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KR-102963437-B1 - Automatic Editting Apparatus for Chip On Film

KR102963437B1KR 102963437 B1KR102963437 B1KR 102963437B1KR-102963437-B1

Abstract

The present invention relates to an automatic chip-on-film editing device comprising a cutting unit for cutting defective parts of a film, a joining unit disposed on the side of the cutting unit for joining the upper and lower surfaces of the cut film with tape, and a transfer unit disposed between the cutting unit and the joining unit for clamping the upper and lower surfaces of the cut film and transferring it to the joining unit. The transfer unit comprises first and second clamp members (41, 42) configured to move laterally after clamping while in contact with the upper and lower surfaces of the film to transfer the film. The joining unit comprises: a first joining table (51) having a first vacuum hole formed on its upper surface to adsorb and support the lower surface of the film; a second joining table (53) having a second vacuum hole formed on its lower surface to adsorb and support the upper surface of the film; a tape support (55) having a vacuum hole formed on its upper surface to adsorb and support the tape; and a first camera (C1) for checking the alignment state of the film placed on the first joining table. and a second camera (C2) for checking the alignment state of the tape placed on the tape support.

Inventors

  • 임병현
  • 박창성
  • 장종수
  • 홍보형

Assignees

  • 노벨이엔씨(주)
  • 스템코 주식회사

Dates

Publication Date
20260508
Application Date
20250110

Claims (4)

  1. It includes a cutting unit for cutting a defective portion of a film, a joining unit positioned on the side of the cutting unit for joining the upper and lower surfaces of the cut film with tape, and a transfer unit positioned between the cutting unit and the joining unit for clamping the upper and lower surfaces of the cut film and transferring it to the joining unit. The above-mentioned transfer unit is configured to move laterally after clamping while in contact with the upper and lower surfaces of the film, and has first and second clamp members (41, 42) for transferring the film. The above bonding unit comprises: a first bonding table (51) having a first vacuum hole formed on its upper surface to adsorb and support the lower surface of the film; a second bonding table (53) having a second vacuum hole formed on its lower surface to adsorb and support the upper surface of the film; a tape support (55) having a vacuum hole formed on its upper surface to adsorb and support the tape; a first camera (C1) for checking the alignment state of the film placed on the first bonding table; and a second camera (C2) for checking the alignment state of the tape placed on the tape support. The above tape support (55) is formed in an overall L shape by having a vertical member (55a) arranged in a vertical direction and rotating, and a horizontal member (55b) provided at one end of the vertical member. The above horizontal member (55b) has a vacuum hole (56) formed therein and has an adsorption surface that supports the tape by adsorbing it with a vacuum. The tape support (55) is rotatably provided to have a first position in which the suction surface faces the ground and a second position in which the suction surface faces in the opposite direction to the ground and is rotated 180 degrees from the first position. With the tape support (55) positioned in the first position, the tape placed on the suction surface is attached to the upper surface of the film, and A chip-on-film automatic editing device characterized by editing the film by attaching the tape placed on the suction surface to the lower surface of the film while the tape support (55) is positioned in the second position.
  2. delete
  3. In paragraph 1, A chip-on-film automatic editing device characterized by having tape holes (25) formed at both ends of the tape that correspond to the IP holes (15) of the film.
  4. In paragraph 3, A chip-on-film automatic editing device characterized by further including a control unit that checks whether the IP hole (15) of the film and the tape hole (25) of the tape (20) are aligned at corresponding positions using images captured using the first and second cameras.

Description

Automatic Editing Apparatus for Chip On Film The present invention relates to an automatic chip-on-film editing device, which automates the process of inspecting a product rolled in a roll form, removing defective parts, and connecting them. More specifically, the invention relates to a technology in which the film being cut and bonded is transferred to the bonding position by a clamping operation, and the punching process of forming sprocket holes on the side of the adhesive tape during the bonding process becomes unnecessary. Chip-on-Film (COF) is a technology that mounts drive ICs and other components by drawing semiconductor microcircuits onto a thin film (such as polyester or polyimide). This enables module miniaturization, allowing for a significant reduction in the thickness of electronic devices. It is primarily used in high-resolution displays and camera modules; because it is a film type, it can be folded or rolled, making it applicable to flexible and wearable devices. Furthermore, it is utilized in various fields that drive screens, such as LCDs, OLEDs, TVs, smartphones, and tablets. The Chip-on-Film (COF) used at this time is shaped similarly to camera film and has sprocket holes (hereinafter IP Holes) formed at both ends of the product to allow the product to move as it rotates with the insertion of sprockets. By moving the product in this manner, it can be manufactured into a roll-type product through processes such as inspection, editing, and cleaning. During chip mounting, a precision inspection is performed to prevent assembly errors, short circuits or open circuits, scratches, cracks, foreign substances, and damage to the semiconductor chip. Rolls free of defects are packaged and shipped, while rolls found to have defective parts undergo an editing process in which the defective parts are cut and removed, the cut sections are reconnected, and then wound up. Regarding technology for such a conventional editing device, Patent No. 10-2023984 (Title: Automatic Editing Device for Tape Carrier Packages) is known. However, conventional editing devices had the following problems. [1. Jamming during product transfer] When a defective part is found in the film, the defective part is cut and removed, and the film is reconnected; however, to reconnect, the cut film must be transported to the connection position. The conventional transport method involved pushing the film from behind by rotating sprockets inserted into the sprocket holes (IP Holes) at both ends of the film to advance it. However, this method had a problem in that it caused defects when the leading edge of the transported film caught on a protruding part of the bottom surface. In particular, there has been a recent trend of films becoming very thin, and the problem of such defects increasing due to the thinner film thickness. [2. Defects caused by transfer of foreign substances during connection film punching] In the case of the equipment according to the prior art Patent No. 10-2023984, after the defective part of the film is cut, the cut film is connected using adhesive tape, and at this time, sprocket holes for transport had to be drilled in the adhesive tape as well. This part is disclosed as follows in paragraphs [0081] to [0082] of Patent No. 10-2023984. In detail, referring to FIG. 8, the side puncher (124a) is positioned to penetrate the pressure fixing plate (121) and cut the side protrusion of the adhesive tape (88) of the bonded portion. Additionally, the sprocket hole puncher (124b) is positioned to penetrate the pressure fixing plate (121) and punch the sprocket hole (1a) of the tape carrier package (1) that is covered by the adhesive tape (88). Additionally, through holes (129d, 129c) through which the side puncher (124a) and sprocket hole puncher (124b) pass are respectively formed in the bottom plate (129). Accordingly, while the tape carrier package (1) is pressed by the pressure fixing plate (121), the side puncher (124a) and sprocket hole puncher (124b) are pressed downward and inserted through the through holes (129d, 129c), and in the process, the adhesive tape (88) covering the sprocket hole (1a) and the protruding part on the side is cut and removed. In other words, conventional technology requires a process of punching holes in the adhesive tape because it is necessary to form sprocket holes at both ends of the side of the adhesive tape bonded with the film in order to enable transport. However, since the adhesive tape is coated with an adhesive substance, even a small amount of adhesive foreign material remains in the punching die during the punching process, and problems arise where this adhesive foreign material accumulates in the die or equipment and transfers to other locations on the film, causing defects. FIG. 1 is a front view showing the overall appearance of a chip-on-film automatic editing device according to the present invention. FIGS. 2 to 8 show, in order, a supply unit, a driving unit, a cutting