KR-102963649-B1 - Manufacturing apparatus for thin laminates having a film-like resin layer

KR102963649B1KR 102963649 B1KR102963649 B1KR 102963649B1KR-102963649-B1

Abstract

(assignment) The present invention provides an apparatus for manufacturing a thin-plate laminate having a film-like resin layer capable of forming an uneven shape with high precision and stability on a film-like resin layer laminated on a thin-plate substrate. (Means of solution) The apparatus has a set device (31) for creating a mold holding structure (100) in which a mold (110) is placed on both sides of a workpiece (85), a heating device (41) for heating the mold to the thermal deformation temperature of a film-like resin composition (84), a pressure roll device (51) for introducing the mold holding structure after the mold is heated between two pressure rolls (52, 54) and applying pressure from the outer surface of the mold by rotating the pressure rolls to thermally press the film-like resin composition and the substrate (81) together to form a thin plate laminate (80) having a film-like resin layer (82), and an extraction device (61) for separating the mold from the mold holding structure after pressure.

Inventors

이마이즈미 타쿠조
고토 나오미
시바 나오키

Assignees

후타무라 가가쿠 가부시키가이샤

Dates

Publication Date: 20260512
Application Date: 20200318
Priority Date: 20190325

Claims (10)

A manufacturing apparatus for obtaining a thin laminate by pressing a workpiece, on which a film-like resin composition is laminated on at least one side of a thin substrate, using a mold to integrally form a film-like resin layer on the substrate. The above mold is positioned on both sides of the workpiece and clamps the workpiece while being held by a mold holding structure. The above manufacturing device is, A set part having a set device for creating a mold holding structure that holds the mold in which the above-mentioned workpiece is clamped, and A heating unit having a heating device that heats the mold to the heat deformation temperature of the film-like resin composition, and A pressurizing unit having a pressure roll device that introduces a mold holding structure, after the mold is heated, between two pressure rolls and applies pressure from the outer surface of the mold by the rotation of the pressure rolls to integrally heat-press the film-like resin composition and the substrate to form a thin plate-like laminate having a film-like resin layer, An ejection unit having an ejection device for separating the mold from the mold holding structure after the above-mentioned pressure Having, An apparatus for manufacturing a thin laminate having a film-like resin layer, characterized in that the above-described mold holding structure is configured to be movable between the above-described set part, the above-described heating part, the above-described pressurizing part, and the above-described ejection part.
An apparatus for manufacturing a thin laminate having a film-like resin layer, characterized in that, in claim 1, the heating device heats a mold that holds the workpiece.
An apparatus for manufacturing a thin laminate having a film-like resin layer, characterized in that, in claim 1, the heating device heats a mold that is not gripping the workpiece.
An apparatus for manufacturing a thin laminate having a film-like resin layer, characterized in that, in any one of claims 1 to 3, it has a cooling unit having a cooling device for cooling the mold compressed by the pressure roller device, and the mold holding structure is configured to be movable to the cooling unit.
An apparatus for manufacturing a thin laminate having a film-like resin layer, characterized in that, in any one of claims 1 to 3, the setting device and the extraction device are common devices.
An apparatus for manufacturing a thin laminate having a film-like resin layer, characterized in that, in any one of claims 1 to 3, the substrate is a thin sheet with a thickness of 1 mm or less and the film-like resin composition has a thickness of 500 μm or less.
An apparatus for manufacturing a thin laminate having a film-like resin layer, characterized in that, in any one of claims 1 to 3, a film-like resin composition is laminated on each of the two sides of the above-described material.
An apparatus for manufacturing a thin laminate having a film-like resin layer, characterized in that, in any one of claims 1 to 3, the workpiece is arranged in plurality and a mold is arranged on both sides of each workpiece.
An apparatus for manufacturing a thin laminate having a film-like resin layer, characterized in that, in any one of claims 1 to 3, the film-like resin composition comprises a functional resin composition having decorative, adhesive, or conductive properties.
An apparatus for manufacturing a thin laminate having a film-like resin layer, characterized in that, in any one of claims 1 to 3, the mold surface of the mold has an uneven surface shape.

Description

Manufacturing apparatus for thin laminates having a film-like resin layer The present invention relates to an apparatus for manufacturing a thin laminate having a film-like resin layer. Resin films are used in a very wide range of applications, such as decorative materials, packaging materials, adhesive films, and optical components, due to their excellent mechanical properties such as moldability and corrosion resistance, lightweight nature, ease of processing, and ease of fusing with other resin materials. For example, when manufacturing a thin-plate laminate such as a semiconductor substrate, a film-like resin layer is laminated on the surface of the substrate. In this thin-plate laminate, a predetermined uneven shape is transferred to the resin layer on the thin-plate substrate, and by etching, an uneven structure corresponding to the uneven shape of the resin layer is formed on the surface of the substrate (for example, see Patent Document 1). In the transfer of the thin-plate laminate to the resin layer, for example, as shown in FIG. 16, a workpiece (220) having a resin layer (222) laminated on a substrate (221) is placed on the side of the resin layer (222) and a mold (210) having a mold surface (211) with an uneven surface shape is pressed through the mold (210) to form an uneven shape (223) on the resin layer (222). In addition, reference numeral 200 in the drawing indicates a pressing means such as a press device, and 201 indicates the base of the pressing means (200). High precision is required for structures such as the surface irregularities of a substrate to exhibit specific functionality. However, since the film-like resin layer of a thin-plate laminate is very thick, it is difficult to form irregular shapes on the resin layer with high precision and stability. In particular, when the irregularities on the substrate surface are fine, the quality of processing precision significantly affects functionality, thus requiring an improvement in processing precision. FIG. 1 is a schematic diagram of the entire apparatus for manufacturing a thin-plate laminate according to one embodiment of the present invention. Figure 2 is a schematic cross-sectional view of a thin-plate laminate. Figure 3 is a schematic cross-sectional view showing the molding state of the workpiece. Figure 4 is a perspective view of a mold holding structure. Figure 5 is a schematic plan view showing a variation of a mold holding structure. Figure 6 is a schematic diagram of the side view of the pressurized part. Figure 7 is a schematic diagram of the side view during the processing of the pressurized part. FIG. 8 is a first schematic diagram showing a combination of the arrangement of each part of a manufacturing apparatus for a thin-plate laminate. FIG. 9 is a second schematic diagram showing a combination of the arrangement of each part of a manufacturing apparatus for a thin-plate laminate. Figure 10 is a schematic diagram of the process for creating a mold retention structure. FIG. 11 is a first schematic diagram showing the process of pressure processing of a workpiece. FIG. 12 is a second schematic diagram showing the process of pressure processing of a workpiece. FIG. 13 is a first schematic cross-sectional view showing variations in the relationship between the laminated structure of the workpiece and the mold. FIG. 14 is a second schematic cross-sectional view showing variations in the relationship between the laminated structure of the workpiece and the mold. FIG. 15 is a third schematic cross-sectional view showing variations in the relationship between the laminated structure of the workpiece and the mold. FIG. 16 is a schematic cross-sectional view showing the processing process of a conventional thin-plate laminate. A manufacturing apparatus (10) for a thin-plate laminate according to one embodiment of the present invention shown in FIG. 1 is an apparatus for obtaining a thin-plate laminate (80) in which a film-like resin layer (82) is integrally formed on a substrate (81) by pressing a workpiece (85), on which a film-like resin composition (84) is laminated on at least one side of a thin-plate substrate (81), using a mold (110). This manufacturing apparatus (10) has a setting part (30) having a setting device (31), a heating part (40) having a heating device (41), a pressing part (50) having a pressure roller device (51), and an extraction part (60) having an extraction device (61). The manufacturing device (10) described in the drawing is equipped with a support (11) that connects a set section (30), a heating section (40), a pressurizing section (50), and an ejection section (60) by means of a rail section (20). The rail section (20) has a rail body (21) consisting of a pair of rod-shaped members arranged and installed between the set section (30), the heating section (40), the pressurizing section (50), and the ejection section (60), and connects the set section (30), the heating section (40), the pressurizing se