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KR-102963554-B1 - SENSING APPARATUS FOR PARTICLE COUNT AND METHOD FOR MANUFACTURING THE SAME

KR102963554B1KR 102963554 B1KR102963554 B1KR 102963554B1KR-102963554-B1

Abstract

A sensing device for particle counting according to one embodiment of the present invention is provided. The device comprises a substrate including a trench forming a channel, a pair of electrodes disposed on each side of the trench, wiring electrically connected to the pair of electrodes and disposed on one side of the substrate, and a cap layer disposed opposite the substrate to cover the channel.

Inventors

  • 임부택
  • 이태재
  • 노길선
  • 김경민
  • 서창호
  • 김태현
  • 박남수

Assignees

  • 한국과학기술원

Dates

Publication Date
20260512
Application Date
20191129

Claims (9)

  1. A substrate including a trench forming a channel for fluid flow; A pair of electrodes configured to count particles in a fluid flowing in a channel, wherein metal is formed on a pair of inner walls facing each other of the trench, and the electrodes are positioned to face each other with a channel formed by the remaining metal after a portion of the metal is etched; Wiring electrically connected to the above pair of electrodes and disposed on one surface of the substrate; and A sensing device for particle counting comprising a cap layer disposed opposite the substrate to cover the channel and an electrode disposed on the inner surface of the channel.
  2. In paragraph 1, The above substrate is a sensing device for particle counting made of inorganic material .
  3. In paragraph 2, The above substrate is a silicon substrate, and the above substrate is coated with an insulating film, a sensing device for particle counting .
  4. In paragraph 1, The above pair of electrodes is a sensing device for particle counting, made of copper or tungsten .
  5. In paragraph 1, The above substrate includes an inlet for injecting a fluid sample and an outlet for discharging the fluid sample, and The above channel is a sensing device for particle counting that is fluidly connected to the above inlet and the above outlet .
  6. In paragraph 5, The above substrate further comprises an additional inlet for injecting a flow control fluid to control the flow of the fluid, a sensing device for particle counting .
  7. A substrate comprising a pair of vias facing each other to form a channel for fluid flow; A pair of electrodes configured to count particles in a fluid flowing in a channel, wherein metal is formed on the inner walls of the pair of vias, and the electrodes are positioned to face each other with a channel formed by the remaining metal after a portion of the metal is etched; Wiring electrically connected to the above pair of electrodes and disposed on one surface of the substrate; and A sensing device for particle counting comprising a cap layer disposed on the other side of the substrate to cover the channel and an electrode disposed on the inner side of the channel.
  8. Step of forming a trench in a substrate; A step of depositing a metal layer to fill the trench of the above substrate with metal; A step of removing the metal formed on the surface of the substrate, excluding the metal filled in the trench; A step of forming wiring that is electrically connected to the above metal; A step of etching the metal such that the metal on the inner surface of the trench forms a pair of electrodes and the space between the pair of electrodes forms a channel; and A method for manufacturing a sensing device for particle counting, comprising the step of placing a cap layer on the substrate to cover the channel and the electrode disposed on the inner surface of the channel.
  9. Step of forming two trenches in a substrate; A step of depositing a metal layer to fill two trenches of the above substrate with metal; A step of removing metal formed on one surface of the substrate, excluding the metal filled in the trench; A step of processing the opposite side of the substrate to expose the filled metal on the opposite side of the substrate so that the two trenches become two vias; A step of removing a portion of the substrate between the two vias by etching so that a pair of electrodes are formed on the opposing inner surfaces of the metal filled in the two trenches, and the space between the pair of electrodes forms a channel; A step of forming wiring electrically connected to the metal on the opposite side of the channel; A method for manufacturing a sensing device for particle counting, comprising the step of placing a cap layer on the substrate to cover the channel and the electrode disposed on the inner surface of the channel.

Description

Sensing apparatus for particle counting and method for manufacturing the same The present invention relates to a sensing device for particle counting and a method for manufacturing the same. Lab-on-a-chip (LOC) technology is gaining attention. Lab-on-a-chip technology is a representative example of convergence technology of NT, IT, and BT, and refers to a technology that enables all sample pretreatment and analysis steps, such as dilution, mixing, reaction, separation, and quantification, to be performed on a single chip using technologies such as MEMS or NEMS. Microfluidic devices utilizing such lab-on-a-chip technology are manufactured in the form of a small chip of several cm² made of glass, silicon, or plastic, equipped with multiple units necessary for analysis, so that they can analyze and diagnose the flow of a fluid sample flowing through a reaction channel or the reaction between a fluid sample supplied to the reaction channel and a reagent, as well as perform various processing and manipulation steps related to the control of the fluid sample on a single chip. Among microfluidic devices, sensing devices capable of counting particles in fluid samples are crucial for the quantitative analysis of samples. However, conventional sensing devices for particle counting utilized materials such as PDMS, but they had disadvantages due to material limitations. The background description of the invention is provided to facilitate a better understanding of the present invention. The matters described in the background description should not be construed as an acknowledgment that they exist as prior art. FIG. 1 is a schematic perspective view illustrating a sensing device for particle counting according to one embodiment of the present invention. FIG. 2a is a schematic cross-sectional view illustrating a sensing device for particle counting according to an embodiment of the present invention according to A-A' of FIG. 1. FIG. 2b is a schematic cross-sectional view illustrating a sensing device for particle counting according to another embodiment of the present invention. FIG. 3 is a schematic perspective view illustrating a sensing device for particle counting according to another embodiment of the present invention. FIGS. 4a to 4f are schematic cross-sectional views illustrating a method for manufacturing a sensing device for particle counting according to one embodiment of the present invention. FIGS. 5a to 5g are schematic cross-sectional views illustrating a method for manufacturing a sensing device for particle counting according to another embodiment of the present invention. Hereinafter, various embodiments are described in more detail with reference to the attached drawings. The embodiments described in this specification may be modified in various ways. Specific embodiments may be depicted in the drawings and described in detail in the detailed description. However, specific embodiments disclosed in the attached drawings are intended only to facilitate understanding of various embodiments. Accordingly, the technical concept is not limited by specific embodiments disclosed in the attached drawings, and it should be understood that it includes all equivalents or substitutions that fall within the spirit and scope of the invention. Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but these components are not limited by the aforementioned terms. The aforementioned terms are used solely for the purpose of distinguishing one component from another. In this specification, terms such as “comprising” or “having” are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. When a component is described as being “connected” or “connected” to another component, it should be understood that it may be directly connected to or connected to that other component, or that there may be other components in between. On the other hand, when a component is described as being “directly connected” or “directly connected” to another component, it should be understood that there are no other components in between. Furthermore, in describing the present invention, if it is determined that a detailed description of related known functions or configurations may unnecessarily obscure the essence of the invention, such detailed description is abbreviated or omitted. Although terms such as "first," "second," etc., are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may also be the second component within the techn