience and clarity of explanation, and parts irrelevant to the description have been omitted. Identical components in the drawings are denoted by the same reference numerals, and redundant descriptions thereof are omitted. Meanwhile, the terms used are for the purpose of describing the present invention only and are not intended to limit the meaning or the scope of the invention as defined in the claims. FIG. 1 is a plan view showing a main part of a substrate processing apparatus according to one embodiment of the present invention, and FIG. 2 is a cross-sectional view showing the I-I' portion of the substrate processing apparatus of FIG. 1. Referring to FIGS. 1 and 2, the substrate processing device (100) of the present embodiment may include a substrate support (110), a cleaning unit (120), and a processing container (130). According to the embodiment, the substrate processing device (100) may be surrounded by a chamber that provides a sealed internal space. The substrate support member (110) may include a spin head, a support shaft, and a rotary drive unit. The spin head may have a circular upper surface when viewed from above. The spin head may include support pins and chuck pins. Multiple support pins may be provided. For example, the support pins may be spaced apart at a predetermined interval on the upper surface of the spin head. The support pins may support the rear surface of the substrate (W) so that the substrate (W) is spaced a certain distance from the upper surface of the spin head. A support shaft may be coupled to the spin head. The support shaft rotates by a rotary drive unit, and accordingly, the substrate (W) may rotate. Multiple chuck pins may be provided, and the chuck pins may be positioned on the outside of the support pins. The chuck pins may